规格参数 > 第6406页
CDR05BP472BJWPM 现货价格参数; 72V273L10PFI 现货价格参数; 853156-1 现货价格参数; CDR06BX474AKWMM 现货价格参数; 72V275L10TF 现货价格参数; LVR05R1470FE73 现货价格参数; CDR11BG1R8ABNR 现货价格参数; 72V291L15TFI 现货价格参数; 853156-3 现货价格参数; LVR05R1470JE12 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| CDR05BP472BJWPM | avx | Cap Ceramic 0.0047uF 100V C0G 5% SMD 1825 (0.1%FR) 125°C Plastic T/R |
| 72V273L10PFI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 16K x 18/32K x 9 80-Pin TQFP |
| 853156-1 | te connectivity / amp | BLADE, TOP STRIP |
| CDR06BX474AKWMM | avx | Cap Ceramic 0.47uF 50V X7R 10% SMD 2225 (1%FR) 125°C Plastic T/R |
| 72V275L10TF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 32K x 18 64-Pin STQFP Tray |
| LVR05R1470FE73 | vishay / dale | Res Metal Strip 0.147 Ohm 1% 5W Molded AXL Thru-Hole T/R |
| CDR11BG1R8ABNR | avx | Cap Ceramic 1.8pF 50V +90±20ppm/C 0.1pF SMD (0.01%FR) 125°C Waffle Pack |
| 72V291L15TFI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 128K x 9 64-Pin STQFP |
| 853156-3 | te connectivity / amp | BLADE, TOP STRIP |
| LVR05R1470JE12 | vishay / dale | Res Metal Strip 0.147 Ohm 5% 5W Molded AXL Thru-Hole Bulk |
| CDR11BG200AJNM | avx | Cap Ceramic 20pF 50V +90±20ppm/C 5% SMD (1%FR) 125°C Waffle Pack |
| 72V36110L6BBG8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 128K x 36 144-Pin BGA T/R |
| CDR11BG6R2ABMP | avx | Cap Ceramic 6.2pF 50V +90±20ppm/C 0.1pF SMD (0.1%FR) 125°C Waffle Pack |
| 72V3680L7-5BB | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 16K x 36 144-Pin BGA |
| LVR05R1470JE73 | vishay / dale | Res Metal Strip 0.147 Ohm 5% 5W Molded AXL Thru-Hole T/R |
| 8531J82ZBE22 | c&k components | Switch Push Button OFF Mom SPST Square Button 20VAC 20VDC 0.4VA Momentary Contact Solder Lug Panel Mount |
| CDR11BG6R8ABMS | avx | Cap Ceramic 6.8pF 50V +90±20ppm/C 0.1pF SMD (0.001%FR) 125°C Waffle Pack |
| 72V70190PFG8 | integrated device technology (idt) | Switch Fabric 256 x 256 3.3V 64-Pin TQFP T/R |
| LVR05R1500FB12 | vishay / dale | Res Metal Strip 0.15 Ohm 1% 5W Molded AXL Thru-Hole Bulk |
| CDR11BP300AJNR | avx | Cap Ceramic 30pF 50V C0G 5% SMD (0.01%FR) 125°C Waffle Pack |
| 853210-1 | te connectivity / amp | SPACER, TUBULAR |
| 732DM-6 | teledyne relays | Electromechanical Relay DPDT 1ADC/0.25AAC 6VDC 200Ohm Through Hole |
| 7343-2SURC/S530-A4 | everlight electronics | LED Uni-Color Red 632nm 2-Pin T-1 3/4 T/R |
| CDR12BG0R8ABWP | avx | Cap Ceramic 0.8pF 50V +90±20ppm/C 0.1pF SMD (0.1%FR) 125°C Waffle Pack |
| LVR05R1500FE70 | vishay / dale | Res Metal Strip 0.15 Ohm 1% 5W Molded AXL Thru-Hole T/R |
| 853224-4 | te connectivity / amp | ANVIL, COMBINATION |
| 7343-2UYC/S400-A6 | everlight electronics | LED Uni-Color Yellow 591nm 2-Pin T-1 3/4 T/R |
| CDR12BG0R8ABWR | avx | Cap Ceramic 0.8pF 50V +90±20ppm/C 0.1pF SMD (0.01%FR) 125°C Waffle Pack |
| 73725-0110BLF | fci sa | Conn USB RCP 4 POS 2mm Solder RA Thru-Hole 4 Terminal 1 Port |
| LVR05R1500JB12 | vishay / dale | Res Metal Strip 0.15 Ohm 5% 5W Molded AXL Thru-Hole Bulk |
| 853323-1 | te connectivity / amp | KNOB, HAND MODIFIED |
| CDR12BG101AJURM250 | avx | Cap Ceramic 100pF 50V +90±20ppm/C 5% SMD (0.01%FR) 125°C Plastic T/R |
| 74192-090 | fci sa | Conn Board to Board HDR 90 POS 1.27mm Solder RA Thru-Hole |
| CDR12BG150AJUP | avx | Cap Ceramic 15pF 50V +90±20ppm/C 5% SMD (0.1%FR) 125°C Waffle Pack |
| LVR05R1600FE12 | vishay / dale | Res Metal Strip 0.16 Ohm 1% 5W Molded AXL Thru-Hole Bulk |
| 853332-1 | te connectivity / amp | CUTOFF PUNCH |
| 742C043330JP | cts components | Res Thick Film Array 33 Ohm 5% 1/8W ±200ppm/°C ISOL Molded 4-Pin 0606(2 X 0603) Concave SMD Paper T/R |
| CDR12BG220AFWR | avx | Cap Ceramic 22pF 50V +90±20ppm/C 1% SMD (0.01%FR) 125°C Waffle Pack |
| LVR05R1600FE73 | vishay / dale | Res Metal Strip 0.16 Ohm 1% 5W Molded AXL Thru-Hole T/R |
| 853478-1 | te connectivity / amp | DOCUMENTATION PACKAGE |
| 742C043563JP | cts components | Res Thick Film Array 56K Ohm 5% 1/8W ±200ppm/°C ISOL Molded 4-Pin 0606(2 X 0603) Concave SMD Paper T/R |
| CDR12BG330AJUSM | avx | Cap Ceramic 33pF 50V +90±20ppm/C 5% SMD (0.001%FR) 125°C Plastic T/R |
| 742C043822JP | cts components | Res Thick Film Array 8.2K Ohm 5% 1/8W ±200ppm/°C ISOL Molded 4-Pin 0606(2 X 0603) Concave SMD Paper T/R |
| LVR05R1600FS70 | vishay / dale | Res Metal Strip 0.16 Ohm 1% 5W Molded AXL Thru-Hole T/R |
| CDR12BG390AKSMM | avx | Cap Ceramic 39pF 50V +90±20ppm/C 10% SMD (1%FR) 125°C Plastic T/R |
| 853491-2 | te connectivity / amp | CRIMPER, INSULATION |
| 742C083473JP | cts components | Res Thick Film Array 47K Ohm 5% 1/4W ±200ppm/°C ISOL Molded 8-Pin 1206(4 X 0603) Concave SMD Paper T/R |
| CDR12BG3R6ACWS | avx | Cap Ceramic 3.6pF 50V +90±20ppm/C 0.25pF SMD (0.001%FR) 125°C Waffle Pack |
| LVR05R1600JE12 | vishay / dale | Res Metal Strip 0.16 Ohm 5% 5W Molded AXL Thru-Hole Bulk |
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