规格参数 > 第9192页
1N4752G 现货价格参数; MDM-9SL1M7-A174 现货价格参数; BACC45FT16C24S 现货价格参数; GS8160E32BGT-250I 现货价格参数; S-80123ALMC-JAIT2G 现货价格参数; MDM03-C21-04 现货价格参数; WBR500-25A 现货价格参数; GS8160EV18BGT-150 现货价格参数; MDM03-D25-01 现货价格参数; S-80123ALPF-JAITFG 现货价格参数;
型号 | 生产商 | 产品描述 |
---|---|---|
1N4752G | Taiwan Semiconductor | Zener Diodes 1W,33V,5%,ZENER |
MDM-9SL1M7-A174 | itt interconnect solutions | Cable Assembly RG178/U 0.012m 25AWG 9 POS Micro D-Sub SKT Crimp |
BACC45FT16C24S | Cinch | Circular MIL Spec Connector 26500 24C 24#20 SKT PLUG WC |
GS8160E32BGT-250I | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 16M-Bit 512K x 32 5.5ns/2.5ns 100-Pin TQFP Tray |
S-80123ALMC-JAIT2G | seiko instruments | Volt Supervisor Detect W/Delay Circuit 2.2V to 6V 5-Pin SOT-23 T/R |
MDM03-C21-04 | itt interconnect solutions | Cable Assembly RG178/U 0.914m 26AWG 21 POS Micro D-Sub PL Crimp |
WBR500-25A | Cornell Dubilier | Aluminum Electrolytic Capacitors - Leaded 500uF 25V |
GS8160EV18BGT-150 | gsi technology | 1M X 18 (18 MEG) SYNCH BURST , DCD |
MDM03-D25-01 | itt interconnect solutions | Cable Assembly RG178/U 0.457m 26AWG 25 POS Micro D-Sub PL Crimp |
S-80123ALPF-JAITFG | seiko instruments | Volt Supervisor Detect W/Delay Circuit 2.2V to 6V 4-Pin SNT-4A T/R |
RN73H1JTTD7231B10 | KOA Speer | Thin Film Resistors - SMD 1/10W 7.23K ohm 0.1% 10ppm |
MDM03-G51-06-A174 | itt interconnect solutions | Cable Assembly RG178/U 0.025m 25AWG 51 POS Micro D-Sub PL Crimp |
GS8160EV18BGT-150I | gsi technology | 1M X 18 (18 MEG) SYNCH BURST , DCD |
1707492 | Phoenix Contact | Pluggable Terminal Blocks MCV 1.5/ 9- G-3,81 P26 THR |
S-80123ANMC-JCIT2G | seiko instruments | Volt Supervisor Detect W/Delay Circuit 2.2V to 6V 5-Pin SOT-23 T/R |
MDM04-A9-09-A174 | itt interconnect solutions | Cable Assembly RG178/U 0.457m 26AWG 9 POS Micro D-Sub RCP Crimp |
C702 10M008 9072 | amphenol | Conn Smart Card HDR 16 POS 2mm Solder RA Thru-Hole 5.3A |
GS8160EV18BGT-250 | gsi technology | 1M X 18 (18 MEG) SYNCH BURST , DCD |
MDM04-B15-09-A174 | itt interconnect solutions | Cable Assembly RG178/U 0.457m 26AWG 15 POS Micro D-Sub RCP Crimp |
S-80123ANPF-JCITFG | seiko instruments | Volt Supervisor Detect W/Delay Circuit 2.2V to 6V 4-Pin SNT-4A T/R |
CA3054MZ96 | intersil | Trans GP BJT NPN 15V 0.05A 14-Pin SOIC N T/R |
MDM04-C21-04-A174 | itt interconnect solutions | Cable Assembly RG178/U 0.914m 26AWG 21 POS Micro D-Sub RCP Crimp |
GS8160FV32BGT-6.5I | gsi technology | SRAM Chip Sync Quad 1.8V 16M-Bit 512K x 32 6.5ns 100-Pin TQFP Tray |
CAT10-121J4LF | bourns | Res Thick Film Array 120 Ohm 5% 1/8W ±250ppm/°C ISOL Molded 8-Pin 0804 Concave SMD Paper Tape on Plastic Reel |
