规格参数 > 第113832页
D55342K07B3T60RWB 现货价格参数; MTMM-111-03-G-D-000 现货价格参数; NCHLGU2D152MELB 现货价格参数; 602GB1762000004 现货价格参数; MTMM-111-03-T-D-000 现货价格参数; D55342K07B402ESWB 现货价格参数; NCHLGU2D561MELB 现货价格参数; 602GB1762000B05 现货价格参数; D55342K07B412ESWB 现货价格参数; RMCF0402FT47K5 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| D55342K07B3T60RWB | vishay / dale | Res Thick Film 1206 3.6M Ohm 2% 1/4W ±100ppm/°C 0.01% Molded SMD SMD Tray |
| MTMM-111-03-G-D-000 | samtec inc. | Conn Unshrouded Header HDR 22 POS 2mm Solder ST Thru-Hole |
| NCHLGU2D152MELB | nichicon | Cap Aluminum 1500uF 200V 20% (30 X 50mm) Snap-In 10mm 3080mA 3000h 105°C Bulk |
| 602GB1762000004 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| MTMM-111-03-T-D-000 | samtec inc. | Conn Unshrouded Header HDR 22 POS 2mm Solder ST Thru-Hole |
| D55342K07B402ESWB | vishay / dale | Res Thick Film 1206 402K Ohm 1% 1/4W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| NCHLGU2D561MELB | nichicon | Cap Aluminum 560uF 200V 20% (30 X 25mm) Snap-In 10mm 1670mA 3000h 105°C Bulk |
| 602GB1762000B05 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| D55342K07B412ESWB | vishay / dale | Res Thick Film 1206 412K Ohm 1% 1/4W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| RMCF0402FT47K5 | stackpole | Res Thick Film 0402 47.5K Ohm 1% 1/16W ±100ppm/°C Molded SMD Paper T/R |
| MTMM-111-04-G-D-250 | samtec inc. | Conn Unshrouded Header HDR 22 POS 2mm Solder ST Thru-Hole |
| NCHLGU2E152MELC | nichicon | Cap Aluminum 1500uF 250V 20% (35 X 50mm) 10mm 3000mA 3000 hr 105°C Bulk |
| 602GB1762000C05 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| D55342K07B41D2RS3 | vishay / dale | Res Thick Film 1206 41.2 Ohm 1% 1/4W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| MTMM-112-04-S-D-130 | samtec inc. | Conn Unshrouded Header HDR 24 POS 2mm Solder ST Thru-Hole |
| DBL155G C1 | Taiwan Semiconductor | Diode Rectifier Bridge Single 600V 1.5A 4-Pin DBL Tube |
| 602GB1762000E04 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| D55342K07B422DRSU | vishay / dale | Res Thin Film 1206 422 Ohm 1% 1/4W ±100ppm/°C 0.01% Molded SMD |
| MTMM-112-05-L-S-200 | samtec inc. | Conn Unshrouded Header HDR 12 POS 2mm Solder ST Thru-Hole |
| RMCF0402FT48R7 | stackpole | Res Thick Film 0402 48.7 Ohm 1% 1/16W ±100ppm/°C Molded SMD SMD Paper T/R |
| NCHLGU2F561MELB | nichicon | Cap Aluminum 560uF 315V 20% (30 X 45mm) 10mm 2050mA 3000 hr 105°C Bulk |
| 602GB1762000F03 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| D55342K07B42E2RTP | vishay / dale | Res Thick Film 1206 42.2K Ohm 1% 1/4W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| MTMM-112-09-T-D-070 | samtec inc. | Conn Unshrouded Header HDR 24 POS 2mm Solder ST Thru-Hole |
| 602GB1762200002 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| NCHLGU2G181MELC | nichicon | Cap Aluminum 180uF 400V 20% (35 X 25mm) 10mm 980mA 3000 hr 105°C Bulk |
| D55342K07B432DRS6 | vishay / dale | Res Thick Film 1206 432 Ohm 1% 1/4W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| MTMM-113-02-S-D-050 | samtec inc. | Conn Unshrouded Header HDR 26 POS 2mm Solder ST Thru-Hole |
| RMCF0402FT499K | stackpole | Res Thick Film 0402 499K Ohm 1% 1/16W ±100ppm/°C Molded SMD Paper T/R |
| 602GB1762200E02 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| NCHLGU2G391MELB | nichicon | Cap Aluminum 390uF 400V 20% (30 X 45mm) 10mm 1600mA 3000 hr 105°C Bulk |
| D55342K07B432ESS2 | vishay / dale | Res Thick Film 1206 432K Ohm 1% 1/4W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| MTMM-113-05-G-D-165 | samtec inc. | Conn Unshrouded Header HDR 26 POS 2mm Solder ST Thru-Hole |
| 602GB1762400005 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| F211JF273K100Q | KEMET Electronics | Cap Film 0.027uF 100V PPS 10% (7.2 X 2.5 X 6.5mm) Radial 5mm 150°C Ammo Pack |
| D55342K07B464DRS2 | vishay / dale | Res Thick Film 1206 464 Ohm 1% 1/4W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| MTMM-113-07-G-D-170 | samtec inc. | Conn Unshrouded Header HDR 26 POS 2mm Solder ST Thru-Hole |
| 602GB1762400B04 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| NCHLGU2W560MELY | nichicon | Cap Aluminum 56uF 450V 20% (20 X 30mm) 10mm 510mA 3000 hr 105°C Bulk |
| RMCF0402FT4M32 | stackpole | Res Thick Film 0402 4.32M Ohm 1% 1/16W ±200ppm/°C Molded SMD Paper T/R |
| D55342K07B470JMS2 | vishay / dale | Res Thick Film 1206 470 Ohm 5% 1/4W ±100ppm/°C 1% Molded SMD SMD T/R |
| MTMM-113-09-S-D-225 | samtec inc. | Conn Unshrouded Header HDR 26 POS 2mm Solder ST Thru-Hole |
| 602GB1762400B05 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| NCHLGU2Z331MELZ | nichicon | Cap Aluminum 330uF 180V 20% (22 X 25mm) 10mm 1200mA 3000 hr 105°C Bulk |
| D55342K07B470JMTP | vishay / dale | Res Thick Film 1206 470 Ohm 5% 1/4W ±100ppm/°C 1% Molded SMD SMD T/R |
| MTMM-113-11-G-D-070 | samtec inc. | Conn Unshrouded Header HDR 26 POS 2mm Solder ST Thru-Hole |
| 602GB1762400C03 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| NCHLGU2Z821MELB | nichicon | Cap Aluminum 820uF 180V 20% (30 X 30mm) Snap-In 10mm 2040mA 3000h 105°C Bulk |
| RMCF0402FT4M42 | stackpole | Res Thick Film 0402 4.42M Ohm 1% 1/16W ±200ppm/°C Molded SMD Paper T/R |
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