规格参数 > 第5927页
1-1499117-5 现货价格参数; MTSW-107-10-T-D-640 现货价格参数; WSC012R1050JEA 现货价格参数; GS8322Z72GC-225I 现货价格参数; MTSW-107-11-T-S-740 现货价格参数; SP-1113 现货价格参数; MTSW-107-22-S-D-380 现货价格参数; GS8322ZV18B-250 现货价格参数; WSC012R1100DTB 现货价格参数; MTSW-108-06-T-S-190 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 1-1499117-5 | te connectivity / amp | Cable Assembly UTP 4.572m 24AWG 8 POS Modular to 8 POS Modular PL-PL Crimp-Crimp Poly Bag |
| MTSW-107-10-T-D-640 | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
| WSC012R1050JEA | vishay / dale | Res Wirewound 2012 0.105 Ohm 5% 1/2W ±90ppm/°C Molded SMD SMD Embossed Plastic T/R |
| GS8322Z72GC-225I | gsi technology | SRAM Chip Sync Octal 2.5V/3.3V 36M-Bit 512K x 72-Bit 7ns/3ns 209-Pin FBGA Tray |
| MTSW-107-11-T-S-740 | samtec inc. | Conn Unshrouded Header HDR 7 POS 2.54mm Solder ST Thru-Hole |
| SP-1113 | Plato | Soldering Irons CERAMIC STANDOFF SP-100/200300/400 |
| MTSW-107-22-S-D-380 | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
| GS8322ZV18B-250 | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 6.5ns/2.5ns 119-Pin FBGA Tray |
| WSC012R1100DTB | vishay / dale | Res Wirewound 2012 0.11 Ohm 0.5% 1/2W ±90ppm/°C Molded SMD SMD T/R |
| MTSW-108-06-T-S-190 | samtec inc. | Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole |
| GS8322ZV36GE-250I | gsi technology | SRAM Chip Sync Quad 1.8V 36M-Bit 1M x 36 6.5ns/2.5ns 165-Pin FBGA Tray |
| SS-30-J-1.3-G D/C | IDI | Contact Probes HEADLESS RADIUS |
| MTSW-108-08-T-S-285 | samtec inc. | Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole |
| GS8342S36GE-200 | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 1M x 36 0.45ns 165-Pin FBGA Tray |
| WSC012R1100FEA | vishay / dale | Res Wirewound 2012 0.11 Ohm 1% 1/2W ±90ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 1-1499379-0 | te connectivity / amp | CA/ASSY,M/PLUG,GRAY,568A,10 |
| MTSW-108-09-T-S-120-RA | samtec inc. | Conn Unshrouded Header HDR 8 POS 2.54mm Solder RA Thru-Hole |
| GS84036AGB-150I | gsi technology | SRAM Chip Sync Quad 3.3V 4M-Bit 128K x 36 10ns/3.8ns 119-Pin FBGA Tray |
| WSC012R1100FEK | vishay / dale | Res Wirewound 2012 0.11 Ohm 1% 1/2W ±90ppm/°C Molded SMD SMD Bulk |
| MTSW-108-09-T-S-220 | samtec inc. | Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole |
| GS840F18AB-7.5 | gsi technology | SRAM Chip Sync Dual 3.3V 4M-Bit 256K x 18 7.5ns 119-Pin FBGA Tray |
| 1-1532007-5 | te connectivity / amp | 094-0105-5005=MCK-C2-L-9P6C2- |
| MTSW-108-10-T-D-440 | samtec inc. | Conn Unshrouded Header HDR 16 POS 2.54mm Solder ST Thru-Hole |
| GS840FH18AGT-7.5I | gsi technology | SRAM Chip Sync Dual 3.3V 4M-Bit 256K x 18 7.5ns 100-Pin TQFP Tray |
| WSC012R1100FTA | vishay / dale | Res Wirewound 2012 0.11 Ohm 1% 1/2W ±90ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 1-1532024-6 | te connectivity / amp | 095-9085-2132=MCDM1-B-21P6A7- |
| MTSW-108-11-G-D-380 | samtec inc. | Conn Unshrouded Header HDR 16 POS 2.54mm Solder ST Thru-Hole |
| GS840H36AGB-150I | gsi technology | SRAM Chip Sync Quad 3.3V 4.5M-Bit 128K x 36 10ns/3.8ns 119-Pin FBGA Tray |
| WSC012R1100JEA | vishay / dale | Res Wirewound 2012 0.11 Ohm 5% 1/2W ±90ppm/°C Molded SMD SMD Embossed Plastic T/R |
| MTSW-108-11-T-S-680 | samtec inc. | Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole |
| 1-1546018-3 | te connectivity / amp | Conn Terminal Block F 13 POS 5mm Screw ST Cable Mount 12A/Contact |
| GS8642ZV18B-300I | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 4M x 18 5.5ns/2.3ns 119-Pin FBGA Tray |
| MTSW-108-12-T-S-440 | samtec inc. | Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole |
| GS8644V18GB-225 | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 72M-Bit 4M x 18 6.5ns/3ns 119-Pin FBGA Tray |
| WSC012R1100JEB | vishay / dale | Res Wirewound 2012 0.11 Ohm 5% 1/2W ±90ppm/°C Molded SMD SMD T/R |
| 1-1546018-8 | te connectivity / amp | Conn Terminal Block F 18 POS 5mm Screw Straight/Right Angle Cable Mount 12A/Contact |
| MTSW-108-22-L-S-330-RA | samtec inc. | Conn Unshrouded Header HDR 8 POS 2.54mm Solder RA Thru-Hole |
| GS8644Z18GE-166 | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 72M-Bit 4M x 18 7ns/3.5ns 165-Pin FBGA Tray |
| MTSW-108-23-T-S-238 | samtec inc. | Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole |
| 1-1546019-8 | te connectivity / amp | Conn Unshrouded Header HDR 18 POS 5mm Solder ST Thru-Hole |
| WSC012R1120FEA | vishay / dale | Res Wirewound 2012 0.112 Ohm 1% 1/2W ±90ppm/°C Molded SMD SMD Embossed Plastic T/R |
| GS8662S09E-250I | gsi technology | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| MTSW-108-24-S-S-230 | samtec inc. | Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole |
| 17716 | Simpson Electric Company | Analog Panel Meters 2153 0-50 ACMA 3. |
| 1-1546073-2 | te connectivity / amp | Conn Terminal Block 12 POS 5.08mm Solder RA Thru-Hole |
| WSC012R1120JEK | vishay / dale | Res Wirewound 2012 0.112 Ohm 5% 1/2W ±90ppm/°C Molded SMD SMD Bulk |
| MTSW-109-08-S-D-285-LL | samtec inc. | Conn Unshrouded Header HDR 18 POS 2.54mm Solder ST Thru-Hole |
| TFP-CNP1 | OK International | Soldering Irons Tweezer Cartridge Conical 0.4mm(.015) |
| WSC012R1130FEB | vishay / dale | Res Wirewound 2012 0.113 Ohm 1% 1/2W ±90ppm/°C Molded SMD SMD T/R |
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