规格参数 > 第4380页
BBS-106-T-B 现货价格参数; 72615L25J 现货价格参数; RWR80SR178FRS73 现货价格参数; GQM1885C2A3R6BB01D 现货价格参数; BBS-106-T-D 现货价格参数; 726343-1 现货价格参数; RWR80SR178FRS74 现货价格参数; GQM1885C2AR50BB01D 现货价格参数; BBS-106-T-G 现货价格参数; 72805LB15PFI8 现货价格参数;
型号 | 生产商 | 产品描述 |
---|---|---|
BBS-106-T-B | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole Tube |
72615L25J | integrated device technology (idt) | FIFO Mem Sync Dual Bi-Dir 512 x 18 x 2 68-Pin PLCC |
RWR80SR178FRS73 | vishay / dale | Res Wirewound 0.178 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
GQM1885C2A3R6BB01D | murata electronics | Cap Ceramic 3.6pF 100V C0G 0.1pF SMD 0603 125°C Paper T/R |
BBS-106-T-D | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole Tube |
726343-1 | te connectivity / amp | Ring Tongue Terminal 8AWG Tin Box |
RWR80SR178FRS74 | vishay / dale | Res Wirewound 0.178 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
GQM1885C2AR50BB01D | murata electronics | Cap Ceramic 0.5pF 100V C0G 0.1pF SMD 0603 125°C Paper T/R |
BBS-106-T-G | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole Tube |
72805LB15PFI8 | integrated device technology (idt) | FIFO Mem Sync Quad Depth/Width Bi-Dir 256 x 18 x 2 128-Pin TQFP T/R |
72811L25TFI | integrated device technology (idt) | FIFO Mem Sync Quad Depth/Width Bi-Dir 512 x 9 x 2 64-Pin STQFP |
BBS-108-G-H | samtec inc. | Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole Tube |
RWR80SR178FSS74 | vishay / dale | Res Wirewound 0.178 Ohm 1% 2W ±650ppm/°C 0.001% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
GQM2195C2A4R7BB01D | murata electronics | Cap Ceramic 4.7pF 100V C0G 0.1pF SMD 0805 125°C Paper T/R |
72825LB10PF8 | integrated device technology (idt) | FIFO Mem Sync Quad Depth/Width Bi-Dir 1K x 18 x 2 128-Pin TQFP T/R |
BBS-109-G-C | samtec inc. | Conn Unshrouded Header HDR 9 POS 2.54mm Solder ST Thru-Hole Tube |
GRM1885C1H391FA01D | murata electronics | Cap Ceramic 390pF 50V C0G 1% SMD 0603 125°C Paper T/R |
RWR80SR182FRB12 | vishay / dale | Res Wirewound 0.182 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
7284L15PA8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 4K x 9 x 2 56-Pin TSSOP T/R |
BBS-114-G-B | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole Tube |
GRM1886P1H151GZ01D | murata electronics | Cap Ceramic 150pF 50V P2H 2% SMD 0603 125°C Paper T/R |
72T3665L4-4BB | integrated device technology (idt) | FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 4K x 36 208-Pin BGA |
BBS-117-G-B | samtec inc. | Conn Unshrouded Header HDR 17 POS 2.54mm Solder ST Thru-Hole Tube |
RWR80SR182FRR36 | vishay / dale | Res Wirewound 0.182 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
72T72115L5BBGI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 128K x 72 324-Pin BGA |
BBS-117-G-D | samtec inc. | Conn Unshrouded Header HDR 17 POS 2.54mm Solder ST Thru-Hole Tube |
GRM2165C1H121FA01D | murata electronics | Cap Ceramic 120pF 50V C0G 1% SMD 0805 125°C Paper T/R |
RWR80SR182FRS73 | vishay / dale | Res Wirewound 0.182 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
BBS-119-T-B | samtec inc. | Conn Unshrouded Header HDR 19 POS 2.54mm Solder ST Thru-Hole Tube |
72V01L15JG8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 512 x 9 32-Pin PLCC T/R |
GRM216R71H332JD01D | murata electronics | Cap Ceramic 0.0033uF 50V X7R 5% SMD 0805 125°C Paper T/R |
BBS-120-T-G | samtec inc. | Conn Unshrouded Header HDR 20 POS 2.54mm Solder ST Thru-Hole Tube |
72V245L20TF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 4K x 18 64-Pin STQFP |
RWR80SR182FRS74 | vishay / dale | Res Wirewound 0.182 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
BBS-131-T-B | samtec inc. | Conn Unshrouded Header HDR 31 POS 2.54mm Solder ST Thru-Hole Tube |
GRM21A5C2E101JW01D | murata electronics | Cap Ceramic 100pF 250V C0G 5% SMD 0805 125°C Paper T/R |
72V285L10PF8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 64K x 18 64-Pin TQFP T/R |
BC238 | fairchild semiconductor | Trans GP BJT NPN 25V 0.1A 3-Pin TO-92 Bulk |
RWR80SR187FRB12 | vishay / dale | Res Wirewound 0.187 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
72V285L15TF8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 64K x 18 64-Pin STQFP T/R |
GRM316R71H123KD01D | murata electronics | Cap Ceramic 0.012uF 50V X7R 10% SMD 1206 125°C Paper T/R |
BC546CBU | fairchild semiconductor | Trans GP BJT NPN 65V 0.1A 3-Pin TO-92 Bulk |
72V285L20TF8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 64K x 18 64-Pin STQFP T/R |
RWR80SR187FRS74 | vishay / dale | Res Wirewound 0.187 Ohm 1% 2W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
3781-18-0 | Pomona Electronics | Test Leads 18 W/EACH END BLK |
BC847AMTF | fairchild semiconductor | Trans GP BJT NPN 45V 0.1A 3-Pin SOT-23 T/R |
72V3640L6PF8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 1K x 36 128-Pin TQFP T/R |
BCS-103-L-S-HE | samtec inc. | Conn Socket Strip SKT 3 POS 2.54mm Solder RA Thru-Hole |
RWR80SR187FSS74 | vishay / dale | Res Wirewound 0.187 Ohm 1% 2W ±650ppm/°C 0.001% Ceramic Hi Temp Sil AXL Thru-Hole T/R |
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