规格参数 > 第4376页
FW068S-1SF-C9 现货价格参数; 70V26S35G 现货价格参数; FWFTV22G 现货价格参数; 70V26S55J 现货价格参数; 70V3319S166PRFG 现货价格参数; FWFTV6G 现货价格参数; 70V3379S5PRFI 现货价格参数; RWR80S9530FRS74 现货价格参数; FYL-1118-31PE10-Y19 现货价格参数; 70V3569S5BC 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| FW068S-1SF-C9 | itt interconnect solutions | CONN 5015 CIRC SKT 1 POS SLDR ST CBL MNT |
| 70V26S35G | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 256K-Bit 16K x 16 35ns 84-Pin CPGA |
| FWFTV22G | amphenol pcd | Conn IEEE 1394 RCP 4 POS Solder ST Panel Mount 4 Terminal 1 Port |
| 70V26S55J | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 256K-Bit 16K x 16 55ns 84-Pin PLCC |
| 70V3319S166PRFG | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 12ns/3.6ns 128-Pin TQFP |
| FWFTV6G | amphenol pcd | Conn IEEE 1394 PL 4 POS ST Cable Mount 4 Terminal 1 Port |
| 70V3379S5PRFI | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 576K-Bit 32K x 18 5ns 128-Pin TQFP |
| RWR80S9530FRS74 | vishay / dale | Res Wirewound 953 Ohm 1% 2W ±20ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| FYL-1118-31PE10-Y19 | amphenol | Conn MIL-C-26500 Circular PIN 31 POS Crimp ST Cable Mount 31 Terminal 1 Port |
| 70V3569S5BC | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 576K-Bit 16K x 36 5ns 256-Pin CABGA |
| RWR80S95R3FRB12 | vishay / dale | Res Wirewound 95.3 Ohm 1% 2W ±20ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 70V3569S6DR8 | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 576K-Bit 16K x 36 6ns 208-Pin PQFP T/R |
| FYL-1922-19SE10 | amphenol | Conn MIL-C-26500 Circular SKT 19 POS Crimp ST Jam Nut 19 Terminal 1 Port |
| 70V3589S166DR | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 2.25M-Bit 64K x 36 12ns/3.6ns 208-Pin PQFP |
| RWR80S95R3FRS74 | vishay / dale | Res Wirewound 95.3 Ohm 1% 2W ±20ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| AQ147M7R5CAJWE | avx | Cap Ceramic 7.5pF 500V +90±30ppm/C 0.25pF SMD 175°C Waffle Pack |
| G2.5X3WH6 | panduit | WIDE FINGER, SLOTTED WIRING DUCT |
| 70V3599S133BCI8 | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 4.5M-Bit 128K x 36 15ns/4.2ns 256-Pin CABGA T/R |
| AQ147M8R2JAJME500 | avx | Cap Ceramic 8.2pF 500V +90±30ppm/C 5% SMD 175°C T/R |
| RWR80S95R3FSB12 | vishay / dale | Res Wirewound 95.3 Ohm 1% 2W ±20ppm/°C 0.001% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| G2R14T130DC12 | omron electronics | INDUSTRIAL, 1 FORM C, PCB, 12 VDC, SEALED |
| 70V35L20PF8 | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 144K-Bit 8K x 18 20ns 100-Pin TQFP T/R |
| AQ14EM511KAJME | avx | Cap Ceramic 510pF 150V +90±20ppm/C 10% SMD 125°C T/R |
| 70V37L15PF8 | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 576K-Bit 32K x 18 15ns 100-Pin TQFP T/R |
| ASQ24T03150-NCC0 | power-one | DCDC |
| G2R2A4AC240 | omron electronics | Electromechanical Relay DPST-NO 4A 240VAC 30KOhm Through Hole |
| RWR80S95R3FSS74 | vishay / dale | Res Wirewound 95.3 Ohm 1% 2W ±20ppm/°C 0.001% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 70V631S12BFI | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 4.5M-Bit 256K x 18 12ns 208-Pin CABGA |
| ASQ24T03150-PABP | power-one | DCDC |
| G3VM3FLS | omron electronics | MOSFET, 1 FORM A, SMT, N/A, SEALED |
| 70V658S15BC8 | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 2.25M-Bit 64K x 36 15ns 256-Pin CABGA T/R |
| ASQ24T04120-PACP | power-one | Module DC-DC 1-OUT 12V 4A 50W 8-Pin 1/8-Brick |
| RWR80S9650BRS73 | vishay / dale | Res Wirewound 965 Ohm 0.1% 2W ±20ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 70V9279L7PRF8 | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 512K-Bit 32K x 16 18ns/7.5ns 128-Pin TQFP T/R |
| G5V12DC12 | omron electronics | Electromechanical Relay SPDT 1A 12VDC 960Ohm Through Hole |
| ASQ24T04120-PBAP | power-one | Module DC-DC 1-OUT 12V 4A 50W 8-Pin 1/8-Brick |
| RWR80S9760FRS74 | vishay / dale | Res Wirewound 976 Ohm 1% 2W ±20ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 70V9289L9PRFI8 | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 1M-Bit 64K x 16 20ns/9ns 128-Pin TQFP T/R |
| ASQ24T15010-NDB0 | power-one | Module DC-DC 1-OUT 1V 15A 50W 8-Pin 1/8-Brick |
| G6A234PBSDC24 | omron electronics | Electromechanical Relay DPDT 2A 24VDC 2.057KOhm Through Hole |
| 70V9389L12PRF8 | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 1.125M-Bit 64K x 18 25ns/12ns 128-Pin TQFP T/R |
| ASQ24T15012-NECP | power-one | Module DC-DC 1-OUT 1.2V 15A 50W 8-Pin 1/8-Brick |
| RWR80S97R6DRB12 | vishay / dale | Res Wirewound 97.6 Ohm 0.5% 2W ±20ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| G748127-32S RJ | avx | MOLDED TA,LOW ESR,15UF,25V,10%,7IN RL (TAZH156K025CRSB0023) |
| 7130LA35JI | integrated device technology (idt) | SRAM Chip Async Dual 5V 8K-Bit 1K x 8 35ns 52-Pin PLCC |
| ASQ24T15012-PDCP | power-one | Module DC-DC 1-OUT 1.2V 15A 50W 8-Pin 1/8-Brick |
| RWR80S97R6FRS73 | vishay / dale | Res Wirewound 97.6 Ohm 1% 2W ±20ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| GA342D1XGF330JY02L | murata electronics | Cap Ceramic 33pF 250VAC SL 5% SMD 1808 Embossed T/R |
| ASQ24T15018-NCCP | power-one | Module DC-DC 1-OUT 1.8V 15A 50W 8-Pin 1/8-Brick |
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