规格参数 > 第73857页
CWR19JB475KCEZ 现货价格参数; MME1P40S-0300(201) 现货价格参数; GS8342R08GE-167 现货价格参数; CWR19JB685JBEC 现货价格参数; MME1P57P-23 现货价格参数; GS8342R08GE-250 现货价格参数; CWR19JC106KBEZ 现货价格参数; GS8342R08GE-250I 现货价格参数; MME1P57P-23(204) 现货价格参数; CWR19JC226KCGB 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| CWR19JB475KCEZ | avx | Cap Tant Solid 4.7uF 20V E CASE 10% (5.08 X 2.54 X 1.27mm) SMD (0.01%FR) 6 Ohm 125°C Bulk |
| MME1P40S-0300(201) | te connectivity / amp | Conn Rectangular SKT 40 POS Crimp ST Cable Mount |
| GS8342R08GE-167 | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 4M x 8 0.5ns 165-Pin FBGA Tray |
| CWR19JB685JBEC | avx | Cap Tant Solid 6.8uF 20V E CASE 5% (5.08 X 2.54 X 1.27mm) SMD (0.1%FR) Bulk |
| MME1P57P-23 | te connectivity / amp | ARINC 404 MILITARY |
| GS8342R08GE-250 | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 4M x 8 0.45ns 165-Pin FBGA Tray |
| CWR19JC106KBEZ | avx | Cap Tant Solid 10uF 20VDC 10% 5.08 X 2.54 X 1.27mm SMD 0.1%(FR) Bulk |
| GS8342R08GE-250I | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 4M x 8 0.45ns 165-Pin FBGA Tray |
| MME1P57P-23(204) | te connectivity / amp | ARINC 404 MILITARY |
| CWR19JC226KCGB | avx | Cap Tant Solid 22uF 20VDC 10% 6.73 X 2.79 X 2.79mm SMD 0.01%(FR) Bulk |
| CWR19JC226KCGC | avx | Cap Tant Solid 22uF 20V G CASE 10% (6.73 X 2.79 X 2.79mm) SMD (0.01%FR) 2.5 Ohm 125°C Bulk |
| GS8342R08GE-300 | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 4M x 8 0.45ns 165-Pin FBGA Tray |
| MME1R26P-7601(204) | te connectivity / amp | |
| CWR19JC335KBDZ | avx | Cap Tant Solid 3.3uF 20V D CASE 10% (3.81 X 2.54 X 1.27mm) SMD (0.1%FR) Bulk |
| GS8342R08GE-300I | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 4M x 8 0.45ns 165-Pin FBGA Tray |
| MME1R45P-0001(200) | te connectivity / amp | |
| CWR19JC476KCHA | avx | Cap Tant Solid 47uF 20VDC 10% 7.24 X 3.81 X 2.79mm SMD 0.01%(FR) Bulk |
| GS8342R18GE-167 | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 2M x 18 0.5ns 165-Pin FBGA Tray |
| CWR19JC685KCEZTR | avx | Cap Tant Solid 6.8uF 20V E CASE 10% (5.08 X 2.54 X 1.27mm) SMD (0.01%FR) 5 Ohm 125°C T/R |
| GS8342R36GE-200 | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 1M x 36 0.45ns 165-Pin FBGA Tray |
| MME2P106P106P-7101(204) | te connectivity / amp | ARINC 404 |
| CWR19JK106KCEA | avx | Cap Tant Solid 10uF 20VDC 10% 5.08 X 2.54 X 1.27mm SMD 0.01%(FR) Bulk |
| GS8342R36GE-250 | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 1M x 36 0.45ns 165-Pin FBGA Tray |
| MME2P33C4S106P-29(204) | te connectivity / amp | ARINC 404 |
| CWR19JK106KCEZ | avx | Cap Tant Solid 10uF 20V E CASE 10% (5.08 X 2.54 X 1.27mm) SMD (0.01%FR) Bulk |
| GS8342R36GE-250I | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 1M x 36 0.45ns 165-Pin FBGA Tray |
| MME2P33C4SD8S-00(204) | te connectivity / amp | |
| CWR19JK336JCHB | avx | Cap Tant Solid 33uF 20VDC 5% 7.24 X 3.81 X 2.79mm SMD 0.01%(FR) Bulk |
| GS8342R36GE-300 | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 1M x 36 0.45ns 165-Pin FBGA Tray |
| GS8342S08GE-167I | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 8 0.5ns 165-Pin FBGA Tray |
| CWR19JK336JCHZ | avx | Cap Tant Solid 33uF 20VDC 5% 7.24 X 3.81 X 2.79mm SMD 0.01%(FR) Bulk |
| MME2PC8S106P-2222(204) | te connectivity / amp | ARINC 404 |
| GS8342S08GE-200 | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 8 0.45ns 165-Pin FBGA Tray |
| CWR19JK476MCHC | avx | Cap Tant Solid 47uF 20V H CASE 20% (7.24 X 3.81 X 2.79mm) SMD (0.01%FR) 0.9 Ohm 125°C Bulk |
| MME2R106P26S-00 | te connectivity / amp | ARINC 404 - MILITARY |
| GS8342S08GE-250 | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 8 0.45ns 165-Pin FBGA Tray |
| CWR19KB226KBGZTR | avx | Cap Tant Solid 22uF 25V G CASE 10% (6.73 X 2.79 X 2.79mm) SMD (0.1%FR) 1.4 Ohm 125°C T/R |
| GS8342S08GE-300 | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 8 0.45ns 165-Pin FBGA Tray |
| CWR19KB336KCHZ | avx | Cap Tant Solid 33uF 25V H CASE 10% (7.24 X 3.81 X 2.79mm) SMD (0.01%FR) 0.9 Ohm 125°C Bulk |
| MME2R106S00S-7668(204) | te connectivity / amp | |
| GS8342S08GE-300I | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 8 0.45ns 165-Pin FBGA Tray |
| CWR19KC105KBBBTR | avx | Cap Tant Solid 1uF 25V B CASE 10% (3.81 X 1.27 X 1.27mm) SMD (0.1%FR) 10 Ohm 125°C T/R |
| MME3P106P106P106P-7101(200) | te connectivity / amp | ARINC 404 |
| GS8342S08GE-400I | gsi technology | 4M X 8 (36 MEG)SIGMASIO-II SEPERATE I/O BURST OF 2 |
| CWR19KC105KCBC | avx | Cap Tant Solid 1uF 25VDC 10% 3.81 X 1.27 X 1.27mm SMD 0.01%(FR) Bulk |
| CWR19KC156KBGC | avx | Cap Tant Solid 15uF 25VDC 10% 6.73 X 2.79 X 2.79mm SMD 0.1%(FR) Bulk |
| GS8342S18GE-200 | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin FBGA Tray |
| MMSD-10-22-S-04.00-D-K-LDX | samtec inc. | Cable Assembly Discrete Wire 0.101m 22AWG 20 POS Discrete Wire Housing to 20 POS Discrete Wire Housing SKT-SKT Crimp-Crimp Bulk |
| CWR19KC226KAGZ | avx | Cap Tant Solid 22uF 25V G CASE 10% (6.73 X 2.79 X 2.79mm) SMD Bulk |
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