规格参数 > 第9431页
0016060010 现货价格参数; PIC16C773T-I/SO 现货价格参数; 15ASL80C-2US 现货价格参数; RS01MR6000DE12 现货价格参数; 00189514466 现货价格参数; RS02B100R0FE12 现货价格参数; PIC16C773T/SO 现货价格参数; 0022032073 现货价格参数; 16383-2-M 现货价格参数; RS02B12K50DE12 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 0016060010 | molex | Pin Terminal PIN Tin |
| PIC16C773T-I/SO | microchip | MCU 8-bit PIC16 PIC RISC 7KB EPROM 5V 28-Pin SOIC W T/R |
| 15ASL80C-2US | cooper bussmann | 15KV 80A 2 SHOT ASL U.S |
| RS01MR6000DE12 | vishay / dale | Res Wirewound 0.6 Ohm 0.5% 1W ±90ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 00189514466 | 3m interconnect solutions | Conn D-Subminiature PIN 50 POS 2.74mm IDT RA Cable Mount 50 Terminal 1 Port |
| RS02B100R0FE12 | vishay / dale | Res Wirewound 100 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| PIC16C773T/SO | microchip | MCU 8-bit PIC16 PIC RISC 7KB EPROM 5V 28-Pin SOIC W T/R |
| 0022032073 | molex | Conn Unshrouded Header HDR 7 POS 2.54mm Solder ST Thru-Hole |
| 16383-2-M | cooper bussmann | POWER DISC BLOCK |
| RS02B12K50DE12 | vishay / dale | Res Wirewound 12.5K Ohm 0.5% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 0022034058 | molex | Conn Unshrouded Header HDR 5 POS 2.54mm Solder ST Thru-Hole |
| PIC16C774-E/PQ | microchip | MCU 8-bit PIC16 PIC RISC 7KB EPROM 5V 44-Pin MQFP Tray |
| LJT00RT-25-11SB(014)-LC | Amphenol Aerospace | Circular MIL Spec Connector 11P Sz 25 Wall Mount Socket Recept Crimp |
| 0022042085 | molex | Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole |
| RS02B147R0FE70 | vishay / dale | Res Wirewound 147 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| PIC16C774T-E/L | microchip | MCU 8-bit PIC16 PIC RISC 7KB EPROM 5V 44-Pin PLCC T/R |
| 0022042102 | molex | Conn Unshrouded Header HDR 10 POS 2.54mm Solder ST Thru-Hole |
| RS02B1K600HE12 | vishay / dale | Res Wirewound 1.6K Ohm 3% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 170605-000 | te connectivity / raychem wire | 382A023-100/180-0 |
| RS02B274R0FE70 | vishay / dale | Res Wirewound 274 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 0022052231 | molex | Conn Unshrouded Header HDR 23 POS 2.54mm Solder RA Thru-Hole Bag |
| PIC16C77T-04/PQ | microchip | MCU 8-bit PIC16 PIC RISC 14KB EPROM 5V 44-Pin MQFP T/R |
| RS02B2K250FE12 | vishay / dale | Res Wirewound 2.25K Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 0022057268 | molex | Conn Wire to Board HDR 26 POS 2.54mm Solder RA Thru-Hole Bag |
| FKP4G026805D00MSSD | WIMA | Film Capacitors FKP 4 0.068 uF 400 VDC 7x16.5x26.5 PCM22.5 |
| PIC16C77T-04/PT | microchip | MCU 8-bit PIC16 PIC RISC 14KB EPROM 5V 44-Pin TQFP T/R |
| RS02B2R500BE12 | vishay / dale | Res Wirewound 2.5 Ohm 0.1% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 0022101131 | molex | Conn Unshrouded Header HDR 13 POS 2.5mm Solder ST Thru-Hole Bag |
| 170M7489 | cooper bussmann | 2100A 1500V 4BKN/125AR TYPOWER ZILOX |
| RS02B2R910DE70 | vishay / dale | Res Wirewound 2.91 Ohm 0.5% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 0022102068 | molex | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole |
| PIC16C77T-10/L | microchip | MCU 8-bit PIC16 PIC RISC 14KB EPROM 5V 44-Pin PLCC T/R |
| 0022102072 | molex | Conn Unshrouded Header HDR 7 POS 2.54mm Solder ST Thru-Hole |
| RS02B3R010FE70 | vishay / dale | Res Wirewound 3.01 Ohm 1% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 1840417-1 | te connectivity / amp | Conn RJ-45 F 8 POS 2.54mm Solder ST Thru-Hole 14 Terminal 1 Port |
| PIC16C77T-10/PQ | microchip | MCU 8-bit PIC16 PIC RISC 14KB EPROM 5V 44-Pin MQFP T/R |
| 0022102104 | molex | Conn Unshrouded Header HDR 10 POS 2.54mm Solder ST Thru-Hole |
| RS02B4K350FE12 | vishay / dale | Res Wirewound 4.35K Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| PIC16C77T-10E/PQ | microchip | MCU 8-bit PIC16 PIC RISC 14KB EPROM 5V 44-Pin MQFP T/R |
| 0022106251 | molex | 100 KK HDR STR ASSY 20SAU 25CKTIN,HAZMAT |
| RS02B4R990FE12 | vishay / dale | Res Wirewound 4.99 Ohm 1% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| CN1J2TTD101J | KOA Speer | Resistor Networks & Arrays 1/16watt 100ohms 5% CONCAVE SQUARE |
| 0022112221 | molex | Conn Unshrouded Header HDR 22 POS 2.54mm Solder ST Thru-Hole |
| RS02B58R00FE12 | vishay / dale | Res Wirewound 58 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| PIC16C77T-10E/PT | microchip | MCU 8-bit PIC16 PIC RISC 14KB EPROM 5V 44-Pin TQFP T/R |
| 184120P-01-1 | cooper bussmann | HI-AMP BREAKER |
| 0022122236 | molex | Conn Wire to Board HDR 23 POS 2.54mm Solder RA Thru-Hole |
| RS02B600R0BE12 | vishay / dale | Res Wirewound 600 Ohm 0.1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| PIC16C77T-20/L | microchip | MCU 8-bit PIC16 PIC RISC 14KB EPROM 5V 44-Pin PLCC T/R |
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