规格参数 > 第113828页
AU1100-333MBI BE 现货价格参数; MTLW-133-22-G-D-000 现货价格参数; 602GB12910 现货价格参数; D55342K07B24E3SS3 现货价格参数; MIC4421AYM TR 现货价格参数; 602GB12912586 现货价格参数; MTLW-134-07-G-D-000 现货价格参数; RMCF0402FT357K 现货价格参数; D55342K07B24E9SS2 现货价格参数; 0712310516 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| AU1100-333MBI BE | AMD | SOC Au1000 MIPS32 399-Pin BGA |
| MTLW-133-22-G-D-000 | samtec inc. | Conn Unshrouded Header HDR 66 POS 2.54mm Solder ST Thru-Hole |
| 602GB12910 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| D55342K07B24E3SS3 | vishay / dale | Res Thick Film 1206 24.3K Ohm 1% 1/4W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| MIC4421AYM TR | Micrel Semiconductor | MOSFET DRVR 9A 1-OUT Lo Side Inv 8-Pin SOIC T/R |
| 602GB12912586 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| MTLW-134-07-G-D-000 | samtec inc. | Conn Unshrouded Header HDR 68 POS 2.54mm Solder ST Thru-Hole |
| RMCF0402FT357K | stackpole | Res Thick Film 0402 357K Ohm 1% 1/16W ±100ppm/°C Molded SMD Paper T/R |
| D55342K07B24E9SS2 | vishay / dale | Res Thick Film 1206 24.9K Ohm 1% 1/4W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| 0712310516 | Molex | CONN WIRE TO BOARD HDR 9 POS 4.2MM SOLDER ST THRU-HOLE TRAY |
| MTLW-134-10-L-D-000 | samtec inc. | Conn Unshrouded Header HDR 68 POS 2.54mm Solder ST Thru-Hole |
| ST202BD | STMicroelectronics | Dual Transmitter/Receiver RS-232 16-Pin SOP Tube |
| NIN-FA1R5KTR | NIC Components | Inductor Chip Molded Wirewound 1.5uH 10% 7.96MHz 30Q-Factor 210mA 750mOhm DCR 1210 T/R |
| 602GB12914 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| MTLW-134-22-L-D-110 | samtec inc. | Conn Unshrouded Header HDR 68 POS 2.54mm Solder ST Thru-Hole |
| RMCF0402FT35K7 | stackpole | Res Thick Film 0402 35.7K Ohm 1% 1/16W ±100ppm/°C Molded SMD Paper T/R |
| D55342K07B267DRSU | vishay / dale | Res Thick Film 1206 267 Ohm 1% 1/4W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| SMHLCDA12C8TBT | semtech corporation | Diode TVS Octal Bi-Dir 12V 500W 16-Pin SOIC T/R |
| MTMM-101-04-T-S-220 | samtec inc. | Conn Unshrouded Header HDR 1 POS Solder ST Thru-Hole |
| 602GB12914416 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| D55342K07B26D7SS2 | vishay / dale | Res Thick Film 1206 26.7 Ohm 1% 1/4W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| 250R05L1R5AV4Y | Johanson Group | Cap Ceramic 1.5pF 25V C0G 0.05pF SMD 0201 125°C Paper T/R |
| MTMM-101-15-T-S-771 | samtec inc. | Conn Unshrouded Header HDR 1 POS Solder ST Thru-Hole |
| 602GB12916 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| RMCF0402FT374R | stackpole | Res Thick Film 0402 374 Ohm 1% 1/16W ±100ppm/°C Molded SMD Paper T/R |
| D55342K07B274DRTN | vishay / dale | Res Thick Film 1206 274 Ohm 1% 1/4W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| NMC1206X7R153K50TRP | NIC Components | Cap Ceramic 0.015uF 50V X7R 10% SMD 1206 125°C Paper T/R |
| MTMM-102-03-G-S-100 | samtec inc. | Conn Unshrouded Header HDR 2 POS 2mm Solder ST Thru-Hole |
| 602GB12916416 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| D55342K07B274ERS6 | vishay / dale | Res Thick Film 1206 274K Ohm 1% 1/4W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| EP1AGX60EF1152I6N | Altera | None |
| MTMM-102-04-G-D-225 | samtec inc. | Conn Unshrouded Header HDR 4 POS 2mm Solder ST Thru-Hole |
| 602GB12918 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| LTC3400ES6#TRPBF | Linear Technology | Conv DC-DC Single Step Up 0.5V to 6V 6-Pin TSOT-23 T/R |
| AD9212BCPZ-40 | Analog Devices | Octal ADC Pipelined 40Msps 10-bit Serial 64-Pin LFCSP EP |
| MTMM-102-04-G-S-158 | samtec inc. | Conn Unshrouded Header HDR 2 POS 2mm Solder ST Thru-Hole |
| RMCF0402FT392K | stackpole | Res Thick Film 0402 392K Ohm 1% 1/16W ±100ppm/°C Molded SMD SMD Paper T/R |
| 602GB12922416 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| D55342K07B27J0RS6 | vishay / dale | Res Thick Film 1206 27 Ohm 5% 1/4W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| 98426-S12-04-210LF | FCI | Conn Elevated Shrouded Header HDR 8 POS 2mm Solder ST Thru-Hole Box |
| MTMM-102-04-S-D-040 | samtec inc. | Conn Unshrouded Header HDR 4 POS 2mm Solder ST Thru-Hole |
| 602GB12922586 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| D55342K07B27J0RWB | vishay / dale | Res Thick Film 1206 27 Ohm 5% 1/4W ±100ppm/°C 0.01% Molded SMD SMD Tray |
| MIC2545A-1YM TR | Micrel Semiconductor | USB Power SW Hi Side/DIST Single 5.5V 0.5A to 3A 8-Pin SOP T/R |
| MTMM-102-04-SM-S-258 | samtec inc. | Conn Unshrouded Header HDR 2 POS 2mm Solder ST Thru-Hole |
| 602GB12924416 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| RMCF0402FT3K09 | stackpole | Res Thick Film 0402 3.09K Ohm 1% 1/16W ±100ppm/°C Molded SMD Paper T/R |
| D55342K07B2E15MTP | vishay / dale | Res Thick Film 1206 2.15K Ohm 1% 1/4W ±100ppm/°C 1% Molded SMD SMD T/R |
| NCHLGG2D152MELA50 | nichicon | Cap Aluminum 1500uF 200V 20% (25 X 50mm) 10mm 2570mA 2000 hr 105°C Bulk |
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