规格参数 > 第79120页
EP7312-IVZ 现货价格参数; HDWM-13-59-G-D-400-SM 现货价格参数; EP9315-IBZ 现货价格参数; HDWM-13-59-S-S-524-SM-001 现货价格参数; EQDP-014-36.00-SEU-SED-1 现货价格参数; HDWM-14-53-G-D-260-SM-A-P 现货价格参数; ER432DM4-26B/G 现货价格参数; HDWM-14-53-G-D-320-SM-A-P 现货价格参数; ERJ-12YJ301U 现货价格参数; HDWM-14-55-S-D-335-SM 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| EP7312-IVZ | cirrus logic | System On Chip with SDRAM and Enhanced Digital Audio Interface 208-Pin LQFP |
| HDWM-13-59-G-D-400-SM | samtec inc. | Conn Board Stacker HDR 26 POS 1.27mm Solder ST SMD |
| EP9315-IBZ | cirrus logic | System-on-Chip Processor 352-Pin BGA |
| HDWM-13-59-S-S-524-SM-001 | samtec inc. | Conn Board Stacker HDR 13 POS 1.27mm Solder ST SMD |
| EQDP-014-36.00-SEU-SED-1 | samtec inc. | Cable Assembly Twin-ax 0.914m 30AWG 28 POS Micro High Speed Socket to 28 POS Micro High Speed Socket SKT-SKT Solder-Solder Bulk |
| HDWM-14-53-G-D-260-SM-A-P | samtec inc. | Conn Board Stacker HDR 28 POS 1.27mm Solder ST SMD |
| ER432DM4-26B/G | teledyne relays | Electromechanical Relay DPDT 1ADC/0.25AAC 26.5VDC 3.3KOhm Through Hole |
| HDWM-14-53-G-D-320-SM-A-P | samtec inc. | Conn Board Stacker HDR 28 POS 1.27mm Solder ST SMD |
| ERJ-12YJ301U | panasonic | Res Thick Film 1812 300 Ohm 5% 3/4W ±200ppm/°C Molded SMD SMD Embossed Carrier T/R |
| HDWM-14-55-S-D-335-SM | samtec inc. | Conn Board Stacker HDR 28 POS 1.27mm Solder ST SMD Tube |
| ERJ-1GEF823C | panasonic | Res Thick Film 0201 82K Ohm 1% 1/20W ±200ppm/°C Molded SMD SMD Pressed Carrier T/R |
| HDWM-14-56-S-D-300-016 | samtec inc. | Conn Board Stacker HDR 28 POS 1.27mm Solder ST Thru-Hole |
| ES2F-E3/52T | vishay / semiconductor | Diode Switching 300V 2A 2-Pin SMB T/R |
| HDWM-14-56-S-D-300-017 | samtec inc. | Conn Board Stacker HDR 28 POS 1.27mm Solder ST Thru-Hole |
| DMT2P1K | Cornell Dubilier | Film Capacitors DMT 200V 0.1uF 10% RADIAL |
| HDWM-14-56-S-D-300-020 | samtec inc. | Conn Board Stacker HDR 28 POS 1.27mm Solder ST Thru-Hole |
| ESQT-109-02-G-D-755 | samtec inc. | Conn Elevated Socket SKT 18 POS 2mm Solder ST Thru-Hole |
| HDWM-14-56-S-D-300-028 | samtec inc. | Conn Board Stacker HDR 28 POS 1.27mm Solder ST Thru-Hole |
| EV-64115-5231 | marvell | GT-64115 PCI DEVELOPMENT BOARD WITH RM5231 CPU, INCLUDES 16 |
| HDWM-14-56-S-S-395-SM | samtec inc. | Conn Board Stacker HDR 14 POS 1.27mm Solder ST SMD Tube |
| EV-64120-CM | marvell | 512KB LEVEL 2 CACHE MODULE FOR R5000 |
| HDWM-15-53-G-D-255-SM-P | samtec inc. | Conn Board Stacker HDR 30 POS 1.27mm Solder ST SMD |
| EV-64BP-5V | marvell | 32-BIT/64-BIT PCI PASSIVE BACKPLANE WITH 3.3V AND 5V, 33MHZ |
| HDWM-15-53-G-D-358-SM-A | samtec inc. | Conn Board Stacker HDR 30 POS 1.27mm Solder ST SMD |
