规格参数 > 第86379页
TF-MT70-A10-DEV 现货价格参数; 72V241L10J8 现货价格参数; B37930K5270J060 现货价格参数; 72V271LA10PFG8 现货价格参数; TF-NANOCOM-U15-A10-01 现货价格参数; 72V271LA20TF 现货价格参数; MS27484E18B96P 现货价格参数; 72V295L15PFI8 现货价格参数; TF-NANOCOM-U15-A10-03 现货价格参数; 72V36100L10PF 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| TF-MT70-A10-DEV | aaeon electronics inc | DM355 ARM 9 DEVELOPMENT SYSTEM, MT70, LCD, POWER SUPPLY, BSP |
| 72V241L10J8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 4K x 9 32-Pin PLCC T/R |
| B37930K5270J060 | EPCOS | Multilayer Ceramic Capacitors MLCC - SMD/SMT 27PF +/-5% MLCC |
| 72V271LA10PFG8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 32K x 9 64-Pin TQFP T/R |
| TF-NANOCOM-U15-A10-01 | aaeon electronics inc | COM EXPRESS.Z530(1.6GHZ).US15W.DDRII SO-DIMM.GBE.SATA.USB2.0 |
| 72V271LA20TF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 32K x 9 64-Pin STQFP |
| MS27484E18B96P | Amphenol Aerospace | Circular MIL Spec Connector 9P STRT PLUG SZ 18 GRND SPRING PIN CRMP |
| 72V295L15PFI8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 128K x 18 64-Pin TQFP T/R |
| TF-NANOCOM-U15-A10-03 | aaeon electronics inc | NANOCOM MODULE W/ ATOM Z530 (1.6GHZ) + SSD (INSTEAD OF SATA) |
| 72V36100L10PF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 64K x 36 128-Pin TQFP |
| TF-NANOCOM-U15-A20-03 | aaeon electronics inc | NANOCOM EXPRESS.Z530 (1.6GHZ).US15W.DDRII 1GB.GBE.4GB SSD.US |
| 72V36110L6PF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 128K x 36 128-Pin TQFP |
| TF-ONYX-1522 | aaeon electronics inc | 15ZZZ MEDICAL PANEL PC |
| 72V3641L15PFG8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Bi-Dir 1K x 36 120-Pin TQFP T/R |
| TF-ONYX-BE150HTT-C1 | aaeon electronics inc | 15.6ZZZ(16:9) MEDCIAL PANEL PC W/ATOM 1.6GHZ,2GB,160GB HD,4USB |
| 140-ESRL100V100-RC | Xicon | Aluminum Electrolytic Capacitors - Leaded 100V 100uF 105C |
| TF-ONYX-BE180DT-C1-1010 | aaeon electronics inc | 18.5ZZZ (16:9) MEDCIAL FANLESS BEDSIDE PANEL ATOM 1.6GHZ |
| 72V3680L7-5PFI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 16K x 36 128-Pin TQFP |
| TF-ONYX-BE180DT-C2-1010 | aaeon electronics inc | 18.5ZZZ (16:9) MEDCIAL FANLESS BEDSIDE PANEL C2D 2.0GHZ |
| 735159-0 | te connectivity / amp | PIDG Quick Disconnect Terminal 13.5-15.5AWG F Loose Piece |
| 140-ESRL16V2200-RC | Xicon | Aluminum Electrolytic Capacitors - Leaded 16V 2200uF 105C |
| TF-PCM-5401-A10 | aaeon electronics inc | PC104 SBC W/AMD LX800 CPU |
| 740X043561JP | cts components | Res Thick Film Array 560 Ohm 5% 1/16W ±200ppm/°C ISOL Molded 4-Pin 0302(2 X 0201) Convex SMD Paper T/R |
| TF-PCM-5895-A10 | aaeon electronics inc | 5.25ZZZBOARD W/LX800 500MHZ, 18-BIT LVDS, DDR, LAN, 4COM, USB2 |
| C0603C560F4GAC | Kemet | マルチレイヤーセラミックキャパシタ MLCC - SMD/SMT 56.0PF 16.0V |
| B37941K5332K60 | EPCOS | Multilayer Ceramic Capacitors MLCC - SMD/SMT 3300pF 50volts X7R 10% |
| TF-PCM-5895-A10-01 | aaeon electronics inc | 5.25ZZZBOARD W/LX800 500MHZ, 24-BIT LVDS, DDR, LAN, 4COM, USB2 |
| TF-PER-A016 | aaeon electronics inc | CP COOLER FOR COM 810 |
| 741C083820JP | cts components | Res Thick Film Array 82 Ohm 5% 1/4W ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Concave SMD Paper T/R |
| TF-PER-A036 | aaeon electronics inc | PASSIVE HEAT-SINK FOR ETX-700.ON-BOARD CPU.FULL SIZE |
| 741X043101JP | cts components | Res Thick Film Array 100 Ohm 5% 1/8W ±200ppm/°C ISOL Molded 4-Pin 0404(2 X 0402) Convex SMD Paper T/R |
| 741X043220JP | cts components | Res Thick Film Array 22 Ohm 5% 1/8W ±200ppm/°C ISOL Molded 4-Pin 0404(2 X 0402) Convex SMD Paper T/R |
| TF-PER-A074 | aaeon electronics inc | PASSIVE HEAT-SINK.FOR COM-45GS.ON-BOARD CPU |
| TF-PER-A084 | aaeon electronics inc | PASSIVE HEAT-SINK.FOR COM-LN.ON-BOARD CPU |
| 741X043330JP | cts components | Res Thick Film Array 33 Ohm 5% 1/8W ±200ppm/°C ISOL Molded 4-Pin 0404(2 X 0402) Convex SMD Paper T/R |
| TF-PER-A093 | aaeon electronics inc | PASSIVE HEAT-SINK.FOR NANOCOM-U15.ON-BOARD CPU |
| 741X043823JP | cts components | Res Thick Film Array 82K Ohm 5% 1/8W ±200ppm/°C ISOL Molded 4-Pin 0404(2 X 0402) Convex SMD Paper T/R |
| TF-PER-C10L-A10-01 | aaeon electronics inc | MINI PCI 10/100 BASE-TX ETHERNET MODULE W/INTEL 82551QM |
| 741X083102JP | cts components | Res Thick Film Array 1K Ohm 5% 1/4W ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Paper T/R |
| TF-PER-C10L-A10-03 | aaeon electronics inc | MINI PCI 2-PORT SATA MODULE.REV.A1.0 |
| 741X083121JP | cts components | Res Thick Film Array 120 Ohm 5% 1/4W ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Paper T/R |
| TF-PER-C40C-A10 | aaeon electronics inc | MINI-PCI 2-PORT RS-232 MODULE |
| 741X083270JP | cts components | Res Thick Film Array 27 Ohm 5% 1/4W ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Paper T/R |
| TF-PER-C40C-A10-01 | aaeon electronics inc | MINI-PCI 4-PORT RS-232 MODULE |
| 741X08347R0FP | cts components | Res Thick Film Array 47 Ohm 1% 1/4W ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Paper T/R |
| 741X0836803FP | cts components | Res Thick Film Array 680K Ohm 1% 1/4W ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Paper T/R |
| TF-PER-U000A | aaeon electronics inc | AAEON |
| TF-PER-V04B-A10 | aaeon electronics inc | SDVO TO LVDS MODULE |
| 741X083683JP | cts components | Res Thick Film Array 68K Ohm 5% 1/4W ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Paper T/R |
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