规格参数 > 第71230页
75-068622-22S 现货价格参数; B43601C2827M87 现货价格参数; GS832118GE-166V 现货价格参数; RC55Y-124RBI 现货价格参数; NTR50D4220CTRF 现货价格参数; B43601C5187M 现货价格参数; 320-1510-500K 现货价格参数; GS832118GE-200IV 现货价格参数; B43601C5187M60 现货价格参数; AC0805FR-0775RL 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 75-068622-22S | Amphenol Aerospace | Circular MIL Spec Connector 4P 97 Series MIL-DTL-5015 |
| B43601C2827M87 | tdk epcos | Cap Aluminum 820uF 200V 20% (30 X 30mm) Snap-In 10mm 0.12 Ohm 2400mA 10000h 85°C Bulk |
| GS832118GE-166V | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 36M-Bit 2M x 18 7ns/3.5ns 165-Pin FBGA Tray |
| RC55Y-124RBI | Welwyn Components / TT electronics | 金属被膜抵抗器 - スルーホール 124ohms 0.1% |
| NTR50D4220CTRF | nic components | Res Thin Film 2512 422 Ohm 0.5% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B43601C5187M | tdk epcos | Cap Aluminum 180uF 450V 20% (30 X 25mm) 10mm 0.6 Ohm 1330mA 10000 hr 85°C Bulk |
| 320-1510-500K | Xicon | Trimmer Resistors - Through Hole BLK KNURL 3PIN 500K |
| GS832118GE-200IV | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 36M-Bit 2M x 18 6.5ns/3ns 165-Pin FBGA Tray |
| B43601C5187M60 | tdk epcos | Cap Aluminum 180uF 450V 20% (30 X 25mm) 10mm 0.6 Ohm 1330mA 10000 hr 85°C Bulk |
| AC0805FR-0775RL | Yageo | Thick Film Resistors - SMD 1/8W 75ohm 1% |
| NTR50D4321CTRF | nic components | Res Thin Film 2512 4.32K Ohm 0.5% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 10-565997-614N | Amphenol Aerospace | Circular MIL Spec Connector JAM NUT RECPT |
| GS832118GE-225V | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 36M-Bit 2M x 18 6ns/3ns 165-Pin FBGA Tray |
| B43601C5187M67 | tdk epcos | Cap Aluminum 180uF 450V 20% (30 X 25mm) 10mm 0.6 Ohm 1330mA 10000 hr 85°C Bulk |
| 271-78.7/REEL | Xicon | Metal Film Resistors - Through Hole 78.7ohms 1% 50PPM |
| NTR50D4420DTRF | nic components | Res Thin Film 2512 442 Ohm 0.5% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B43601C5187M87 | tdk epcos | Cap Aluminum 180uF 450V 20% (30 X 25mm) 10mm 0.6 Ohm 1330mA 10000 hr 85°C Bulk |
| GS832118GE-250IV | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 36M-Bit 2M x 18 5.5ns/3ns 165-Pin FBGA Tray |
| 302-53.6 | Xicon | Thick Film Resistors - SMD 53.6ohms 1% Tol |
| NTR50D4421CTRF | nic components | Res Thin Film 2512 4.42K Ohm 0.5% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B43601C5227M | tdk epcos | Cap Aluminum 220uF 450V 20% (30 X 30mm) 10mm 0.49 Ohm 1530mA 10000 hr 85°C Bulk |
| C1808Q104J5XAG | Kemet | マルチレイヤーセラミックキャパシタ MLCC - SMD/SMT |
| GS832132GE-150IV | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 32M-Bit 1M x 32 7.5ns/3.8ns 165-Pin FBGA Tray |
| RN73H1JTTD9531D50 | KOA Speer | Thin Film Resistors - SMD 1/10W 9.53K ohm .50% 50ppm |
| B43601C5227M82 | tdk epcos | Cap Aluminum 220uF 450V 20% (30 X 30mm) 0.49 Ohm 1530mA 10000 hr 85°C Bulk |
| NTR50D4421DTRF | nic components | Res Thin Film 2512 4.42K Ohm 0.5% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| DCP4K05160SL1IJY00 | WIMA | フィルムコンデンサ DC-LINK MKP 4 16.0 uF 700 VDC 20x39.5x41.5 SN |
| B43601C5227M87 | tdk epcos | Cap Aluminum 220uF 450V 20% (30 X 30mm) 10mm 0.49 Ohm 1530mA 10000 hr 85°C Bulk |
| GS832132GE-166IV | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 32M-Bit 1M x 32 7ns/3.5ns 165-Pin FBGA Tray |
| 294-1.1M | Xicon | Carbon Film Resistors - Through Hole 1.1Mohms 5% |
| NTR50D4531DTRF | nic components | Res Thin Film 2512 4.53K Ohm 0.5% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B43601C5277M67 | tdk epcos | Cap Aluminum 270uF 450V 20% (35 X 30mm) 10mm 0.4 Ohm 1770mA 10000 hr 85°C Bulk |
| RLP01R3480GS00 | Vishay / Sfernice | Wirewound Resistors - Through Hole RLP 1 U348 2% BA100NA e3 |
| GS832132GE-200V | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 32M-Bit 1M x 32 6.5ns/3ns 165-Pin FBGA Tray |
| 3310H-004-502L | Bourns | Potentiometers Potentiometers, Variable Resistors Rotary - Linear - POT COND PLASTIC 9MM 5K OHM |
| B43601C5277M80 | tdk epcos | Cap Aluminum 270uF 450V 20% (35 X 30mm) 10mm 0.4 Ohm 1770mA 10000 hr 85°C Bulk |
| NTR50D4640DTRF | nic components | Res Thin Film 2512 464 Ohm 0.5% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| C1210N222J1GSH | Kemet | Multilayer Ceramic Capacitors MLCC - SMD/SMT 2200PF 100V |
| B43601C5277M82 | tdk epcos | Cap Aluminum 270uF 450V 20% (35 X 30mm) 0.4 Ohm 1770mA 10000 hr 85°C Bulk |
| GS832132GE-225IV | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 32M-Bit 1M x 32 6ns/3ns 165-Pin FBGA Tray |
| RN73H1JTTD1650B50 | KOA Speer | Thin Film Resistors - SMD 1/10W 165 ohm 0.1% 50ppm |
| NTR50D4641DTRF | nic components | Res Thin Film 2512 4.64K Ohm 0.5% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B43601C5337M | tdk epcos | Cap Aluminum 330uF 450V 20% (35 X 30mm) 10mm 0.33 Ohm 1960mA 10000 hr 85°C Bulk |
| PV22Y203A01B00 | Murata Electronics | Trimmer Resistors - Through Hole 20k ohm |
| GS832132GE-225V | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 32M-Bit 1M x 32 6ns/3ns 165-Pin FBGA Tray |
| C06CF0R3D-9UN-X1T | Dielectric Laboratories | マルチレイヤーセラミックキャパシタ MLCC - SMD/SMT .3pF 250V +/-.50pF Low ESR |
| B43601C5337M62 | tdk epcos | Cap Aluminum 330uF 450V 20% (35 X 30mm) 0.33 Ohm 1960mA 10000 hr 85°C Bulk |
| NTR50D4643CTRF | nic components | Res Thin Film 2512 464K Ohm 0.5% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B43601C5337M67 | tdk epcos | Cap Aluminum 330uF 450V 20% (35 X 30mm) 10mm 0.33 Ohm 1960mA 10000 hr 85°C Bulk |
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