规格参数 > 第8965页
0022280148 现货价格参数; CDR34BX184AKZSAT 现货价格参数; 70G-IAC15A 现货价格参数; 0022280175 现货价格参数; 5KP8.0A-E3/54 现货价格参数; 70L-ODCA 现货价格参数; 0022280246 现货价格参数; CDR34BX473BKMPAB 现货价格参数; 70M-OAC5A 现货价格参数; 0022280250 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 0022280148 | molex | Conn Wire to Board HDR 14 POS 2.54mm Solder ST Thru-Hole Bag |
| CDR34BX184AKZSAT | vishay / vitramon | Cap Ceramic 0.18uF 50V BX 10% SMD 1812 (0.001%FR) 125°C Plastic T/R |
| 70G-IAC15A | grayhill | OptoCoupler Transistor-Out 1-CH 5-Pin |
| 0022280175 | molex | Conn Wire to Board HDR 17 POS 2.54mm Solder ST Thru-Hole Bag |
| 5KP8.0A-E3/54 | vishay / semiconductor | Diode TVS Single Uni-Dir 8V 5KW 2-Pin Case P600 T/R |
| 70L-ODCA | grayhill | OptoCoupler Transistor-Out 2-CH 9-Pin |
| 0022280246 | molex | Conn Wire to Board HDR 24 POS 2.54mm Solder ST Thru-Hole Bag |
| CDR34BX473BKMPAB | vishay / vitramon | Cap Ceramic 0.047uF 100V BX 10% SMD 1812 (0.1%FR) 125°C Bulk |
| 70M-OAC5A | grayhill | Digital I/O Modules 5-Pin |
| 0022280250 | molex | Conn Wire to Board HDR 25 POS 2.54mm Solder ST Thru-Hole Bag |
| 5KP8.5A-E3/54 | vishay / semiconductor | Diode TVS Single Uni-Dir 8.5V 5KW 2-Pin Case P600 T/R |
| 70T633S12BFI | integrated device technology (idt) | SRAM Chip Async Dual 2.5V 9M-Bit 512K x 18 12ns 208-Pin CABGA Tray |
| CDR34BX473BKMPAT | vishay / vitramon | Cap Ceramic 0.047uF 100V BX 10% SMD 1812 (0.1%FR) 125°C Plastic T/R |
| 0022280288 | molex | Conn Wire to Board HDR 28 POS 2.54mm Solder ST Thru-Hole Bag |
| 70V06L25J8 | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 128K-Bit 16K x 8 25ns 68-Pin PLCC T/R |
| 5KP85A-E3/54 | vishay / semiconductor | Diode TVS Single Uni-Dir 85V 5KW 2-Pin Case P600 T/R |
| 0022280305 | molex | Conn Wire to Board HDR 30 POS 2.54mm Solder ST Thru-Hole Bag |
| CDR34BX473BKMRAR | vishay / vitramon | Cap Ceramic 0.047uF 100V BX 10% SMD 1812 (0.01%FR) 125°C Plastic T/R |
| 70V06L55PF8 | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 128K-Bit 16K x 8 55ns 64-Pin TQFP T/R |
| 0022280332 | molex | Conn Wire to Board HDR 33 POS 2.54mm Solder ST Thru-Hole Bag |
| MAX6727KAYDD5-T | Maxim Integrated | Supervisory Circuits |
| 70V06S35G | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 128K-Bit 16K x 8 35ns 68-Pin PGA |
| CDR34BX473BKMRAT | vishay / vitramon | Cap Ceramic 0.047uF 100V BX 10% SMD 1812 (0.01%FR) 125°C Plastic T/R |
| 0022281351 | molex | Conn Wire to Board HDR 35 POS 2.54mm Solder RA Thru-Hole Bag |
| 6-1616360-5 | te connectivity / amp | 51808-021 NUT |
| 70V07S35J | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 256K-Bit 32K x 8 35ns 68-Pin PLCC |
| 0022282024 | molex | Conn Wire to Board HDR 2 POS 2.54mm Solder RA Thru-Hole Bag |
| 70V24L20J | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 64K-Bit 4K x 16 20ns 84-Pin PLCC Tray |
| RN731JTTD17R8D25 | KOA Speer | Thin Film Resistors - SMD 1/16W 17.8ohm .5% 25ppm |
| 6-1617545-8 | te connectivity / cii | |
| 0022282188 | molex | Conn Wire to Board HDR 18 POS 2.54mm Solder RA Thru-Hole Bag |
| 70V26S25J | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 256K-Bit 16K x 16 25ns 84-Pin PLCC |
| 0022282252 | molex | Conn Wire to Board HDR 25 POS 2.54mm Solder RA Thru-Hole Bag |
| CDR34BX473BKMSAT | vishay / vitramon | Cap Ceramic 0.047uF 100V BX 10% SMD 1812 (0.001%FR) 125°C Plastic T/R |
| 70V3319S133BF | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 15ns/4.2ns 208-Pin CABGA |
| 6-6609929-0 | te connectivity / corcom | 6-6609929-0 |
| 0022282346 | molex | Conn Wire to Board HDR 34 POS 2.54mm Solder RA Thru-Hole Bag |
| 70V3319S133BFI8 | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 15ns/4.2ns 208-Pin CABGA T/R |
| 6-6609929-7 | te connectivity / corcom | 6-6609929-7 |
| 0022283044 | molex | Conn Wire to Board HDR 4 POS 2.54mm Solder ST Thru-Hole Bag |
| 70V3579S4BC8 | integrated device technology (idt) | SRAM Chip Sync Dual 3.3V 1.125M-Bit 32K x 36 4.2ns 256-Pin CABGA T/R |
| CDR34BX473BKUMAB | vishay / vitramon | Cap Ceramic 0.047uF 100V BX 10% SMD 1812 (1%FR) 125°C Bulk |
| 0022283068 | molex | Conn Wire to Board HDR 6 POS 2.54mm Solder ST Thru-Hole Bag |
| 6-6609941-9 | te connectivity / corcom | 6-6609941-9 |
| 70V35L15PF | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 144K-Bit 8K x 18 15ns 100-Pin TQFP Tray |
| CDR34BX473BKUMAR | vishay / vitramon | Cap Ceramic 0.047uF 100V BX 10% SMD 1812 (1%FR) 125°C Plastic T/R |
| 0022283155 | molex | Conn Wire to Board HDR 15 POS 2.54mm Solder ST Thru-Hole Bag |
| 70V639S12BFI8 | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 2.25M-Bit 128K x 18 12ns 208-Pin CABGA T/R |
| 6-6609959-3 | te connectivity / corcom | 6-6609959-3 |
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