规格参数 > 第9087页
7025L15PF8 现货价格参数; CD19ED750FO3 现货价格参数; 7025S45J8 现货价格参数; DW-23-12-G-S-500 现货价格参数; C321C474M5U5TA 现货价格参数; 7034L20PF8 现货价格参数; DW-24-10-L-D-400 现货价格参数; M374S3323FTS-C7A00 现货价格参数; C322C100K1G5TATR 现货价格参数; 705557-000 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 7025L15PF8 | integrated device technology (idt) | SRAM Chip Async Dual 5V 128K-Bit 8K x 16 15ns 100-Pin TQFP T/R |
| CD19ED750FO3 | Cornell Dubilier | Mica Capacitors 75pF 500V +/-1% |
| 7025S45J8 | integrated device technology (idt) | SRAM Chip Async Dual 5V 128K-Bit 8K x 16 45ns 84-Pin PLCC T/R |
| DW-23-12-G-S-500 | samtec inc. | Conn Board Stacker HDR 23 POS 2.54mm Solder ST Thru-Hole |
| C321C474M5U5TA | kemet | Cap Ceramic 0.47uF 50V Z5U 20% Radial 6.35mm 85°C Bulk |
| 7034L20PF8 | integrated device technology (idt) | SRAM Chip Async Dual 5V 72K-Bit 4K x 18 20ns 100-Pin TQFP T/R |
| DW-24-10-L-D-400 | samtec inc. | Conn Board Stacker HDR 48 POS 2.54mm Solder ST Thru-Hole |
| M374S3323FTS-C7A00 | samsung | 128MSDRAM_MSDRAM MODULEX72TSOP2-400 |
| C322C100K1G5TATR | kemet | Cap Ceramic 10pF 100V C0G 10% Radial 5.08mm 125°C T/R |
| 705557-000 | te connectivity / raychem wire | Connector Accessories Tinel Lock Adapter Right Angle Aluminum Alloy Olive Drab Cadmium Over Electroless Nickel |
| DW-24-14-T-S-1100 | samtec inc. | Conn Board Stacker HDR 24 POS 2.54mm Solder ST Thru-Hole |
| M381L6423ETM-CA200 | samsung | 256 DDR SDRAM MODUL X72 TSOP2-400 |
| 709159L9BF | integrated device technology (idt) | SRAM Chip Sync Dual 5V 72K-Bit 8K x 9-Bit 20ns/9ns 100-Pin CABGA |
| DW-25-12-L-D-815 | samtec inc. | Conn Board Stacker HDR 50 POS 2.54mm Solder ST Thru-Hole |
| C322C102J1G5TATR | kemet | Cap Ceramic 0.001uF 100V C0G 5% Radial 5.08mm 125°C T/R |
| DW-25-13-G-D-900 | samtec inc. | Conn Board Stacker HDR 50 POS 2.54mm Solder ST Thru-Hole |
| 709269L12PF | integrated device technology (idt) | SRAM Chip Sync Dual 5V 256K-Bit 16K x 16 25ns/12ns 100-Pin TQFP |
| DCP4N05220SM3NKY00 | WIMA | Film Capacitors DC-LINK MKP 4 22.0 uF 900 VDC 24x45.5x41.5 SN |
| C322C103M5R5TATR | kemet | Cap Ceramic 0.01uF 50V X7R 20% Radial 5.08mm 125°C T/R |
| DW-25-19-T-D-1000 | samtec inc. | Conn Board Stacker HDR 50 POS 2.54mm Solder ST Thru-Hole |
| MAX6476UT24AD4-T | Maxim Integrated | Low Dropout Regulators - LDO |
| DW-25-19-T-D-1110 | samtec inc. | Conn Board Stacker HDR 50 POS 2.54mm Solder ST Thru-Hole |
| 70T3319S133BCI8 | integrated device technology (idt) | SRAM Chip Sync Dual 2.5V 4M-Bit 256K x 18 15ns/4.2ns 256-Pin CABGA T/R |
