规格参数 > 第10113页
M55342K11B243ERS6 现货价格参数; RS02C9K000FE12 现货价格参数; GROUPC/F9568901VXC 现货价格参数; M55342K11B243ESS6 现货价格参数; RS02M225R0FE12 现货价格参数; GROUPD/F9563201VXC 现货价格参数; M55342K11B249DRS2 现货价格参数; RS121R250FE70 现货价格参数; GROUPE/F9563201VXC 现货价格参数; RS122K000FE12 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| M55342K11B243ERS6 | vishay / dale | Res Thick Film 0402 243K Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| RS02C9K000FE12 | vishay / dale | Res Wirewound 9K Ohm 1% 2.5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| GROUPC/F9568901VXC | intersil | DATA |
| M55342K11B243ESS6 | vishay / dale | Res Thick Film 0402 243K Ohm 1% 1/20W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| RS02M225R0FE12 | vishay / dale | Res Wirewound 225 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| GROUPD/F9563201VXC | intersil | DATA |
| M55342K11B249DRS2 | vishay / dale | Res Thick Film 0402 249 Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| RS121R250FE70 | vishay / dale | Res Wirewound 1.25 Ohm 1% 3/4W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| GROUPE/F9563201VXC | intersil | DATA |
| RS122K000FE12 | vishay / dale | Res Wirewound 2K Ohm 1% 3/4W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| M55342K11B249DSS2 | vishay / dale | Res Thick Film 0402 249 Ohm 1% 1/20W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| 0022427105 | molex | Conn IDC Connector F 10 POS 2.54mm IDT RA Cable Mount Bag |
| GS78116AB-8I | gsi technology | SRAM Chip Async Single 3.3V 8M-Bit 512K x 16 8ns 119-Pin FBGA Tray |
| RS124K700JE70 | vishay / dale | Res Wirewound 4.7K Ohm 5% 3/4W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 0022427110 | molex | Conn IDC Connector F 11 POS 2.54mm IDT RA Cable Mount Bag |
| RS126R000FE12 | vishay / dale | Res Wirewound 6 Ohm 1% 3/4W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| GS8342D08E-333 | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 8 0.45ns 165-Pin FBGA Tray |
| M55342K11B249DSS6 | vishay / dale | Res Thick Film 0402 249 Ohm 1% 1/20W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| 0022427175 | molex | Conn IDC Connector F 17 POS 2.54mm IDT RA Cable Mount Bag |
| RS12R3220FE70 | vishay / dale | Res Wirewound 0.322 Ohm 1% 3/4W ±90ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 0022432050 | molex | Conn IDC Connector M 5 POS 2.5mm IDT RA Cable Mount |
| GS8342D08E-333I | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 8 0.45ns 165-Pin FBGA Tray |
| M55342K11B249DTWBT | vishay / dale | Res Thick Film 0402 249 Ohm 1% 1/20W ±100ppm/°C Molded SMD SMD Tray |
| RS1416R90FE12 | vishay / dale | Res Wirewound 16.9 Ohm 1% 2/5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 0022433132 | molex | Conn IDC Connector F 13 POS 4.2mm IDT RA Cable Mount |
| GS8342D09E-200I | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| RS1416R90FE70 | vishay / dale | Res Wirewound 16.9 Ohm 1% 2/5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| M55342K11B249ERS6 | vishay / dale | Res Thick Film 0402 249K Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| 0022436130 | molex | Conn Shrouded Header HDR 13 POS 2.5mm Solder ST Thru-Hole Bag |
| RS141K240FE70 | vishay / dale | Res Wirewound 1.24K Ohm 1% 2/5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| GS8342S09E-167 | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 9-Bit 0.5ns 165-Pin FBGA Tray |
| 0022472148 | molex | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
| M55342K11B249ERWB | vishay / dale | Res Thick Film 0402 249K Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD Tray |
| RS141K470FE70 | vishay / dale | Res Wirewound 1.47K Ohm 1% 2/5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 2967675 | Phoenix Contact | Industrial Relays PLC-RSC-230UC/21 HC |
| GS8342S09E-300I | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| RS1428R70FE12 | vishay / dale | Res Wirewound 28.7 Ohm 1% 2/5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 0022663269 | molex | Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Thru-Hole |
| M55342K11B24D3SWB | vishay / dale | Res Thick Film 0402 24.3 Ohm 1% 1/20W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| GS8342T09E-250I | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 4M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| RS1435R00FE12 | vishay / dale | Res Wirewound 35 Ohm 1% 2/5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 0022672040 | molex | Conn Shrouded Header HDR 4 POS 2.54mm Solder RA Thru-Hole Bag |
| M55342K11B24D9SS6 | vishay / dale | Res Thick Film 0402 24.9 Ohm 1% 1/20W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| RS148R250FE12 | vishay / dale | Res Wirewound 8.25 Ohm 1% 2/5W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| GS8662D08E-333 | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 8 0.45ns 165-Pin FBGA Tray |
| 0022672162 | molex | 100 KK HDR RA TFT 16CKT |
| RS1G-E3/61T | vishay / semiconductor | Diode Switching 400V 1A 2-Pin SMA T/R |
| 0022673021 | molex | 100 KK HDR RA 30SAU 2CKTIN |
| GS8662D36E-200I | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA Tray |
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