规格参数 > 第5926页
MTSW-106-06-G-S-110 现货价格参数; GRM3195C2A471FD01D 现货价格参数; WSC0124R990FBA 现货价格参数; MTSW-106-08-T-S-140-RA 现货价格参数; 1-147734-7 现货价格参数; GS71108AU-8 现货价格参数; WSC0124R990FEK 现货价格参数; MTSW-106-10-G-S-565 现货价格参数; GS72116AGU-7I 现货价格参数; 1-1479152-1 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| MTSW-106-06-G-S-110 | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole |
| GRM3195C2A471FD01D | murata electronics | Cap Ceramic 470pF 100V C0G 1% SMD 1206 125°C Paper T/R |
| WSC0124R990FBA | vishay / dale | Res Wirewound 2012 4.99 Ohm 1% 1/2W ±50ppm/°C Molded SMD SMD Bulk |
| MTSW-106-08-T-S-140-RA | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder RA Thru-Hole |
| 1-147734-7 | te connectivity / amp | Conn Socket Strip RCP 36 POS 2.54mm Solder RA SMD |
| GS71108AU-8 | gsi technology | SRAM Chip Async Single 3.3V 1M-Bit 128K x 8 8ns 48-Pin FBGA Tray |
| WSC0124R990FEK | vishay / dale | Res Wirewound 2012 4.99 Ohm 1% 1/2W ±50ppm/°C Molded SMD SMD Bulk |
| MTSW-106-10-G-S-565 | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole |
| GS72116AGU-7I | gsi technology | SRAM Chip Async Single 3.3V 2M-Bit 128K x 16 7ns 48-Pin FBGA Tray |
| 1-1479152-1 | te connectivity / amp | KIT,FACEPLATE,WALL PHONE,IVORY |
| MTSW-106-12-S-D-755 | samtec inc. | Conn Unshrouded Header HDR 12 POS 2.54mm Solder ST Thru-Hole |
| GS74116AGX-10I | gsi technology | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 10ns 48-Pin FBGA Tray |
| WSC0124R990JEB | vishay / dale | Res Wirewound 2012 4.99 Ohm 5% 1/2W ±50ppm/°C Molded SMD SMD T/R |
| MTSW-106-12-S-S-825 | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole |
| 1-1479268-1 | te connectivity / amp | LABEL COVER, ELEC IVORY |
| GS78132AGB-15I | gsi technology | SRAM Chip Async Quad 3.3V 8M-Bit 256K x 32 15ns 119-Pin FBGA Tray |
| MTSW-106-13-S-S-900 | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole |
| WSC012R1000JBA | vishay / dale | Res Wirewound 2012 0.1 Ohm 5% 1/2W ±90ppm/°C Molded SMD SMD Bulk |
| GS8160E18BGT-250 | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 18M-Bit 1M x 18 5.5ns/2.5ns 100-Pin TQFP Tray |
| 1-1490019-5 | te connectivity / amp | CRIMPER, WIRE (.090 F ) |
| MTSW-106-22-G-S-130-RA | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder RA Thru-Hole |
| GS8162Z36BD-250 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 18M-Bit 512K x 36 5.5ns/2.5ns 165-Pin FBGA Tray |
| WSC012R1000JEA | vishay / dale | Res Wirewound 2012 0.1 Ohm 5% 1/2W ±90ppm/°C Molded SMD SMD Embossed Plastic T/R |
| MTSW-106-23-G-D-235 | samtec inc. | Conn Unshrouded Header HDR 12 POS 2.54mm Solder ST Thru-Hole |
| SX-2-K-10-G D/C | IDI | Contact Probes HD 45 DEG 4SIDE CHSL IMPRV PT ACC GLD |
| GS8170LW36AGC-250I | gsi technology | SRAM Chip Sync Quad 1.8V 18M-Bit 512K x 36 2.1ns 209-Pin FBGA Tray |
| MTSW-106-24-S-S-150-RA | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder RA Thru-Hole |
| WSC012R1000JTB | vishay / dale | Res Wirewound 2012 0.1 Ohm 5% 1/2W ±90ppm/°C Molded SMD SMD T/R |
| GS8170LW36AGC-300 | gsi technology | SRAM Chip Sync Quad 1.8V 18M-Bit 512K x 36 1.8ns 209-Pin FBGA Tray |
| 06215 | Simpson Electric Company | Analog Panel Meters 1227 0-20 DCMA 2. |
| MTSW-107-07-G-S-130-RA | samtec inc. | Conn Unshrouded Header HDR 7 POS 2.54mm Solder RA Thru-Hole |
| GS8320V36GT-250I | gsi technology | SRAM Chip Sync Quad 1.8V 36M-Bit 1M x 36 6.5ns/2.5ns 100-Pin TQFP Tray |
| WSC012R1010FEB | vishay / dale | Res Wirewound 2012 0.101 Ohm 1% 1/2W ±90ppm/°C Molded SMD SMD T/R |
| MTSW-107-07-S-D-210 | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
| 1-1499114-4 | te connectivity / amp | Cable Assembly UTP 4.267m 24AWG 8 POS Modular to 8 POS Modular PL-PL Crimp-Crimp Poly Bag |
| GS8320V36T-250 | gsi technology | SRAM Chip Sync Quad 1.8V 36M-Bit 1M x 36 6.5ns/2.5ns 100-Pin TQFP Tray |
| MTSW-107-08-T-D-080-RA | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder RA Thru-Hole |
| WSC012R1010FEK | vishay / dale | Res Wirewound 2012 0.101 Ohm 1% 1/2W ±90ppm/°C Molded SMD SMD Bulk |
| GS8320ZV18GT-200I | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 2M x 18 7.5ns/3ns 100-Pin TQFP Tray |
| IPA057N08N3 G | Infineon Technologies | MOSFET N-KANAL POWER MOS |
| MTSW-107-08-T-S-325 | samtec inc. | Conn Unshrouded Header HDR 7 POS 2.54mm Solder ST Thru-Hole |
| GS8321EV18GE-150I | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 7.5ns/3.8ns 165-Pin FBGA Tray |
| WSC012R1020JEK | vishay / dale | Res Wirewound 2012 0.102 Ohm 5% 1/2W ±90ppm/°C Molded SMD SMD Bulk |
| GS8321ZV32GE-133 | gsi technology | SRAM Chip Sync Quad 1.8V 32M-Bit 1M x 32 8.5ns/4ns 165-Pin FBGA Tray |
| MTSW-107-09-G-D-380 | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
| 5674B | Pomona Electronics | Digital Multimeters DELUXE ELECTRONIC |
| GS832236GB-225 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 36M-Bit 1M x 36 7ns/2.7ns 119-Pin FBGA Tray |
| WSC012R1050FEB | vishay / dale | Res Wirewound 2012 0.105 Ohm 1% 1/2W ±90ppm/°C Molded SMD SMD T/R |
| MTSW-107-09-T-S-100-RE | samtec inc. | Conn Unshrouded Header HDR 7 POS 2.54mm Solder RA Thru-Hole |
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