规格参数 > 第85987页
72V201L15PFI8 现货价格参数; ERJ-B2CJR036V 现货价格参数; 72V205L15PF 现货价格参数; TRX08GVP2530 现货价格参数; 72V205L15PF8 现货价格参数; TRX08GVP5310 现货价格参数; 72V2101L15PF8 现货价格参数; M85049/2115W02 现货价格参数; 72V2101L15PFI 现货价格参数; LLQ2D122MHSC 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 72V201L15PFI8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 256 x 9 32-Pin TQFP T/R |
| ERJ-B2CJR036V | Panasonic | 厚膜抵抗器 - SMD 5%, 0.036ohm,0.5W |
| 72V205L15PF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 256 x 18 64-Pin TQFP |
| TRX08GVP2530 | fci sa | SCFF 850NM 8G FIBER CHANNEL |
| 72V205L15PF8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 256 x 18 64-Pin TQFP T/R |
| TRX08GVP5310 | fci sa | SFP+ 1310NM 8G FIBER CHANNEL |
| 72V2101L15PF8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 256K x 9 64-Pin TQFP T/R |
| M85049/2115W02 | Amphenol PCD | Circular MIL Spec Backshells BACKSHELL NON ENV ST OD CAD SZ 15 |
| 72V2101L15PFI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 256K x 9 64-Pin TQFP |
| LLQ2D122MHSC | Nichicon | Aluminum Electrolytic Capacitors - Snap In 200volts 1200uF 35x35 20% 10LS |
| 72V2111L20PF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 512K x 9 64-Pin TQFP |
| TS024HAACD01-00 | tianma microelectronics | ZZZ2.4ZZZZZZ QVGAZZZ |
| 72V2113L6PF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 256K x 18/512K x 9 80-Pin TQFP |
| TS104SAATC01-00 | tianma microelectronics | 10.4ZZZSVGA, 700 NIT, LED |
| 72V221L15JI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 1K x 9 32-Pin PLCC |
| M85049/2123W07C | Amphenol PCD | Circular MIL Spec Backshells BACKSHELL NON ENV ST OD CAD SZ 23 |
| 72V225L15TF8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 1K x 18 64-Pin STQFP T/R |
| TS3000B3ADFN-8 | integrated device technology (idt) | TDFN-8 TEMP SENSOR |
| 72V245L10PFG8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 4K x 18 64-Pin TQFP T/R |
| UWF1V220MCR1GB | Nichicon | Aluminum Electrolytic Capacitors - SMD |
| 72V245L20PF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 4K x 18 64-Pin TQFP |
| M85049/7-13W | Amphenol PCD | Circular MIL Spec Backshells BACKSHELL ENV 45 DEG OD CAD |
| 72V251L15JI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 8K x 9 32-Pin PLCC |
| UVR0J331MDA | Nichicon | Aluminum Electrolytic Capacitors - Leaded 330uF 6.3V 6.3x11 |
| 72V253L6BCG | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 4K x 18/8K x 9 100-Pin CABGA |
| UVZ1E332MHH | Nichicon | Aluminum Electrolytic Capacitors - Leaded |
| 72V253L7-5PF8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 4K x 18/8K x 9 80-Pin TQFP T/R |
| 72V255LA20PFG | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 8K x 18 64-Pin TQFP |
| D38999/20JC35BA | Amphenol Aerospace | Circular MIL Spec Connector 22P WL MNT RECPT SZ 13 |
| TSC2301IZQZ | rochester electronics | |
| 72V263L10PFI8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 8K x 18/16K x 9 80-Pin TQFP T/R |
| TSE2002BC3DFN-8 | integrated device technology (idt) | TDFN-8 TEMP SENSOR |
| 72V263L15PF8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 8K x 18/16K x 9 80-Pin TQFP T/R |
| FKP4T022206A00JH00 | WIMA | フィルムコンデンサ FKP 4 0.022 uF 1600 VDC 9x19x31.5 PCM27.5 |
| 72V265LA15TF8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 16K x 18 64-Pin STQFP T/R |
| DME2P22K | Cornell Dubilier | Film Capacitors DME 250V.22 |
| 72V273L6PFG | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 16K x 18/32K x 9 80-Pin TQFP |
| TSV6391AICT | stmicroelectronics | OP Amp Single GP R-R I/O 5.5V 5-Pin SC-70 T/R |
| 72V275L10TFG8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 32K x 18 64-Pin STQFP T/R |
| TSW-103-08-G-D | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole |
| 72V275L15TF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 32K x 18 64-Pin STQFP Tray |
| TSW-107-08-S-S-LC | samtec inc. | Conn Unshrouded Header HDR 7 POS 2.54mm Solder ST Thru-Hole |
| 72V275L15TFGI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 32K x 18 64-Pin STQFP |
| TSW-109-24-F-D | samtec inc. | Conn Unshrouded Header HDR 18 POS 2.54mm Solder ST Thru-Hole |
| 72V275L15TFGI8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 32K x 18 64-Pin STQFP T/R |
| TSW4200 | texas instruments | TSW4200 |
| 72V275L20PF8 | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 32K x 18 64-Pin TQFP T/R |
| TVOUT-7 | ibase technology (usa) inc. | AC, TV-OUT CABLE FOR (IB840/IB850, MICROAGP) |
| 72V281L15PFI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 64K x 9 64-Pin TQFP |
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