规格参数 > 第71228页
GS8320E32GT-250V 现货价格参数; C1210C683J2RAC 现货价格参数; NTR50D3161DTRF 现货价格参数; B43601B9337M80 现货价格参数; GS8320E36GT-133IV 现货价格参数; FKP2C022201J00KF00 现货价格参数; B43601B9397M 现货价格参数; NTR50D3162DTRF 现货价格参数; P0805H4992FN 现货价格参数; B43601B9397M62 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| GS8320E32GT-250V | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 32M-Bit 1M x 32 5.5ns/3ns 100-Pin TQFP Tray |
| C1210C683J2RAC | Kemet | Multilayer Ceramic Capacitors MLCC - SMD/SMT .068UF 200V |
| NTR50D3161DTRF | nic components | Res Thin Film 2512 3.16K Ohm 0.5% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B43601B9337M80 | tdk epcos | Cap Aluminum 330uF 400V 20% (30 X 35mm) 10mm 0.33 Ohm 1810mA 10000 hr 85°C Bulk |
| GS8320E36GT-133IV | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 36M-Bit 1M x 36 8.5ns/4ns 100-Pin TQFP Tray |
| FKP2C022201J00KF00 | WIMA | Film Capacitors FKP 2 0.022 uF 63 VDC 7.2x8.5x7.2 PCM5 |
| B43601B9397M | tdk epcos | Cap Aluminum 390uF 400V 20% (30 X 35mm) 10mm 0.28 Ohm 1970mA 10000 hr 85°C Bulk |
| NTR50D3162DTRF | nic components | Res Thin Film 2512 31.6K Ohm 0.5% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| P0805H4992FN | Vishay / Sfernice | 薄膜抵抗器 - SMD P 0805 H 4992 F N WP e2 |
| B43601B9397M62 | tdk epcos | Cap Aluminum 390uF 400V 20% (30 X 35mm) 0.28 Ohm 1970mA 10000 hr 85°C Bulk |
| GS8320E36GT-133V | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 36M-Bit 1M x 36 8.5ns/4ns 100-Pin TQFP Tray |
| PV34F203A01B00 | Murata Electronics | Trimmer Resistors - Through Hole 20k ohm |
| NTR50D3163CTRF | nic components | Res Thin Film 2512 316K Ohm 0.5% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B43601B9477M60 | tdk epcos | Cap Aluminum 470uF 400V 20% (30 X 40mm) 10mm 0.23 Ohm 2380mA 10000 hr 85°C Bulk |
| C0402C152J3GAC | Kemet | Multilayer Ceramic Capacitors MLCC - SMD/SMT |
| GS8320E36GT-166V | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 36M-Bit 1M x 36 7ns/3.5ns 100-Pin TQFP Tray |
| C320C123K5R5CA | Kemet | Multilayer Ceramic Capacitors MLCC - Leaded .012UF 50.0V |
| B43601B9477M62 | tdk epcos | Cap Aluminum 470uF 400V 20% (30 X 40mm) 0.23 Ohm 2380mA 10000 hr 85°C Bulk |
| NTR50D3163DTRF | nic components | Res Thin Film 2512 316K Ohm 0.5% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 291-110K/AP | Xicon | Carbon Film Resistors - Through Hole USE 291-110K/AP-RC |
| B43601B9477M67 | tdk epcos | Cap Aluminum 470uF 400V 20% (30 X 40mm) 10mm 0.23 Ohm 2380mA 10000 hr 85°C Bulk |
| GS8320E36GT-225IV | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 36M-Bit 1M x 36 6ns/3ns 100-Pin TQFP Tray |
| RLP012R260FS14MG7 | Vishay / Sfernice | Wirewound Resistors - Through Hole RLP 1 MG7 2U26 1% BA100 e1 |
| NTR50D31R6DTRF | nic components | Res Thin Film 2512 31.6 Ohm 0.5% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| FKP1Y004705A00MB00 | WIMA | フィルムコンデンサ FKP 1 470 pF 6000 VDC 5x14x26.5 PCM22.5 |
| B43601B9477M80 | tdk epcos | Cap Aluminum 470uF 400V 20% (30 X 40mm) 10mm 0.23 Ohm 2380mA 10000 hr 85°C Bulk |
| GS8320E36GT-250IV | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 36M-Bit 1M x 36 5.5ns/3ns 100-Pin TQFP Tray |
| C1206C820J5GAC | Kemet | Multilayer Ceramic Capacitors MLCC - SMD/SMT 82.0PF 50.0V |
| B43601B9567M60 | tdk epcos | Cap Aluminum 560uF 400V 20% (35 X 35mm) 10mm 0.19 Ohm 2440mA 10000 hr 85°C Bulk |
| NTR50D3322CTRF | nic components | Res Thin Film 2512 33.2K Ohm 0.5% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| TNPW1206768KBEBD | Vishay | Thin Film Resistors - SMD 768Kohms .1% 25ppm |
| GS8320Z18GT-133IV | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 36M-Bit 2M x 18 8.5ns/4ns 100-Pin TQFP Tray |
| B43601B9567M62 | tdk epcos | Cap Aluminum 560uF 400V 20% (35 X 35mm) 0.19 Ohm 2440mA 10000 hr 85°C Bulk |
| C1812C150JHGAC7800 | Kemet | Multilayer Ceramic Capacitors MLCC - SMD/SMT 15.0PF 3000V |
| NTR50D3403DTRF | nic components | Res Thin Film 2512 340K Ohm 0.5% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B43601B9567M67 | tdk epcos | Cap Aluminum 560uF 400V 20% (35 X 35mm) 10mm 0.19 Ohm 2440mA 10000 hr 85°C Bulk |
| AIMC-0402-6N8S-T | ABRACON | Fixed Inductors 6.8nH, 300mA Tol.=+/-.3nH |
| GS8320Z18GT-150IV | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 36M-Bit 2M x 18 7.5ns/3.8ns 100-Pin TQFP Tray |
| B43601B9567M80 | tdk epcos | Cap Aluminum 560uF 400V 20% (35 X 35mm) Snap-In 10mm 0.19 Ohm 2440mA 10000h 85°C Bulk |
| B41043A5396M8 | EPCOS | アルミニウム電解キャパシタ - リード線付き 39 F 25V 5x11 SINGLE ENDED |
| NTR50D3482DTRF | nic components | Res Thin Film 2512 34.8K Ohm 0.5% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| FP0002150KJ9251B8 | Vishay / Dale | Metal Film Resistors - Through Hole 2watts 150Kohms 5% |
| B43601B9687M80 | tdk epcos | Cap Aluminum 680uF 400V 20% (35 X 40mm) 10mm 0.16 Ohm 2770mA 10000 hr 85°C Bulk |
| GS8320Z18GT-166V | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 36M-Bit 2M x 18 7ns/3.5ns 100-Pin TQFP Tray |
| DCP4H05350SM1KMY00 | WIMA | Film Capacitors DC-LINK MKP 4 35.0 uF 450 VDC 24x45.5x41.5 SN |
| NTR50D34R8DTRF | nic components | Res Thin Film 2512 34.8 Ohm 0.5% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B43601B9687M82 | tdk epcos | Cap Aluminum 680uF 400V 20% (35 X 40mm) 0.16 Ohm 2770mA 10000 hr 85°C Bulk |
| 830200-1 | TE Connectivity / AMP | Standard Circular Connector LGH RECEPTACLE |
| GS8320Z18GT-200IV | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 36M-Bit 2M x 18 6.5ns/3ns 100-Pin TQFP Tray |
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