规格参数 > 第6409页
CDR14BG101EKSR 现货价格参数; 854176-1 现货价格参数; LVR05R2500FS73 现货价格参数; 74CBTK16245DGGRE4 现货价格参数; CDR14BG200EFUM 现货价格参数; 74CBTLV3857DGVRE4 现货价格参数; LVR05R2500JE12 现货价格参数; 854179-1 现货价格参数; CDR14BG221CFUM 现货价格参数; 74FCT162374ETPAG 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| CDR14BG101EKSR | avx | Cap Ceramic 100pF 500V +90±20ppm/C 10% SMD (0.01%FR) 125°C Waffle Pack |
| 854176-1 | te connectivity / amp | Connector Accessories Interchangeable Head |
| LVR05R2500FS73 | vishay / dale | Res Metal Strip 0.25 Ohm 1% 5W Molded AXL Thru-Hole T/R |
| 74CBTK16245DGGRE4 | texas instruments | Bus Switch 2-Element CMOS 16-IN 48-Pin TSSOP T/R |
| CDR14BG200EFUM | avx | Cap Ceramic 20pF 500V +90±20ppm/C 1% SMD (1%FR) 125°C Waffle Pack |
| 74CBTLV3857DGVRE4 | texas instruments | Bus Switch 1-Element CMOS 10-IN 24-Pin TVSOP T/R |
| LVR05R2500JE12 | vishay / dale | Res Metal Strip 0.25 Ohm 5% 5W Molded AXL Thru-Hole Bulk |
| 854179-1 | te connectivity / amp | HOUSING INSERT |
| CDR14BG221CFUM | avx | Cap Ceramic 220pF 200V +90±20ppm/C 1% SMD (1%FR) 125°C Waffle Pack |
| 74FCT162374ETPAG | integrated device technology (idt) | Flip Flop D-Type Bus Interface Pos-Edge 3-ST 2-Element 48-Pin TSSOP |
| CDR14BG360EJSS | avx | Cap Ceramic 36pF 500V +90±20ppm/C 5% SMD (0.001%FR) 125°C Waffle Pack |
| 854234-3 | te connectivity / amp | HD TL TAZ PGA 25 POS |
| LVR05R2700FB12 | vishay / dale | Res Metal Strip 0.27 Ohm 1% 5W Molded AXL Thru-Hole Bulk |
| 74FCT16245ETPAG8 | integrated device technology (idt) | Bus XCVR Dual 16-CH 3-ST 48-Pin TSSOP T/R |
| CDR14BG3R0EBSM | avx | Cap Ceramic 3pF 500V +90±20ppm/C 0.1pF SMD (1%FR) 125°C Waffle Pack |
| 74FCT162827CTPVG8 | integrated device technology (idt) | Buffer/Line Driver 20-CH Non-Inverting 3-ST CMOS 56-Pin SSOP T/R |
| CDR14BG3R6EBUMM | avx | Cap Ceramic 3.6pF 500V +90±20ppm/C 0.1pF SMD (1%FR) 125°C Plastic T/R |
| 854246-1 | te connectivity / amp | MOUNT, ANGLE |
| XTD-10XL | Apex Tool Group (Formerly Cooper Tools) | Screwdrivers, Nut Drivers & Socket Drivers TORX HANDLE #10 |
| CDR14BG430EFUM | avx | Cap Ceramic 43pF 500V +90±20ppm/C 1% SMD (1%FR) 125°C Waffle Pack |
| 74FCT240CTPYG8 | integrated device technology (idt) | Buffer/Line Driver 8-CH Inverting 3-ST CMOS 20-Pin SSOP T/R |
| CDR14BG471CJUPM | avx | Cap Ceramic 470pF 200V +90±20ppm/C 5% SMD (0.1%FR) 125°C Plastic T/R |
| 854260-2 | te connectivity / amp | DOCUMENTATION PACKAGE |
| 74FCT244ATPGG8 | integrated device technology (idt) | Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin TSSOP T/R |
| CDR14BG5R6EDUP | avx | Cap Ceramic 5.6pF 500V +90±20ppm/C 0.5pF SMD (0.1%FR) 125°C Waffle Pack |
| 74HC11N,652 | nxp semiconductors | AND Gate 3-Element 3-IN CMOS 14-Pin PDIP Bulk |
| 854295-1 | te connectivity / amp | CAM, TRANSFER |
| CDR14BG680EJUR | avx | Cap Ceramic 68pF 500V +90±20ppm/C 5% SMD (0.01%FR) 125°C Waffle Pack |
| 74LCX11MX | fairchild semiconductor | AND Gate 3-Element 3-IN CMOS 14-Pin SOIC N T/R |
| CDR14BG6R8ECUM | avx | Cap Ceramic 6.8pF 500V +90±20ppm/C 0.25pF SMD (1%FR) 125°C Waffle Pack |
| 854317-1 | te connectivity / amp | BLOCK, PIVOT |
| 74LCX373SJX | fairchild semiconductor | Latch Transparent 3-ST 8-CH D-Type 20-Pin SOP-II T/R |
| CDR14BP0R2EBSMM | avx | Cap Ceramic 0.2pF 500V C0G 0.1pF SMD (1%FR) 125°C Plastic T/R |
| 854332-1 | te connectivity / amp | SHAFT, VERTICAL |
| CDR14BP0R3EBUM | avx | Cap Ceramic 0.3pF 500V C0G 0.1pF SMD (1%FR) 125°C Waffle Pack |
| 74LCX573MTCX | fairchild semiconductor | Latch Transparent 3-ST 8-CH D-Type 20-Pin TSSOP T/R |
| LVR05R2700FE12 | vishay / dale | Res Metal Strip 0.27 Ohm 1% 5W Molded AXL Thru-Hole Bulk |
| CDR14BP132AFUP | avx | Cap Ceramic 0.0013uF 50V C0G 1% SMD (0.1%FR) 125°C Waffle Pack |
| 74LCXH16245GX | fairchild semiconductor | Bus XCVR Dual 16-CH 3-ST 54-Pin FBGA T/R |
| 854340-1 | te connectivity / amp | GRIPPER, LEFT |
| CDR14BP180EJUM | avx | Cap Ceramic 18pF 500V C0G 5% SMD (1%FR) 125°C Waffle Pack |
| 74LCXP16245MEAX | fairchild semiconductor | Bus XCVR Dual 16-CH 3-ST 48-Pin SSOP W T/R |
| LVR05R2700FE73 | vishay / dale | Res Metal Strip 0.27 Ohm 1% 5W Molded AXL Thru-Hole T/R |
| CDR14BP200EGUPM250 | avx | Cap Ceramic 20pF 500V C0G 2% SMD (0.1%FR) 125°C Plastic T/R |
| 854358-1 | te connectivity / amp | ADAPTER |
| 74LVC273PW,118 | nxp semiconductors | Flip Flop D-Type Bus Interface Pos-Edge 1-Element 20-Pin TSSOP T/R |
| LVR05R2700JE73 | vishay / dale | Res Metal Strip 0.27 Ohm 5% 5W Molded AXL Thru-Hole T/R |
| CDR14BP222AFURM | avx | Cap Ceramic 0.0022uF 50V C0G 1% SMD (0.01%FR) 125°C Plastic T/R |
| 74LVCH16646APAG | integrated device technology (idt) | Bus XCVR Dual 16-CH 3-ST 56-Pin TSSOP Tube |
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