规格参数 > 第13639页
179843-1 现货价格参数; 70V3579S5BCGI 现货价格参数; CW02M9K100KE70 现货价格参数; 79-400348-10I 现货价格参数; SN74S51DR 现货价格参数; 70V3589S166BF 现货价格参数; PCA9673D 现货价格参数; CW02M9R100JE12 现货价格参数; 70V657S15DR 现货价格参数; 79-400348-10K 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 179843-1 | te connectivity / amp | Conn Power M 12 POS 3.96mm Solder ST Thru-Hole 12 Terminal 1 Port |
| 70V3579S5BCGI | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 1.125M-Bit 32K x 36 5ns 256-Pin CABGA |
| CW02M9K100KE70 | vishay / dale | Res Wirewound 9.1K Ohm 10% 3W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 79-400348-10I | amphenol | MINIATURIZED STANDARD CONNECTORS |
| SN74S51DR | Texas Instruments | Logic Gates Dual 2-wide 2-input AND-OR-Invert Gates |
| 70V3589S166BF | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 2.25M-Bit 64K x 36 12ns/3.6ns 208-Pin CABGA |
| PCA9673D | NXP Semiconductors | Interface - I/O Expanders 16BIT I2C FM+ QBGPIO INT-RS PU |
| CW02M9R100JE12 | vishay / dale | Res Wirewound 9.1 Ohm 5% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 70V657S15DR | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 1.125M-Bit 32K x 36 15ns 208-Pin PQFP |
| 79-400348-10K | amphenol | MINIATURIZED STANDARD CONNECTORS |
| 180352-3 | te connectivity / amp | Quick Disconnect Terminal 10-11AWG Tab 30.1mm 7.4mm Strip |
| 70V658S10BCG | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 2.25M-Bit 64K x 36 10ns 256-Pin CABGA |
| CW02MR1000JS70 | vishay / dale | Res Wirewound 0.1 Ohm 5% 3W ±90ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 79-400348-10P | amphenol | MINIATURIZED STANDARD CONNECTORS |
| 180397-2 | te connectivity / amp | Quick Disconnect Terminal 13-17AWG RCP 11.4mm Tin Strip |
| 70V7339S133BFI | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 9M-Bit 512K x 18 15ns/4.2ns 208-Pin CABGA |
| CW02MR1250JS73 | vishay / dale | Res Wirewound 0.125 Ohm 5% 3W ±90ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 18121A392FAT2A | avx | Cap Ceramic 0.0039uF 100V C0G 1% SMD 1812 125°C Embossed T/R |
| 79-400349-19J | amphenol | MINIATURIZED STANDARD CONNECTORS |
| 7142LA55L48B | integrated device technology (idt) | SRAM Chip Async Dual 5V 16K-Bit 2K x 8 55ns 48-Pin LCC |
| 18121A392JAT2A | avx | Cap Ceramic 0.0039uF 100V C0G 5% SMD 1812 125°C Embossed T/R |
| CW02MR1500KE12 | vishay / dale | Res Wirewound 0.15 Ohm 10% 3W ±90ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 71V424S10YG8 | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 512K x 8 10ns 36-Pin SOJ T/R |
| 79-400349-19L | amphenol | MINIATURIZED STANDARD CONNECTORS |
| 18123A153JAT2A | avx | Cap Ceramic 0.015uF 25V C0G 5% SMD 1812 125°C Embossed T/R |
| 71V632S5PFG | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 2M-Bit 64K x 32 5ns 100-Pin TQFP Tray |
| CW02MR2400KE12 | vishay / dale | Res Wirewound 0.24 Ohm 10% 3W ±90ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 18125A153FAT2A | avx | Cap Ceramic 0.015uF 50V C0G 1% SMD 1812 125°C Embossed T/R |
| 79-400349-19S | amphenol | MINIATURIZED STANDARD CONNECTORS |
| 7202LA25TP | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 1K x 9 28-Pin PTDIP Tube/Tray |
| 18127A202KAT2A | avx | Cap Ceramic 0.002uF 500V C0G 10% SMD 1812 125°C T/R |
| CW02MR4400JE12 | vishay / dale | Res Wirewound 0.44 Ohm 5% 3W ±90ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 7206L25TPI | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 16K x 9 28-Pin PDIP |
| 79-536365-26P | amphenol | MINIATURIZED STANDARD CONNECTORS |
| 18127C563KAT2A | avx | Cap Ceramic 0.056uF 500V X7R 10% SMD 1812 125°C T/R |
| CW02MR5600KR50 | vishay / dale | Res Wirewound 0.56 Ohm 10% 3W ±90ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 7285L15PA | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 8K x 9 x 2 56-Pin TSSOP Tube/Tray |
| 182341 | te connectivity / amp | HDR PLUG ASSY & JKSCR RESTR |
| 8-1589472-6 | te connectivity / amp | Cable Assembly Strand 1.016m 30AWG 65 POS Rectangular PL Crimp |
| CW02MR6190JE70 | vishay / dale | Res Wirewound 0.619 Ohm 5% 3W ±90ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 72V01L15J | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 512 x 9 32-Pin PLCC Tube/Tray |
| 18251A123JAT4A | avx | Cap Ceramic 0.012uF 100V C0G 5% SMD 1825 125°C Embossed T/R |
| 8-435626-6 | te connectivity / amp | Switch DIP ON OFF SPST 2 Recessed Rocker PC Pins 2.54mm Thru-Hole Tube |
| 18255A562JAT2A | avx | Cap Ceramic 0.0056uF 50V C0G 5% SMD 1825 125°C Embossed T/R |
| 72V06L15JG | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 16K x 9 32-Pin PLCC Tube/Tray |
| CW1211R00KE70 | vishay / dale | Res Wirewound 11 Ohm 10% 1/2W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 72V3660L7-5PF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 4K x 36 128-Pin TQFP |
| 18255C334MAT2A | avx | Cap Ceramic 0.33uF 50V X7R 20% SMD 1825 125°C Embossed T/R |
| 8-534206-0 | te connectivity / amp | Conn Socket Strip SKT 60 POS 2.54mm Solder ST Thru-Hole Gang of Tubes |
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