规格参数 > 第4379页
GM103630-107/HSD/HAMSTD 现货价格参数; 71V416L10PHGI8 现货价格参数; BBD-107-G-B 现货价格参数; RWR80SR150FRS74 现货价格参数; 71V67703S75BQGI 现货价格参数; BBD-108-T-C 现货价格参数; GP3100E-36-7PW 现货价格参数; BBD-112-G-G 现货价格参数; 7200L12JG8 现货价格参数; RWR80SR154FRB12 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| GM103630-107/HSD/HAMSTD | itt interconnect solutions | GM103630-107 TIN DIPPED MEEHAN |
| 71V416L10PHGI8 | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 10ns 44-Pin TSOP-II T/R |
| BBD-107-G-B | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole Tube |
| RWR80SR150FRS74 | vishay / dale | Res Wirewound 0.15 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 71V67703S75BQGI | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 7.5ns 165-Pin CABGA |
| BBD-108-T-C | samtec inc. | Conn Unshrouded Header HDR 16 POS 2.54mm Solder ST Thru-Hole Tube |
| GP3100E-36-7PW | amphenol | CONN 5015 CIRC PIN 47 POS SLDR ST WALL MNT |
| BBD-112-G-G | samtec inc. | Conn Unshrouded Header HDR 24 POS 2.54mm Solder ST Thru-Hole Tube |
| 7200L12JG8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 256 x 9 32-Pin PLCC T/R |
| RWR80SR154FRB12 | vishay / dale | Res Wirewound 0.154 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 7200L20J8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 256 x 9 32-Pin PLCC T/R |
| BBD-114-T-A | samtec inc. | Conn Unshrouded Header HDR 28 POS 2.54mm Solder ST Thru-Hole Tube |
| GP3100E-36-7PZ | amphenol | CONN 5015 CIRC PIN 47 POS SLDR ST WALL MNT |
| BBD-117-G-C | samtec inc. | Conn Unshrouded Header HDR 34 POS 2.54mm Solder ST Thru-Hole Tube |
| 7201LA12SO8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 512 x 9 28-Pin SOIC T/R |
| RWR80SR154FRS73 | vishay / dale | Res Wirewound 0.154 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| GP3100E-36-7S | amphenol | CONN 5015 CIRC SKT 47 POS SLDR ST WALL MNT |
| BBD-117-G-H | samtec inc. | Conn Unshrouded Header HDR 34 POS 2.54mm Solder ST Thru-Hole Tube |
| 7204L50J8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 4K x 9 32-Pin PLCC T/R |
| RWR80SR154FRS74 | vishay / dale | Res Wirewound 0.154 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 72205LB15PFI8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 256 x 18 64-Pin TQFP T/R |
| GP3101E-40-53SW | amphenol | CONN 5015 CIRC SKT 60 POS SLDR ST CBL MNT |
| BBD-118-G-G | samtec inc. | Conn Unshrouded Header HDR 36 POS 2.54mm Solder ST Thru-Hole Tube |
| BBD-120-T-C | samtec inc. | Conn Unshrouded Header HDR 40 POS 2.54mm Solder ST Thru-Hole Tube |
| 72221L25JI8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 1K x 9 32-Pin PLCC T/R |
| GP3106A-20-27PZ | amphenol | CONN 5015 CIRC PIN 14 POS SLDR ST CBL MNT |
| RWR80SR162FSB12 | vishay / dale | Res Wirewound 0.162 Ohm 1% 2W ±650ppm/°C 0.001% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| BBD-124-T-A | samtec inc. | Conn Unshrouded Header HDR 48 POS 2.54mm Solder ST Thru-Hole Tube |
| 72251L15JI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 8K x 9 32-Pin PLCC Tray |
| GP3106E-10SL-4S | amphenol | CONN 5015 CIRC SKT 2 POS SLDR ST CBL MNT |
| RWR80SR165FRS74 | vishay / dale | Res Wirewound 0.165 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| BBD-125-G-H | samtec inc. | Conn Unshrouded Header HDR 50 POS 2.54mm Solder ST Thru-Hole Tube |
| 72255LA10TF8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 8K x 18 64-Pin STQFP T/R |
| BBD-126-G-D | samtec inc. | Conn Unshrouded Header HDR 52 POS 2.54mm Solder ST Thru-Hole Tube |
| GP3106E-14S-7PY | amphenol | CONN 5015 CIRC PIN 3 POS SLDR ST CBL MNT |
| 72265LA20TF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 16K x 18 64-Pin STQFP |
| RWR80SR165FSB12 | vishay / dale | Res Wirewound 0.165 Ohm 1% 2W ±650ppm/°C 0.001% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| BBD-136-G-C | samtec inc. | Conn Unshrouded Header HDR 72 POS 2.54mm Solder ST Thru-Hole Tube |
| 72271LA10PFG | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 32K x 9 64-Pin TQFP |
| GP3106E-14S-9PY | amphenol | CONN 5015 CIRC PIN 2 POS SLDR ST CBL MNT |
| BBL-111-T-E | samtec inc. | Conn Unshrouded Header HDR 11 POS 2.54mm Solder ST Thru-Hole Tube |
| 72281L15TF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 64K x 9 64-Pin STQFP |
| RWR80SR165FSS74 | vishay / dale | Res Wirewound 0.165 Ohm 1% 2W ±650ppm/°C 0.001% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| GPFM115-13 | sl power electronics | AC/DC Power Supply Single-OUT 13V 6.2A 80W 19-Pin |
| BBS-102-T-A | samtec inc. | Conn Unshrouded Header HDR 2 POS 2.54mm Solder ST Thru-Hole Tube |
| DS2E-M-DC9V-R | Panasonic Electric Works | Low Signal Relays - PCB 2 Form C, 9VDC 2 Form C 400mW Type |
| RWR80SR169FRS74 | vishay / dale | Res Wirewound 0.169 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| BBS-105-G-H | samtec inc. | Conn Unshrouded Header HDR 5 POS 2.54mm Solder ST Thru-Hole Tube |
| 72413L45SO | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 64 x 5 20-Pin SOIC |
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