| EVAL-AD5933EB | analog devices | Evaluation Board For AD5933 |
| HDWM-40-59-S-D-585-SM-A | samtec inc. | Conn Board Stacker HDR 80 POS 1.27mm Solder ST SMD |
| EVAL-AD7277CB | analog devices | Evaluation Board For 3 MSPS, 12-/10-/8-Bit ADCs In 6-Lead Tsot |
| HDWM-48-59-S-D-470-SM-A | samtec inc. | Conn Board Stacker HDR 96 POS 1.27mm Solder ST SMD |
| EVAL-PRAOPAMP | analog devices | Evaluation Board For, Zero-Drift, Single-Supply, Rail-To-Rail Input/Output Operational Amplifier |
| RN73H1JTTD2800D100 | KOA Speer | 薄膜抵抗器 - SMD 1/10W 280 ohm 0.50% 100ppm |
| EX128-TQG64 | microsemi | FPGA eX Family 4K Gates 256 Cells 250MHz 0.22um (CMOS) Technology 2.5V 64-Pin TQFP |
| RN73H1JTTD8662C25 | KOA Speer | Thin Film Resistors - SMD 1/10W 86.6K ohm .25% 25ppm |
| EX256-PTQG100 | microsemi | FPGA eX Family 8K Gates 512 Cells 0.22um (CMOS) Technology 2.5V 100-Pin TQFP |
| PHG.0K.309.CLLC45 | LEMO | Circular Push Pull Connectors 9P SOLDER SCKT RECPT CABLE COLLET 5.2MM |
| EX64-PTQ64 | microsemi | FPGA eX Family 2K Gates 128 Cells 0.22um (CMOS) Technology 2.5V 64-Pin TQFP |
| MC8641VU1000NC | Freescale Semiconductor | Microprocessors - MPU G8 REV 2.1 0.95V 105C |
| 108-2300-501 | Johnson / Emerson Connectivity Solutions | Test Plugs & Test Jacks BANANA JACK UNINSUL |
| EX64-PTQ64I | microsemi | FPGA eX Family 2K Gates 128 Cells 0.22um (CMOS) Technology 2.5V 64-Pin TQFP |
| RLP104R220FB25 | Vishay / Sfernice | Wirewound Resistors - Through Hole RLP 10 4U22 1% BO50 e1 |
| EX64-PTQG64 | microsemi | FPGA eX Family 2K Gates 128 Cells 0.22um (CMOS) Technology 2.5V 64-Pin TQFP |
| HF70SH35X0.8X12 | tdk | Ferrite Core EMI Suppression Core 39mm 12mm 4mm Flat Cable and Flexible Substrate |
| EXB-28V103GX | panasonic | Res Thick Film Array 10K Ohm 2% ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Paper T/R |
| C2012X7R1H103J | TDK | Multilayer Ceramic Capacitors MLCC - SMD/SMT |
| EXB-E10C750J | panasonic | Res Thick Film NET 75 Ohm 5% ±200ppm/°C BUS Molded 10-Pin 1608 Concave SMD Punched Carrier T/R |
| 111-0112-001 | Johnson / Emerson Connectivity Solutions | Test Plugs & Test Jacks BINDING POST VIOLET |
| EXB-S8V474J | panasonic | Res Thick Film Array 470K Ohm 5% ±200ppm/°C ISOL Molded 8-Pin 2008(4 X 0805) Concave SMD Embossed Carrier T/R |
| PHG.0K.305.CYMC50 | LEMO | Circular Push Pull Connectors 5P CRIMP SCKT RECEPT CABLE COLLET 5.2MM |
| EXB-S8V680J | panasonic | Res Thick Film Array 68 Ohm 5% ±200ppm/°C ISOL Molded 8-Pin 2008(4 X 0805) Concave SMD Embossed Carrier T/R |
| HFA1112IPZ | intersil | OP Amp Single GP ±5.5V 8-Pin PDIP |
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