S-80123BLPF-JEITFG | seiko instruments | Volt Supervisor Detect W/Delay Circuit 2.2V to 6V 4-Pin SNT-4A T/R |
MDM04-C21-06 | itt interconnect solutions | Cable Assembly RG178/U 0.025m 25AWG 21 POS Micro D-Sub RCP Crimp |
CAT10-7R5J4LF | bourns | Res Thick Film Array 7.5 Ohm 5% 1/8W ±250ppm/°C ISOL Molded 8-Pin 0804 Concave SMD Paper Tape on Plastic Reel |
GS8160FV36BGT-5.5 | gsi technology | SRAM Chip Sync Quad 1.8V 18M-Bit 512K x 36 5.5ns 100-Pin TQFP Tray |
MDM04-E31-03 | itt interconnect solutions | Cable Assembly RG178/U 0.457m 26AWG 32 POS Micro D-Sub RCP Crimp |
CAT16-121J4LF | bourns | Res Thick Film Array 120 Ohm 5% ISOL Molded 8-Pin 1206 Concave SMD Paper T/R |
S-80123BNMC-JGIT2G | seiko instruments | Volt Supervisor Detect W/Delay Circuit 2.2V to 6V 5-Pin SOT-23 T/R |
MDM04-F37-02 | itt interconnect solutions | Cable Assembly RG178/U 0.914m 26AWG 37 POS Micro D-Sub RCP Crimp |
CAT16-PC2F6LF | bourns | Res Array 100 Ohm/187 Ohm 1% ±200ppm/°C LADDER Molded 8-Pin 1206 Concave SMD T/R |
GS8160ZV18BGT-200I | gsi technology | 1M X 18 (18 MEG) NBT |
S-80123BNPF-JGITFG | seiko instruments | Volt Supervisor Detect W/Delay Circuit 2.2V to 6V 4-Pin SNT-4A T/R |
MDM04-F37-05 | itt interconnect solutions | Cable Assembly RG178/U 0.012m 25AWG 37 POS Micro D-Sub RCP Crimp |
CAT16-PC4F12LF | bourns | Res Array 100 Ohm/187 Ohm 1% ±200ppm/°C LADDER Molded 16-Pin 2506 Concave SMD T/R |
MDM04-F37-07-A174 | itt interconnect solutions | Cable Assembly RG178/U 0.012m 25AWG 37 POS Micro D-Sub RCP Crimp |
CAT25-181JALF | bourns | Res Thick Film Array 180 Ohm 5% ±200ppm/°C BUS Molded 10-Pin 1608 Concave SMD Embossed T/R |
GS816118BGT-150I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 18M-Bit 1M x 18 7.5ns/3.8ns 100-Pin TQFP Tray |
S-80123CLPF-JIITFG | seiko instruments | Volt Supervisor Detect W/Delay Circuit 2.2V to 6V 4-Pin SNT-4A T/R |
MDM04-G51-05-A174 | itt interconnect solutions | Cable Assembly RG178/U 0.012m 25AWG 51 POS Micro D-Sub RCP Crimp |
CAT25-500JALF | bourns | Res Thick Film Array 50 Ohm 5% ±200ppm/°C BUS Molded 10-Pin 1608 Concave SMD Embossed T/R |
MDM96513-412 | itt interconnect solutions | 096513-0412 |
CAY10-201J4LF | bourns | Res Thick Film Array 200 Ohm 5% 1/8W ±250ppm/°C ISOL Molded 8-Pin 0804 Convex SMD Paper T/R |
S-80123CNMC-JKIT2G | seiko instruments | Volt Supervisor Detect W/Delay Circuit 2.2V to 6V 5-Pin SOT-23 T/R |
GS816136BGD-250 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 18M-Bit 512K x 36 5.5ns/2.5ns 165-Pin FBGA Tray |
MDM96520-483 | itt interconnect solutions | MDM96520-483 |
CAY10-681J4LF | bourns | Res Thick Film Array 680 Ohm 5% 1/8W ±250ppm/°C ISOL Molded 8-Pin 0804 Convex SMD Paper T/R |
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