规格参数 > 第82383页
GS882Z18CGB-200I 现货价格参数; M55342K05B5H60RS2 现货价格参数; GS882Z18CGB-250 现货价格参数; M55342K05B60D4SWB 现货价格参数; GS882Z18CGB-250IV 现货价格参数; RLP0130R50FS00MG7 现货价格参数; GS882Z18CGB-250V 现货价格参数; M55342K05B61E9RS2 现货价格参数; GS882Z18CGD-150I 现货价格参数; EGG.0B.660.ZZE 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| GS882Z18CGB-200I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 6.5ns/3ns 119-Pin FBGA Tray |
| M55342K05B5H60RS2 | vishay / dale | Res Thick Film 2208 5.6K Ohm 2% 9/40W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| GS882Z18CGB-250 | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 5.5ns/2.5ns 119-Pin FBGA Tray |
| M55342K05B60D4SWB | vishay / dale | Res Thick Film 2208 60.4 Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| GS882Z18CGB-250IV | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 9M-Bit 512K x 18 5.5ns/3ns 119-Pin FBGA Tray |
| RLP0130R50FS00MG7 | Vishay / Sfernice | 巻き線型巻線型抵抗器 - スルーホール RLP 1 MG7 30U5 1% BA100NA e1 |
| GS882Z18CGB-250V | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 9M-Bit 512K x 18 5.5ns/3ns 119-Pin FBGA Tray |
| M55342K05B61E9RS2 | vishay / dale | Res Thick Film 2208 61.9K Ohm 1% 9/40W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| GS882Z18CGD-150I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 7.5ns/3.8ns 165-Pin FBGA Tray |
| EGG.0B.660.ZZE | LEMO | Circular Push Pull Connectors FEMALE CRIMP CONT NUT FIXING |
| M55342K05B68D1RS2 | vishay / dale | Res Thick Film 2208 68.1 Ohm 1% 9/40W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| GS882Z18CGD-200IV | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 9M-Bit 512K x 18 6.5ns/3ns 165-Pin FBGA Tray |
| M55342K05B68D1SS3 | vishay / dale | Res Thick Film 2208 68.1 Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| GS882Z18CGD-250I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 5.5ns/2.5ns 165-Pin FBGA Tray |
| M55342K05B68E1SWB | vishay / dale | Res Thick Film 2208 68.1K Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| GS882Z18CGD-250IV | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 9M-Bit 512K x 18 5.5ns/3ns 165-Pin FBGA Tray |
| M55342K05B68H0SS2 | vishay / dale | Res Thick Film 2208 68K Ohm 2% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| GS882Z18CGD-250V | gsi technology | SRAM Chip Sync Dual 1.8V/2.5V 9M-Bit 512K x 18 5.5ns/3ns 165-Pin FBGA Tray |
| M55342K05B6E04STP | vishay / dale | Res Thick Film 2208 6.04K Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| AT28C256F-20PC | Atmel | EEPROM 256K FAST PROG SDP- 200NS COM TEMP |
| M55342K05B6E81PS2 | vishay / dale | Res Thick Film 2208 6.81K Ohm 1% 9/40W ±100ppm/°C 0.1% Molded SMD SMD T/R |
| DCP4K05600SS1BKY00 | WIMA | Film Capacitors DC-LINK MKP 4 60.0 uF 700 VDC 37x54x56 SN |
| M55342K05B6E81SS2 | vishay / dale | Res Thick Film 2208 6.81K Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| FFA.1S.303.CLAZ | LEMO | Circular Push Pull Connectors STRAIGHT PLUG CABLE COLLET |
| AT28HC256E-70SI | Atmel | EEPROM 256K HI-ENDURANCE SDP - 70NS IND TEMP |
| 2508051216Y3 | Fair-Rite | EMI Filter Beads, Chokes & Arrays CHZ0.9/1.3/2-Y3-121 |
| M55342K05B750HRS3 | vishay / dale | Res Thick Film 2208 750K Ohm 2% 9/40W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| GS882Z36CB-150 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 9M-Bit 256K x 36 7.5ns/3.8ns 119-Pin FBGA Tray |
| M55342K05B75E0SS3 | vishay / dale | Res Thick Film 2208 75K Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| GS882Z36CB-150IV | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 9M-Bit 256K x 36 7.5ns/3.8ns 119-Pin FBGA Tray |
| M55342K05B787DRTP | vishay / dale | Res Thick Film 2208 787 Ohm 1% 9/40W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| M55342K05B7E50SS6 | vishay / dale | Res Thick Film 2208 7.5K Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| GS882Z36CB-250 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 9M-Bit 256K x 36 5.5ns/2.5ns 119-Pin FBGA Tray |
| M55342K05B80D6RTP | vishay / dale | Res Thick Film 2208 80.6 Ohm 1% 9/40W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| GS882Z36CB-250IV | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 9M-Bit 256K x 36 5.5ns/3ns 119-Pin FBGA Tray |
| M55342K05B825DSS6 | vishay / dale | Res Thick Film 2208 825 Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| GS882Z36CB-300I | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 9M-Bit 256K x 36 5ns/2.5ns 119-Pin FBGA Tray |
| M55342K05B82D5SS2 | vishay / dale | Res Thick Film 2208 82.5 Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| GS882Z36CD-150 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 9M-Bit 256K x 36 7.5ns/3.8ns 165-Pin FBGA Tray |
| GS882Z36CD-150IV | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 9M-Bit 256K x 36 7.5ns/3.8ns 165-Pin FBGA Tray |
| AT17F16A-30JI | Atmel | Memory - FPGA Configuration FPGA SERIAL CONFIG 30MHZ IND TEMP |
| GS882Z36CD-150V | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 9M-Bit 256K x 36 7.5ns/3.8ns 165-Pin FBGA Tray |
| M55342K05B82E5SS2 | vishay / dale | Res Thick Film 2208 82.5K Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| GS882Z36CD-200V | gsi technology | SRAM Chip Sync Quad 1.8V/2.5V 9M-Bit 256K x 36 6.5ns/3ns 165-Pin FBGA Tray |
| M55342K05B845DRS2 | vishay / dale | Res Thick Film 2208 845 Ohm 1% 9/40W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| M55342K05B84E5RTP | vishay / dale | Res Thick Film 2208 84.5K Ohm 1% 9/40W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| GS882Z36CD-250 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 9M-Bit 256K x 36 5.5ns/2.5ns 165-Pin FBGA Tray |
| M55342K05B88D7RS6 | vishay / dale | Res Thick Film 2208 88.7 Ohm 1% 9/40W ±100ppm/°C 0.01% Molded SMD SMD T/R |
| GS882Z36CD-300I | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 9M-Bit 256K x 36 5ns/2.5ns 165-Pin FBGA Tray |
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