规格参数 > 第13626页
1241.1625.6 现货价格参数; 7200L15JI 现货价格参数; WSN692746R40FEA 现货价格参数; CW02C2K700KE7014 现货价格参数; 1251381-1 现货价格参数; WSN6927470R0FEA 现货价格参数; 7201LA12J8 现货价格参数; 1255511-1 现货价格参数; CW02C2K800KE70 现货价格参数; WSN692747R50JEA 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 1241.1625.6 | schurter | Switch Tactile N.O. SPST Round Button PC Pins 0.05A 30VAC 42VDC 1000000Cycle 1.8N Thru-Hole |
| 7200L15JI | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 256 x 9 32-Pin PLCC Tube/Tray |
| WSN692746R40FEA | vishay / dale | Res Wirewound 6927 46.4 Ohm 1% 3W ±20ppm/°C Molded SMD SMD Embossed Plastic T/R |
| CW02C2K700KE7014 | vishay / dale | Res Wirewound 2.7K Ohm 10% 2.5W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 1251381-1 | te connectivity / amp | Conn OSP-3.5mm Adapter PL/RCP 0Hz to 22GHz 50Ohm ST Gold |
| WSN6927470R0FEA | vishay / dale | Res Wirewound 6927 470 Ohm 1% 3W ±20ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 7201LA12J8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 512 x 9 32-Pin PLCC T/R |
| 1255511-1 | te connectivity / amp | Conn 3.5mm PL 50Ohm Solder ST Gold |
| CW02C2K800KE70 | vishay / dale | Res Wirewound 2.8K Ohm 10% 2.5W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| WSN692747R50JEA | vishay / dale | Res Wirewound 6927 47.5 Ohm 5% 3W ±20ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 127-50-7 | fox | SMD Crystal Oscillator 50MHz 3.3V 15pF 4-Pin SMD T/R |
| 7201LA25SOI8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 512 x 9 28-Pin SOIC T/R |
| CW02C2K800KE7014 | vishay / dale | Res Wirewound 2.8K Ohm 10% 2.5W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| WSN6927487R0DEK | vishay / dale | Res Wirewound 6927 487 Ohm 0.5% 3W ±20ppm/°C Molded SMD SMD Bulk |
| 127007-0101 | itt interconnect solutions | Conn XLR Connector M 4 POS Solder Cup ST Panel Mount 4 Terminal 1 Port |
| WSN6927487R0FEK | vishay / dale | Res Wirewound 6927 487 Ohm 1% 3W ±20ppm/°C Molded SMD SMD Bulk |
| 7202LA25SOI | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 1K x 9 28-Pin SOIC Tube/Tray |
| CW02C2R370KE12 | vishay / dale | Res Wirewound 2.37 Ohm 10% 2.5W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 1278032-2 | te connectivity / amp | Cable Assembly Twin Zip 2m Duplex MT-RJ to Duplex MT-RJ F-F |
| WSN692748R00FEA | vishay / dale | Res Wirewound 6927 48 Ohm 1% 3W ±20ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 7203L15PI | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 2K x 9 28-Pin PDIP |
| CW02C2R400JE70 | vishay / dale | Res Wirewound 2.4 Ohm 5% 2.5W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| WSN69274R000FEA | vishay / dale | Res Wirewound 6927 4 Ohm 1% 3W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 1278750-2 | te connectivity / amp | Conn MT-RJ Multimode PL ST Cable Mount Bulk |
| 130058 | te connectivity / amp | Ring Tongue Terminal 16-22AWG 21.84mm 11.91mm Tin Loose Piece |
| WSN69274R300FEA | vishay / dale | Res Wirewound 6927 4.3 Ohm 1% 3W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| CW02C2R400KE7014 | vishay / dale | Res Wirewound 2.4 Ohm 10% 2.5W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 7204L15J8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 4K x 9 32-Pin PLCC T/R |
| 131-3701-831 | emerson network power connectivity solutions | Conn SMB RCP 0Hz to 4GHz 50Ohm Solder ST Edge Mount Gold Over Nickel |
| WSN69274R320JEA | vishay / dale | Res Wirewound 6927 4.32 Ohm 5% 3W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| CW02C2R500KE70 | vishay / dale | Res Wirewound 2.5 Ohm 10% 2.5W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 7204L35SO8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 4K x 9 28-Pin SOIC T/R |
| 131-6404-006 | emerson network power connectivity solutions | Conn SMC PL 0Hz to 10GHz 50Ohm Crimp ST Cable Mount Gold |
| WSN69274R920FEA | vishay / dale | Res Wirewound 6927 4.92 Ohm 1% 3W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| CW02C2R700KE1214 | vishay / dale | Res Wirewound 2.7 Ohm 10% 2.5W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| WSN69274R990JEK | vishay / dale | Res Wirewound 6927 4.99 Ohm 5% 3W ±50ppm/°C Molded SMD SMD Bulk |
| 131-1402-116 | emerson network power connectivity solutions | Conn SMB PL 0Hz to 4GHz 50Ohm Crimp RA Cable Mount Gold |
| 7205L20J8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 8K x 9 32-Pin PLCC T/R |
| WSN692750R00JEA | vishay / dale | Res Wirewound 6927 50 Ohm 5% 3W ±20ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 131-6701-201 | emerson network power connectivity solutions | Conn SMC RCP 0Hz to 10GHz 50Ohm Solder ST Thru-Hole Gold |
| CW02C300R0JR50 | vishay / dale | Res Wirewound 300 Ohm 5% 2.5W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 72201L10J8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 256 x 9 32-Pin PLCC T/R |
| 1320142-1 | te connectivity / amp | SEAT TOOL BLINDMATE EXT.HEIGHT |
| WSN6927510R0FEA | vishay / dale | Res Wirewound 6927 510 Ohm 1% 3W ±20ppm/°C Molded SMD SMD Embossed Plastic T/R |
| CW02C310R0JE12 | vishay / dale | Res Wirewound 310 Ohm 5% 2.5W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 1320560-1 | te connectivity / amp | DEPRESSOR, TERMINAL |
| 72201L15JI8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 256 x 9 32-Pin PLCC T/R |
| WSN6927515R0JEA | vishay / dale | Res Wirewound 6927 515 Ohm 5% 3W ±20ppm/°C Molded SMD SMD Embossed Plastic T/R |
| CW02C324R0JE7014 | vishay / dale | Res Wirewound 324 Ohm 5% 2.5W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
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