购物车(规格参数 > 第10114页
RT1236B7TR7 现货价格参数; 0025022034 现货价格参数; GS8662Q08E-200I 现货价格参数; 0025022080 现货价格参数; M55342K11B24E3RS3 现货价格参数; RT1432B7TR7 现货价格参数; 0025026040 现货价格参数; RT2403B7TR7 现货价格参数; GS8662Q08E-300 现货价格参数; M55342K11B24E3RTP 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| RT1236B7TR7 | cts components | Res NET 100 Ohm 1% 1W ±200ppm/°C ISOL Molded 64-Pin BGA Ball SMD T/R |
| 0025022034 | molex | Conn Shrouded Header HDR 34 POS 2.54mm Solder ST Thru-Hole Tray |
| GS8662Q08E-200I | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 8 0.45ns 165-Pin FBGA Tray |
| 0025022080 | molex | Conn Shrouded Header HDR 80 POS 2.54mm Solder ST Thru-Hole Tray |
| M55342K11B24E3RS3 | vishay / dale | Res Thick Film 0402 24.3K Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| RT1432B7TR7 | cts components | Res NET 120 Ohm 1% 1W ±200ppm/°C BUS Molded 27-Pin BGA Ball SMD T/R |
| 0025026040 | molex | Conn Shrouded Header HDR 40 POS 2.54mm Solder ST Thru-Hole Tray |
| RT2403B7TR7 | cts components | Res NET 25 Ohm 1% 1W ±200ppm/°C BUS Molded 27-Pin BGA Ball SMD T/R |
| GS8662Q08E-300 | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 8 0.45ns 165-Pin FBGA Tray |
| M55342K11B24E3RTP | vishay / dale | Res Thick Film 0402 24.3K Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| 0025026100 | molex | Conn Shrouded Header HDR 100 POS 2.54mm Solder ST Thru-Hole Tray |
| RT2416B7TR7 | cts components | Res NET 8.2K Ohm 1% 1W ±200ppm/°C BUS Molded 12-Pin BGA Ball SMD T/R |
| GS8662Q09E-200 | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| M55342K11B24E9PWB | vishay / dale | Res Thick Film 0402 24.9K Ohm 1% 1/20W ±100ppm/°C 0.1% Molded SMD SMD Tray |
| LP3964EMP-2.5 | Texas Instruments | Low Dropout Regulators - LDO |
| RWR80S1330FRB12 | vishay / dale | Res Wirewound 133 Ohm 1% 2W ±20ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| GS8662Q09E-250I | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| RWR80S1871FMB12 | vishay / dale | Res Wirewound 1.87K Ohm 1% 2W ±20ppm/°C 1% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| GLL4760A/46 | Vishay Semiconductors | Zener Diodes 68 Volt 1 Watt 5% |
| M55342K11B24E9RS6 | vishay / dale | Res Thick Film 0402 24.9K Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| RWR80S2R43FRB12 | vishay / dale | Res Wirewound 2.43 Ohm 1% 2W ±50ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| GS8662Q18E-300I | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA Tray |
| 0026282021 | molex | Conn Unshrouded Header HDR 2 POS 3.96mm Solder RA Thru-Hole Bag |
| M55342K11B24E9RWB | vishay / dale | Res Thick Film 0402 24.9K Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD Tray |
| RWR80S8R06FSB12 | vishay / dale | Res Wirewound 8.06 Ohm 1% 2W ±50ppm/°C 0.001% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 0026352062 | molex | Conn IDC Connector F 6 POS 3.96mm IDT RA Cable Mount |
| RWR81SR464FRB12 | vishay / dale | Res Wirewound 0.464 Ohm 1% 1W ±650ppm/°C 0.01% Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| GS8662Q36E-300I | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA Tray |
| 0026352071 | molex | Conn IDC Connector F 7 POS 3.96mm IDT RA Cable Mount |
| M55342K11B24H0RS3 | vishay / dale | Res Thick Film 0402 24K Ohm 2% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| S1008-103K | api delevan | Ind RF Shielded Wirewound 10uH 10% 7.9MHz 30Q-Factor Ferrite 230mA 1008 T/R |
| 0026481060 | molex | Conn Unshrouded Header HDR 6 POS 3.96mm Solder ST Thru-Hole Bag |
| GS8662R08E-250I | gsi technology | SRAM Chip Sync Single 1.8V 64M-Bit 8M x 8 0.45ns 165-Pin FBGA Tray |
| S1008-122J | api delevan | Ind RF Shielded Wirewound 1.2uH 5% 7.9MHz 30Q-Factor Ferrite 625mA 1008 T/R |
| M55342K11B24J0MTP | vishay / dale | Res Thick Film 0402 24 Ohm 5% 1/20W ±100ppm/°C 1% Molded SMD SMD T/R |
| 0026482234 | molex | Conn Unshrouded Header HDR 21 POS 3.96mm Solder RA Thru-Hole Bag |
| GS8662R08E-300 | gsi technology | SRAM Chip Sync Single 1.8V 64M-Bit 8M x 8 0.45ns 165-Pin FBGA Tray |
| S1008-181G | api delevan | Ind RF Shielded Wirewound 180nH 2% 25MHz 40Q-Factor Ferrite 970mA 1008 T/R |
| 0026484056 | molex | Conn Unshrouded Header HDR 5 POS 3.96mm Solder ST Thru-Hole Bulk |
| M55342K11B24J0PTP | vishay / dale | Res Thick Film 0402 24 Ohm 5% 1/20W ±100ppm/°C 0.1% Molded SMD SMD T/R |
| S1008-183K | api delevan | Ind RF Shielded Wirewound 18uH 10% 2.5MHz 30Q-Factor Ferrite 200mA 1008 T/R |
| GS8662R09E-167I | gsi technology | SRAM Chip Sync Single 1.8V 72M-Bit 8M x 9-Bit 0.4ns 165-Pin FBGA Tray |
| 0026484111 | molex | Conn Unshrouded Header HDR 11 POS 3.96mm Solder ST Thru-Hole Bag |
| S1008R-471F | api delevan | Ind RF Shielded Wirewound 470nH 1% 25MHz 40Q-Factor Ferrite 815mA 1008 T/R |
| M55342K11B24J0RS2 | vishay / dale | Res Thick Film 0402 24 Ohm 5% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| GS8662R09E-200 | gsi technology | SRAM Chip Sync Single 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| 0026484154 | molex | 156 KK BKWY HDR STR SQP TFT 15CKT |
| S1008R-621F | api delevan | Ind RF Shielded Wirewound 620nH 1% 25MHz 40Q-Factor Ferrite 770mA 1008 T/R |
| M55342K11B24J0RWB | vishay / dale | Res Thick Film 0402 24 Ohm 5% 1/20W ±100ppm/°C 0.01% Molded SMD SMD Tray |
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