规格参数 > 第87723页
GX24064-TCI-BBI-MCE 现货价格参数; 6828848-8 现货价格参数; 380FS019NF1006TA3 现货价格参数; BTNKT110380 现货价格参数; AC0805JR-071ML 现货价格参数; BTNKT110390 现货价格参数; 69001661 现货价格参数; 69001883 现货价格参数; MVY6.3VC152M10X10TP 现货价格参数; 531/9/04520/023 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| GX24064-TCI-BBI-MCE | Matrix Orbital | LCD Graphic Display Modules & Accessories 240x64 Black Text TriColor Inverse B/G |
| 6828848-8 | te connectivity / amp | FO C/A LC YEL LC YEL 62.5 ORN |
| 380FS019NF1006TA3 | Glenair | Circular MIL Spec Backshells NON ENV STRN RLF DC LOWSTRT3RING MED DTY |
| BTNKT110380 | c&k components | |
| AC0805JR-071ML | Yageo | 厚膜抵抗器 - SMD 1/8W 1M ohm 5% |
| BTNKT110390 | c&k components | |
| 69001661 | pny technologies inc. | 128MB CF (TOSHIBA) |
| 69001883 | pny technologies inc. | 1GB,ECC,REG, 184 PIN DIMM. |
| MVY6.3VC152M10X10TP | United Chemi-Con | Aluminum Electrolytic Capacitors - SMD 1500uF 6.3V |
| 531/9/04520/023 | Glenair | Circular MIL Spec Tools, Hardware & Accessories |
| UZS0J220MCR1GB | Nichicon | Aluminum Electrolytic Capacitors - SMD 22uF 6.3V 85c Chip 20% |
| 69002014-T | pny technologies inc. | 1GB MODULE |
| 69002653-T | pny technologies inc. | 2GB,ECC,REG,DDR3-1066 DIMM |
| L0603C18NJRMST | kemet | Ind Chip Multi-Layer 18nH 5% 100MHz 12Q-Factor 300mA 0603 T/R |
| 69002706-T | pny technologies inc. | 1GB DIMM VGTPNYMD1024SD@-800 - 1GB DIMM RAM |
| 1915082-17 | Glenair | Circular MIL Spec Backshells |
| 69002708-T | pny technologies inc. | 1GIG DD2 SODIM,I |
| L78M06CDT-TR | stmicroelectronics | Standard Regulator Pos 6V 0.5A 3-Pin(2+Tab) DPAK T/R |
| NK562000JA20 | Vishay / Sfernice | 金属被膜抵抗器 - スルーホール T5. 6K2 5% AM500 e3 |
| L9338DTR | stmicroelectronics | Power Switch Lo Side 20-Pin SO T/R |
| UMA1C100MDA1TP | Nichicon | Aluminum Electrolytic Capacitors - Leaded 10UF 16V |
| 69192-206HTLF | fci sa | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole Tube |
| 431-002NFA03B02C02D02 | Glenair | Circular MIL Spec Backshells |
| 69F02064 | pny technologies inc. | 128 MB LABELED USB |
| GRP0335C1E560JD01C | Murata Electronics | Multilayer Ceramic Capacitors MLCC - SMD/SMT 0201 56pF 25volt C0G +/-5% |
| 69F02080 | pny technologies inc. | 512MB FLASH DRIVE |
| LCW-102-13-S-M-230-RP | samtec inc. | Conn Wire to Board HDR 2 POS 2.54mm Solder RA Thru-Hole |
| 69F02178-T | pny technologies inc. | 2GB MINI-SWING USB DRIVE |
| LCW-108-09-G-S-230-RE | samtec inc. | Conn Wire to Board HDR 8 POS 2.54mm Solder RA Thru-Hole |
| 69F02251-T | pny technologies inc. | 1GB USB |
| LCW-110-15-T-S-230-RE | samtec inc. | Conn Wire to Board HDR 10 POS 2.54mm Solder RA Thru-Hole |
| 69F02456-T | pny technologies inc. | 1GB W/ PHISON 2231ED |
| LCW-111-09-G-S-230-RA | samtec inc. | Conn Wire to Board HDR 11 POS 2.54mm Solder RA Thru-Hole |
| 69V02120-T | pny technologies inc. | 7600GT CARD, ROHS |
| LCW-112-08-L-S-230 | samtec inc. | Conn Wire to Board HDR 12 POS 2.54mm Solder ST Thru-Hole |
| M28840/14AE1S4 | Glenair | Circular MIL Spec Connector JAM NUT MT RCPT CONN CLASS D |
| LD055A221FAB2A | avx | Cap Ceramic 220pF 50V C0G 1% SMD 0805 125°C Paper T/R |
| 69V02659-T | pny technologies inc. | GF8400GS-256K |
| LDB212G1005C-001*EPOD | murata electronics | HYBRID BALUN, CHIP MULTILAYER - SAMPLES |
| GA801LC1C177C | Glenair | Circular MIL Spec Backshells |
| LDBCC3100JC5N | kemet | SMT FILM CAP,1812,.1UF,50V,W3.3,H2.0,L4.7,TR,HAZMAT |
| 3PCV-06-008 | te connectivity / buchanan-rdi | Conn Barrier Strip 6 POS 6.35mm Solder ST Thru-Hole 10A/Contact |
| LDEEC2150JA5N00 | kemet | |
| 7-146497-9 | te connectivity / amp | Conn Board Stacker HDR 58 POS 2.54mm Solder ST Thru-Hole |
| M85049/111S14TN05-6D | Glenair | Circular MIL Spec Backshells |
| 7-1906072-4 | te connectivity / amp | C/A FO LC YLW SC ZIPCORD XG AQ |
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