规格参数 > 第88072页
FDS4897AC/BKN 现货价格参数; 5047202-21 现货价格参数; T192B227M008AS 现货价格参数; GS81302D19E-375 现货价格参数; C0402C209C3GAC 现货价格参数; GS81302R18GE-250 现货价格参数; RN731JTTD1421A25 现货价格参数; GS81302S08E-300I 现货价格参数; 2053AS631-01 现货价格参数; GS81302S09GE-250 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| FDS4897AC/BKN | fairchild semiconductor | Trans MOSFET N/P-CH 40V 6.1A/5.2A 8-Pin SOIC N T/R |
| 5047202-21 | Glenair | Circular MIL Spec Strain Reliefs & Adapters |
| T192B227M008AS | Kemet | Tantalum Capacitors - Wet 8volts 220uF 20% |
| GS81302D19E-375 | gsi technology | SRAM Chip Sync Dual 1.8V 144M-Bit 8M x 18 0.45ns 165-Pin FBGA Tray |
| C0402C209C3GAC | Kemet | Multilayer Ceramic Capacitors MLCC - SMD/SMT 2.00PF 25.0V |
| GS81302R18GE-250 | gsi technology | SRAM Chip Sync Dual 1.8V 144M-Bit 8M x 18 0.45ns 165-Pin FBGA Tray |
| RN731JTTD1421A25 | KOA Speer | 薄膜抵抗器 - SMD 1/16W 1.42K ohm .05% 25ppm |
| GS81302S08E-300I | gsi technology | SRAM Chip Sync Dual 1.8V 144M-Bit 16M x 8 0.45ns 165-Pin FBGA Tray |
| 2053AS631-01 | Glenair | Circular MIL Spec Backshells |
| GS81302S09GE-250 | gsi technology | SRAM Chip Sync Dual 1.8V 144M-Bit 16M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| T192B686M035AS | Kemet | Tantalum Capacitors - Wet 35volts 68uF 20% |
| GS815018AB-357 | gsi technology | SRAM Chip Sync Dual 2.5V 18M-Bit 1M x 18 1.4ns 119-Pin FBGA Tray |
| FKP4U016805F00JMSD | WIMA | Film Capacitors FKP 4 6800 pF 2000 VDC 8.5x18.5x26.5 PCM22.5 |
| 258531-1 | Glenair | Circular MIL Spec Strain Reliefs & Adapters |
| DD680 | Vishay / BC Components | Multilayer Ceramic Capacitors MLCC - Leaded 68PF 1KV 10% |
| 380DA002B1406A | Glenair | Circular MIL Spec Backshells |
| GS8160V18CT-300 | gsi technology | SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 5ns/2.5ns 100-Pin TQFP Tray |
| FQB33N10TM/BKN | fairchild semiconductor | Trans MOSFET N-CH 100V 33A 3-Pin(2+Tab) D2PAK T/R |
| GS816118BGD-150V | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 18M-Bit 1M x 18 7.5ns/3.8ns 165-Pin FBGA Tray |
| 140-PF2A183K | Xicon | Film Capacitors CAP 100V .018uF |
| GS8161FZ18BD-5.5I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 18M-Bit 1M x 18 5.5ns 165-Pin FBGA Tray |
| RCME0240000BZS03 | Vishay / Sfernice | 金属被膜抵抗器 - スルーホール RCME 02 4K 0,1% K8 BA10 e3 |
| GS8162Z72CC-150IV | gsi technology | SRAM Chip Sync Octal 1.8V/2.5V 18M-Bit 256K x 72-Bit 7.5ns/3.8ns 209-Pin BGA Tray |
| FQD5N60CTM/BKN | fairchild semiconductor | Trans MOSFET N-CH 600V 2.8A 3-Pin(2+Tab) DPAK T/R |
| GS8182D36BD-300 | gsi technology | SRAM Chip Sync Dual 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray |
| FSA1259AK8X | fairchild semiconductor | Analog Switch Dual SPST 8-Pin US T/R |
| GS8182D36BGD-167 | gsi technology | SRAM Chip Sync Dual 1.8V 18M-Bit 512K x 36 0.5ns 165-Pin FBGA Tray |
| HEDB-9100-G05 | Avago Technologies | エンコーダ 2 Channel 360 CPR 3/16in Carbon Wheel |
| GS8182D37BD-435 | gsi technology | SRAM Chip Sync Dual 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray |
| FXL2T245L10X | fairchild semiconductor | Translator 10-Pin MicroPak W T/R |
| GS8182Q08BGD-133I | gsi technology | SRAM Chip Sync Dual 1.8V 18M-Bit 2M x 8 0.5ns 165-Pin FBGA Tray |
| GS8182Q09BD-300I | gsi technology | SRAM Chip Sync Dual 1.8V 18M-Bit 2M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| 923CX7R223K050B | Vishay | Ceramic Disc Capacitors 923C 0.022uF 50volts X7R 10% |
| GS8182R08BD-375I | gsi technology | SRAM Chip Sync Single 1.8V 18M-Bit 2M x 8 0.45ns 165-Pin FBGA Tray |
| GJM1555C1H1R6CB01D | murata electronics | Cap Ceramic 1.6pF 50V C0G 0.25pF SMD 0402 125°C Paper T/R |
| GS8182R09BD-250I | gsi technology | SRAM Chip Sync Single 1.8V 18M-Bit 2M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| GQM2195C2E1R5BB12D | murata electronics | Cap Ceramic 1.5pF 250V C0G 0.1pF SMD 0805 125°C Paper T/R |
| GS8182R18BD-300 | gsi technology | SRAM Chip Sync Single 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray |
| GRM1555C1HR75CA01D | murata electronics | Cap Ceramic 0.75pF 50V C0G 0.25pF SMD 0402 125°C Paper T/R |
| GS8182S08BD-250 | gsi technology | SRAM Chip Sync Dual 1.8V 18M-Bit 2M x 8 0.45ns 165-Pin FBGA Tray |
| EFO-B1695B5 | Panasonic | 共振器 SMD B Type Ceramic Resonator |
| GS8182S09BD-200I | gsi technology | SRAM Chip Sync Dual 1.8V 18M-Bit 2M x 9-Bit 0.45ns 165-Pin FBGA Tray |
| MS17341C8A1 | Glenair | Circular MIL Spec Strain Reliefs & Adapters |
| GS8182T18BD-400 | gsi technology | SRAM Chip Sync Single 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA Tray |
| 140-50N5-200J-TR | Xicon | Ceramic Disc Capacitors 50V 20pF NPO 5% Tol |
| GS832018GT-225I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 36M-Bit 2M x 18 7ns/2.7ns 100-Pin TQFP Tray |
| 521-010NF02B | Glenair | Circular MIL Spec Backshells |
| GS832036GT-225I | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 36M-Bit 1M x 36 7ns/2.7ns 100-Pin TQFP Tray |
| HF01B02DP-LF | monolithic power systems | OFF-LINE HIGH VOLTAGE QUASI RESONANT REGULATOR |
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