规格参数 > 第4375页
7-530664-3 现货价格参数; AQ06EM6R2BAJ1A 现货价格参数; FTR-133-53-G-D 现货价格参数; RWR80S9310FSS74 现货价格参数; 7006S17G 现货价格参数; AQ115A471JA1WE 现货价格参数; FTR-1621-59 现货价格参数; 7006S55JI8 现货价格参数; RWR80S93R1DMB12 现货价格参数; AQ125A391JAJME 现货价格参数;
型号 | 生产商 | 产品描述 |
---|---|---|
7-530664-3 | te connectivity / amp | Conn Card Edge SKT 30 POS 3.18mm Solder ST Thru-Hole |
AQ06EM6R2BAJ1A | avx | Cap Ceramic 6.2pF 150V +90±20ppm/C 0.1pF SMD 125°C T/R |
FTR-133-53-G-D | samtec inc. | Conn Unshrouded Header HDR 66 POS 1.27mm Solder ST SMD Tube |
RWR80S9310FSS74 | vishay / dale | Res Wirewound 931 Ohm 1% 2W ±20ppm/°C 0.001% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
7006S17G | integrated device technology (idt) | SRAM Chip Async Dual 5V 128K-Bit 16K x 8 17ns 68-Pin CPGA |
AQ115A471JA1WE | avx | Cap Ceramic 470pF 50V C0G 5% SMD 125°C Waffle Pack |
FTR-1621-59 | finisar | TX/RX Optical Fiber 2700Mbps 20-Pin |
7006S55JI8 | integrated device technology (idt) | SRAM Chip Async Dual 5V 128K-Bit 16K x 8 55ns 68-Pin PLCC T/R |
RWR80S93R1DMB12 | vishay / dale | Res Wirewound 93.1 Ohm 0.5% 2W ±20ppm/°C 1% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
AQ125A391JAJME | avx | Cap Ceramic 390pF 50V C0G 5% SMD 125°C T/R |
FTS-113-03-F-DV-P | samtec inc. | Conn Unshrouded Header HDR 26 POS 1.27mm Solder ST SMD Tube |
AQ12EM180JAJME250V | avx | MICRO-W MLC STD |
7008L20PFI | integrated device technology (idt) | SRAM Chip Async Dual 5V 512K-Bit 64K x 8 20ns 100-Pin TQFP |
RWR80S93R1FMB12 | vishay / dale | Res Wirewound 93.1 Ohm 1% 2W ±20ppm/°C 1% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
AQ12EM1R7BAJME | avx | Cap Ceramic 1.7pF 150V +90±30ppm/C 0.1pF SMD 175°C T/R |
70121L35JI | integrated device technology (idt) | SRAM Chip Async Dual 5V 18K-Bit 2K x 9-Bit 35ns 52-Pin PLCC |
FTS-120-01-L-D | samtec inc. | Conn Unshrouded Header HDR 40 POS 1.27mm Solder ST Thru-Hole Tube |
AQ12EM4R3BAJBE | avx | Cap Ceramic 4.3pF 150V +90±30ppm/C 0.1pF SMD 175°C Bulk |
7024L35GB | integrated device technology (idt) | SRAM Chip Async Dual 5V 64K-Bit 4K x 16 35ns 84-Pin CPGA |
RWR80S93R1FRS74 | vishay / dale | Res Wirewound 93.1 Ohm 1% 2W ±20ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
FTSH-105-04-L-D-RA | samtec inc. | Conn Unshrouded Header HDR 10 POS 1.27mm Solder RA Thru-Hole Tube |
AQ137M1R2BA7WE | avx | Cap Ceramic 1.2pF 500V +90±30ppm/C 0.1pF SMD 175°C Waffle Pack |
7025L20JI | integrated device technology (idt) | SRAM Chip Async Dual 5V 128K-Bit 8K x 16 20ns 84-Pin PLCC Tube |
RWR80S94R2DRB12 | vishay / dale | Res Wirewound 94.2 Ohm 0.5% 2W ±20ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
709279L12PF8 | integrated device technology (idt) | SRAM Chip Sync Dual 5V 512K-Bit 32K x 16 25ns/12ns 100-Pin TQFP T/R |
FTSH-125-01-S-DV-K-P-TR | samtec inc. | Conn Unshrouded Header HDR 50 POS 1.27mm Solder ST SMD T/R |
AQ141M102GAJME | avx | Cap Ceramic 0.001uF 100V +90±20ppm/C 2% SMD 125°C T/R |
RWR80S9530FRB12 | vishay / dale | Res Wirewound 953 Ohm 1% 2W ±20ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
9438 | Keystone Electronics | Screws & Fasteners 3/4 6-32 NYLON BND |
AQ147M100JAJWE | avx | Cap Ceramic 10pF 500V +90±30ppm/C 5% SMD 175°C Waffle Pack |
FTSH-150-01-L-MT | samtec inc. | Conn Unshrouded Header HDR 100 POS 1.27mm Solder RA Thru-Hole/SMD Tube |
70T3399S133BCI8 | integrated device technology (idt) | SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 15ns/4.2ns 256-Pin CABGA T/R |
AQ147M2R7CAJBE | avx | Cap Ceramic 2.7pF 500V +90±30ppm/C 0.25pF SMD 175°C Bulk |
FV80503CSM66233S L2Z3 | intel | PROCESSOR |
70T3519S166BF | integrated device technology (idt) | SRAM Chip Sync Dual 2.5V 9M-Bit 256K x 36 12ns/3.6ns 208-Pin CABGA |
AQ147M330KAJBE | avx | Cap Ceramic 33pF 500V +90±30ppm/C 10% SMD 175°C Bulk |
70T631S10BCI | integrated device technology (idt) | SRAM Chip Async Dual 2.5V 4M-Bit 256K x 18 10ns 256-Pin CABGA Tray |
FW-09-04-F-D-320 | samtec inc. | |
AQ147M390KAJME | avx | Cap Ceramic 39pF 500V +90±30ppm/C 10% SMD 175°C T/R |
70V05S55PFI | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 64K-Bit 8K x 8 55ns 64-Pin TQFP |
AQ147M3R0CAJME500 | avx | Cap Ceramic 3pF 500V +90±30ppm/C 0.25pF SMD 175°C T/R |
FW-20-05-F-D-414-150-A | samtec inc. | Conn Board Stacker HDR 40 POS 1.27mm Solder ST SMD |
70V07S55PF | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 256K-Bit 32K x 8 55ns 80-Pin TQFP |
AQ147M3R9DAJME | avx | Cap Ceramic 3.9pF 500V +90±30ppm/C 0.5pF SMD 175°C T/R |
FW-30-05-F-D-414-150-A | samtec inc. | Conn Board Stacker HDR 60 POS 1.27mm Solder ST SMD |
70V08L15PF8 | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 512K-Bit 64K x 8 15ns 100-Pin TQFP T/R |
AQ147M510FAJBE | avx | Cap Ceramic 51pF 500V +90±30ppm/C 1% SMD 175°C Bulk |
70V24S35PFI | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 64K-Bit 4K x 16 35ns 100-Pin TQFP Tray |
FW-32-05-G-D-385-100-P-TR | samtec inc. | Conn Board Stacker HDR 64 POS 1.27mm Solder ST SMD T/R |
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