规格参数 > 第10115页
GS8662R09E-333 现货价格参数; S102K29X5FN6TJ5R 现货价格参数; 0026486042 现货价格参数; M55342K11B24K0RWB 现货价格参数; GS8662R18E-250 现货价格参数; S1210-153G 现货价格参数; 0026496053 现货价格参数; S1210-221K 现货价格参数; M55342K11B255DRS2 现货价格参数; GS8662R18E-300I 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| GS8662R09E-333 | gsi technology | SRAM Chip Sync Single 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| S102K29X5FN6TJ5R | vishay / bc components | Cap Ceramic 0.001uF 1000V X5F 10% (7.5 X 4mm) Radial 5mm 85°C T/R |
| 0026486042 | molex | Conn Unshrouded Header HDR 4 POS 3.96mm Solder RA Thru-Hole |
| M55342K11B24K0RWB | vishay / dale | Res Thick Film 0402 24K Ohm 5% 1/20W ±100ppm/°C 0.01% Molded SMD SMD Tray |
| GS8662R18E-250 | gsi technology | SRAM Chip Sync Single 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA Tray |
| S1210-153G | api delevan | Ind RF Shielded Wirewound 15uH 2% 2.5MHz 40Q-Factor Ferrite 254mA 1210 T/R |
| 0026496053 | molex | 156 KK BKWY HDR RA SQP TFT 5CKT |
| S1210-221K | api delevan | Ind RF Shielded Wirewound 220nH 10% 25MHz 40Q-Factor Iron 876mA 1210 T/R |
| M55342K11B255DRS2 | vishay / dale | Res Thick Film 0402 255 Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| GS8662R18E-300I | gsi technology | SRAM Chip Sync Single 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA Tray |
| 0026503190 | molex | Conn Unshrouded Header HDR 19 POS 3.96mm Solder ST Thru-Hole Bulk |
| S1210-683H | api delevan | Ind RF Shielded Wirewound 68uH 3% 2.5MHz 40Q-Factor Ferrite 152mA 1210 T/R |
| 0026504043 | molex | Conn Unshrouded Header HDR 7 POS 3.96mm Solder RA Thru-Hole Bag |
| M55342K11B255DRTP | vishay / dale | Res Thick Film 0402 255 Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| GS8662S08E-200I | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 8 0.45ns 165-Pin FBGA Tray |
| S1210R-123H | api delevan | Ind RF Shielded Wirewound 12uH 3% 2.5MHz 40Q-Factor Ferrite 277mA 1210 T/R |
| 0026580029 | molex | 156 KK BKWY HDR STR SQP TFT 2CKT |
| GS8662S09E-300 | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| M55342K11B255ERS2 | vishay / dale | Res Thick Film 0402 255K Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| S1210R-221H | api delevan | Ind RF Shielded Wirewound 220nH 3% 25MHz 40Q-Factor Iron 876mA 1210 T/R |
| 0026604021 | molex | Conn Wire to Board HDR 2 POS 3.96mm Solder ST Thru-Hole |
| GS8662S18E-250I | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 0.45ns 165-Pin FBGA Tray |
| 0026606021 | molex | Conn Wire to Board HDR 2 POS 3.96mm Solder ST Thru-Hole |
| T 3638 004 | Amphenol Tuchel | Circular DIN Connectors 12 Pin female;Gold Front Mount |
| M55342K11B255ESS2 | vishay / dale | Res Thick Film 0402 255K Ohm 1% 1/20W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| 0026609060 | molex | Conn Wire to Board HDR 6 POS 3.96mm Solder ST Thru-Hole Bag |
| ASJ-5-5 | ADAM TECH | Phone Connectors STEREO JACK TYPE 5 5 CONTACT FORMS |
| GS8662S36E-167 | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.5ns 165-Pin FBGA Tray |
| M55342K11B255ESS6 | vishay / dale | Res Thick Film 0402 255K Ohm 1% 1/20W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| 0026612070 | molex | Conn Unshrouded Header HDR 7 POS 3.96mm Solder ST Thru-Hole Bag |
| S1812-122K | api delevan | Ind RF Shielded Wirewound 1.2uH 10% 7.9MHz 40Q-Factor Ferrite 725mA 1812 T/R |
| GS8662S36E-250I | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA Tray |
| M55342K11B255ESWB | vishay / dale | Res Thick Film 0402 255K Ohm 1% 1/20W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| 0026615042 | molex | Conn Wire to Board HDR 4 POS 3.96mm Solder RA Thru-Hole |
| S1812-151G | api delevan | Ind RF Shielded Wirewound 150nH 2% 25MHz 50Q-Factor Iron 1.347A 1812 T/R |
| GS8662T08E-167 | gsi technology | SRAM Chip Sync Single 1.8V 72M-Bit 8M x 8 0.5ns 165-Pin FBGA Tray |
| 0026623054 | molex | Conn Unshrouded Header HDR 5 POS 3.96mm Solder ST Thru-Hole Bulk |
| S1812-183H | api delevan | Ind RF Shielded Wirewound 18uH 3% 2.5MHz 50Q-Factor Ferrite 288mA 1812 T/R |
| S1812-471G | api delevan | Ind RF Shielded Wirewound 470nH 2% 25MHz 40Q-Factor Iron 802mA 1812 T/R |
| 0026625032 | molex | Conn Wire to Board HDR 3 POS 3.96mm Solder RA Thru-Hole |
| M55342K11B25D5RS2 | vishay / dale | Res Thick Film 0402 25.5 Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| GS8662T08E-200I | gsi technology | SRAM Chip Sync Single 1.8V 72M-Bit 8M x 8 0.45ns 165-Pin FBGA Tray |
| S1812-473G | api delevan | Ind RF Shielded Wirewound 47uH 2% 2.5MHz 50Q-Factor Ferrite 242mA 1812 T/R |
| 0031.2201 | schurter | Fuse Holder 30A 600VDC Solder Lug Panel Mount Bulk |
| GS8662T08E-333 | gsi technology | SRAM Chip Sync Single 1.8V 72M-Bit 8M x 8 0.45ns 165-Pin FBGA Tray |
| M55342K11B25D5RS6 | vishay / dale | Res Thick Film 0402 25.5 Ohm 1% 1/20W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| S1812-683G | api delevan | Ind RF Shielded Wirewound 68uH 2% 2.5MHz 50Q-Factor Ferrite 215mA 1812 T/R |
| 0031.5101 | schurter | Fuse Holder 6.3A 250VAC Solder Lug Screw Mount Bulk |
| S1812-823K | api delevan | Ind RF Shielded Wirewound 82uH 10% 2.5MHz 50Q-Factor Ferrite 196mA 1812 T/R |
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