规格参数 > 第8978页
05111196719 现货价格参数; 72811L15TFI 现货价格参数; 71V321L25PFG8 现货价格参数; 05111992883 现货价格参数; CDR35BX474AKYMAR 现货价格参数; 72821L15TFI8 现货价格参数; 71V321L25PFGI8 现货价格参数; 72831L12PF 现货价格参数; CDR35BX474AKYRAB 现货价格参数; 05112858809 现货价格参数;
型号 | 生产商 | 产品描述 |
---|---|---|
05111196719 | 3m interconnect solutions | Conn IDC Connector SKT 20 POS 2mm IDT RA Cable Mount |
72811L15TFI | integrated device technology (idt) | FIFO Mem Sync Quad Depth/Width Bi-Dir 512 x 9 x 2 64-Pin STQFP |
71V321L25PFG8 | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 16K-Bit 2K x 8 25ns 64-Pin TQFP T/R |
05111992883 | 3m interconnect solutions | Flat Cable 34Conductors 30AWG 30.48m/91.44m Tinned Solid Copper Gray/Blue Edge 150V Roll |
CDR35BX474AKYMAR | vishay / vitramon | Cap Ceramic 0.47uF 50V BX 10% SMD 1825 (1%FR) 125°C Plastic T/R |
72821L15TFI8 | integrated device technology (idt) | FIFO Mem Sync Quad Depth/Width Bi-Dir 1K x 9 x 2 64-Pin STQFP T/R |
71V321L25PFGI8 | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 16K-Bit 2K x 8 25ns 64-Pin TQFP T/R |
72831L12PF | integrated device technology (idt) | 2K X 9 SYNCHRONOUS DUAL FIFO |
CDR35BX474AKYRAB | vishay / vitramon | Cap Ceramic 0.47uF 50V BX 10% SMD 1825 (0.01%FR) 125°C Bulk |
05112858809 | 3m interconnect solutions | Quick Disconnect Terminal 18-22AWG F 22.09mm 9.39mm Case |
72841L15TFI8 | integrated device technology (idt) | FIFO Mem Sync Quad Depth/Width Bi-Dir 4K x 9 x 2 64-Pin STQFP T/R |
71V416L10PHI | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 10ns 44-Pin TSOP-II Tray |
05113825180 | 3m interconnect solutions | Conn Socket Strip SKT 10 POS 2mm Solder ST SMD Tray |
CDR35BX474AKYRAR | vishay / vitramon | Cap Ceramic 0.47uF 50V BX 10% SMD 1825 (0.01%FR) 125°C Plastic T/R |
7285L15PAI | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 8K x 9 x 2 56-Pin TSSOP Tube/Tray |
05113825233 | 3m interconnect solutions | Conn Socket Strip SKT 60 POS 2mm Solder ST SMD Tray |
71V416L12YG | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 12ns 44-Pin SOJ Tube/Tray |
72T1855L10BB | integrated device technology (idt) | FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 4K x 18/8K x 9 144-Pin BGA |
05113826040 | 3m interconnect solutions | Conn Unshrouded Header HDR 50 POS 2mm Solder ST SMD Tray |
CDR35BX474AKYSAR | vishay / vitramon | Cap Ceramic 0.47uF 50V BX 10% SMD 1825 (0.001%FR) 125°C Plastic T/R |
72T1865L6-7BB | integrated device technology (idt) | FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 8K x 18/16K x 9 144-Pin BGA |
05113826400 | 3m interconnect solutions | Conn Socket Strip SKT 30 POS 2mm Solder RA Thru-Hole |
71V416S12BE1 | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 12ns 48-Pin CABGA Tray |
CDR35BX474AKYSAT | vishay / vitramon | Cap Ceramic 0.47uF 50V BX 10% SMD 1825 (0.001%FR) 125°C Plastic T/R |
72T36105L5BB | integrated device technology (idt) | FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 64K x 36 240-Pin BGA |
05113827591 | 3m interconnect solutions | Conn IDC Connector SKT 10 POS 2mm IDT RA Cable Mount |
05113833070 | 3m interconnect solutions | Conn Shrouded Header HDR 50 POS 2.54mm Solder ST Thru-Hole |
71V416S12BE2 | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 12ns 48-Pin CABGA Tray |
CDR35BX474AKZSAB | vishay / vitramon | Cap Ceramic 0.47uF 50V BX 10% SMD 1825 (0.001%FR) 125°C Bulk |
05113840599 | 3m interconnect solutions | Conn Ejector Header HDR 20 POS 2.54mm Solder ST Thru-Hole |
71V416S12BEG1 | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 12ns 48-Pin CABGA Tube/Tray |
05113842127 | 3m interconnect solutions | Round Flat Cable 30Conductors 28AWG 30.48m/91.44m 9.4mm Tinned Copper Black/Gray 300V Roll |
CDRH5D16NP-3R3NC | sumida | Ind Power Shielded Wirewound 3.3uH 25% 100KHz Ferrite 2.4A Carrier T/R |
05113861643 | 3m interconnect solutions | Conn Ejector Header HDR 40 POS 2.54mm Solder ST Thru-Hole |
71V416S12BEG18 | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 12ns 48-Pin CABGA T/R |
CES-0202MC | nidec copal electronics | Switch Slide OFF ON DPST Raised Slide 0.1A 24VDC PC Pins Thru-Hole Magazine |
05113861707 | 3m interconnect solutions | Conn Socket Strip SKT 17 POS 2.54mm Solder ST Thru-Hole |
71V416S15YGI8 | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 15ns 44-Pin SOJ T/R |
0511981400 | molex | Conn Housing RCP 14 POS 2.5mm Crimp ST Bag |
CES-0402C | nidec copal electronics | Switch Slide OFF ON 4PST Raised Slide 0.1A 50VDC PC Pins Thru-Hole Bulk |
0520188825 | molex | Conn RJ-45 RCP 8 POS 2.04mm Solder RA Thru-Hole 8 Terminal 1 Port Tray Cat 3 |
71V416S20BE18 | integrated device technology (idt) | 4MB (256KX16) 3.3V FAST ASYNCH SRAM |
CES-0402MC | nidec copal electronics | Switch Slide OFF ON 4PST Raised Slide 0.1A 24VDC PC Pins Thru-Hole Magazine |
0524352372 | molex | Conn FFC/FPC Connector SKT 23 POS 0.5mm Solder RA SMD Embossed T/R |
72T3695L10BB | integrated device technology (idt) | FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 32K x 36 208-Pin BGA |
71V416S20BE2 | integrated device technology (idt) | 4MB (256KX16) 3.3V FAST ASYNCH SRAM |
0526092070 | molex | Conn Board to Board RCP 20 POS 1.25mm Solder ST SMD T/R |
CES-0802C | nidec copal electronics | Switch Slide OFF ON 8PST Raised Slide 0.1A 50VDC PC Pins Thru-Hole Bulk |
72V241L20J | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 4K x 9 32-Pin PLCC |
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