| ERJ-T06J111V | Panasonic Electronic Components | Thick Film Resistors - SMD 0805 110ohms 5% Tol |
| M393T5660CZ3-CCC00 | samsung | 1GB DDR SDRAM MODUL X72 BOC(LF) |
| DW-26-15-S-D-290 | samtec inc. | Conn Board Stacker HDR 52 POS 2.54mm Solder ST Thru-Hole |
| 70T3319S133BFI | integrated device technology (idt) | SRAM Chip Sync Dual 2.5V 4M-Bit 256K x 18 15ns/4.2ns 208-Pin CABGA |
| DW-30-09-L-D-350 | samtec inc. | Conn Board Stacker HDR 60 POS 2.54mm Solder ST Thru-Hole |
| M395T2953EZ4-CE660 | samsung | 512 DDR SDRAM MODUL X72 BOC(LF) |
| C322C122K2R5TA | kemet | Cap Ceramic 0.0012uF 200V X7R 10% Radial 5.08mm 125°C Bulk |
| 70T3319S200BC | integrated device technology (idt) | SRAM Chip Sync Dual 2.5V 4M-Bit 256K x 18 10ns/3.4ns 256-Pin CABGA |
| DW-30-20-S-D-290-LL | samtec inc. | Conn Board Stacker HDR 60 POS 2.54mm Solder ST Thru-Hole |
| 70T3519S166BCI8 | integrated device technology (idt) | SRAM Chip Sync Dual 2.5V 9M-Bit 256K x 36 12ns/3.6ns 256-Pin CABGA T/R |
| C322C122K2R5TATR | kemet | Cap Ceramic 0.0012uF 200V X7R 10% Radial 5.08mm 125°C T/R |
| M395T5166AZ4-CE61P | samsung | 512 DDR SDRAM MODUL X72 BOC(LF) |
| DW-32-09-G-D-300 | samtec inc. | Conn Board Stacker HDR 64 POS 2.54mm Solder ST Thru-Hole |
| 70T3589S133BF8 | integrated device technology (idt) | SRAM Chip Sync Dual 2.5V 2.25M-Bit 64K x 36 15ns/4.2ns 208-Pin CABGA T/R |
| DW-32-09-T-S-540 | samtec inc. | Conn Board Stacker HDR 32 POS 2.54mm Solder ST Thru-Hole |
| C322C152J1G5TATR | kemet | Cap Ceramic 0.0015uF 100V C0G 5% Radial 5.08mm 125°C T/R |
| 70T3599S133BF8 | integrated device technology (idt) | SRAM Chip Sync Dual 2.5V 4.5M-Bit 128K x 36 15ns/4.2ns 208-Pin CABGA T/R |
| M470T6554CZ3-CD500 | samsung | DRAM Module DDR2 SDRAM 512Mbyte 200SODIMM Tray |
| DW-32-10-T-D-600 | samtec inc. | Conn Board Stacker HDR 64 POS 2.54mm Solder ST Thru-Hole |
| CY7C136-25JXCT | Cypress Semiconductor | SRAM 5V 2Kx8 COM Dual-Port SRAM |
| C322C152K1R5TA | kemet | Cap Ceramic 0.0015uF 100V X7R 10% Radial 5.08mm 125°C Bulk |
| M55342H12B16E2RT5 | vishay / dale | Res Thin Film 0603 16.2K Ohm 1% 1/10W ±50ppm/°C 0.01% Molded SMD SMD T/R |
| DW-32-13-G-D-500 | samtec inc. | Conn Board Stacker HDR 64 POS 2.54mm Solder ST Thru-Hole |
| 70T633S10BFI8 | integrated device technology (idt) | SRAM Chip Async Dual 2.5V 9M-Bit 512K x 18 10ns 208-Pin CABGA T/R |
| DW-36-09-G-D-300 | samtec inc. | Conn Board Stacker HDR 72 POS 2.54mm Solder ST Thru-Hole |
| C322C152K5R5TATR | kemet | Cap Ceramic 0.0015uF 50V X7R 10% Radial 5.08mm 125°C T/R |
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