规格参数 > 第73840页
H005-1000-030 现货价格参数; GS8162ZV36BGD-250 现货价格参数; CWR11KK475JTC 现货价格参数; GS8170DW36AGC-300I 现货价格参数; CWR11KK475KBC 现货价格参数; MAX6386LT23D3+T 现货价格参数; GS8170DW36AGC-333 现货价格参数; CWR11KK475KCBTR 现货价格参数; GS8170DW36AGC-350I 现货价格参数; C1812Q273K1XAH 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| H005-1000-030 | Spectrum Sensors | Signal Conditioning 0.500 dia. Servo Analog |
| GS8162ZV36BGD-250 | gsi technology | 512K X 36 (18 MEG) NBT, JTAG, FLEXDRIVE |
| CWR11KK475JTC | avx | Cap Tant Solid 4.7uF 25V C CASE 5% (6 X 3.2 X 2.5mm) SMD 6032-28 2.5 Ohm 125°C Bulk |
| GS8170DW36AGC-300I | gsi technology | SRAM Chip Sync Quad 1.8V 18M-Bit 512K x 36 1.8ns 209-Pin FBGA Tray |
| CWR11KK475KBC | avx | Cap Tant Solid 4.7uF 25V C CASE 10% (6 X 3.2 X 2.5mm) SMD 6032-28 (0.1%FR) 2.5 Ohm 125°C Bulk |
| MAX6386LT23D3+T | rochester electronics | |
| GS8170DW36AGC-333 | gsi technology | SRAM Chip Sync Quad 1.8V 18M-Bit 512K x 36 1.8ns 209-Pin FBGA Tray |
| CWR11KK475KCBTR | avx | Cap Tant Solid 4.7uF 25V C CASE 10% (6 X 3.2 X 2.5mm) SMD 6032-28 (0.01%FR) 2.5 Ohm 125°C T/R |
| GS8170DW36AGC-350I | gsi technology | SRAM Chip Sync Quad 1.8V 18M-Bit 512K x 36 1.7ns 209-Pin FBGA Tray |
| C1812Q273K1XAH | Kemet | Multilayer Ceramic Capacitors MLCC - SMD/SMT |
| CWR11KK475KCC | avx | Cap Tant Solid 4.7uF 25V C CASE 10% (6 X 3.2 X 2.5mm) SMD 6032-28 (0.01%FR) 2.5 Ohm 125°C Bulk |
| GS8170DW72AGC-250 | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 2.1ns 209-Pin FBGA Tray |
| CWR11KK475KTC | avx | Cap Tant Solid 4.7uF 25V C CASE 10% (6 X 3.2 X 2.5mm) SMD 6032-28 2.5 Ohm 125°C Bulk |
| C0603C224K9RAC | Kemet | マルチレイヤーセラミックキャパシタ MLCC - SMD/SMT .220UF 6.3V |
| GS8170DW72AGC-250I | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 2.1ns 209-Pin FBGA Tray |
| CWR11KK685JBC | avx | Cap Tant Solid 6.8uF 25V D CASE 5% (7.3 X 4.3 X 2.8mm) SMD 7343-31 (0.1%FR) 1.4 Ohm 125°C Bulk |
| GS8170DW72AGC-350 | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 1.7ns 209-Pin FBGA Tray |
| PCI7510PDV | Texas Instruments | Peripheral Drivers & Components - PCIs Int PC Cd Smart Cd & 1394 Cntrlr |
| CWR11KK685KBTR | avx | Cap Tant Solid 6.8uF 25V D CASE 10% (7.3 X 4.3 X 2.8mm) SMD 7343-31 (0.1%FR) 1.4 Ohm 125°C T/R |
| GS8170LW36AGC-250 | gsi technology | SRAM Chip Sync Quad 1.8V 18M-Bit 512K x 36 2.1ns 209-Pin FBGA Tray |
| CWR11MB104KBB | avx | Cap Tant Solid 0.1uF 35V A CASE 10% (3.2 X 1.6 X 1.6mm) SMD 3216-18 (0.1%FR) 24 Ohm 125°C Bulk |
| M85049/55S18A | Amphenol PCD | Circular MIL Spec Strain Reliefs & Adapters BACKSHELL QCK CLAMP R/A SL BLACK SZ 18 |
| GS8170LW36AGC-350 | gsi technology | SRAM Chip Sync Quad 1.8V 18M-Bit 512K x 36 1.7ns 209-Pin FBGA Tray |
| CWR11MB104KBC | avx | Cap Tant Solid 0.1uF 35V A CASE 10% (3.2 X 1.6 X 1.6mm) SMD 3216-18 (0.1%FR) 24 Ohm 125°C Bulk |
| GS8170LW72AGC-250 | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 2.1ns 209-Pin FBGA Tray |
| P11S1C0BJSZ00103MA | Vishay / Sfernice | Potentiometers P11S 1 C 0 BJ S Z00 10K 20% A e3 |
| CWR11MB105JBA | avx | Cap Tant Solid 1uF 35V B CASE 5% (3.5 X 2.8 X 1.9mm) SMD 3528-21 (0.1%FR) 6.5 Ohm 125°C Bulk |
| GS8170LW72AGC-333I | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 1.8ns 209-Pin FBGA Tray |
| SC18IS602BIPW | NXP Semiconductors | I2C Interface IC I2C SLAVE TO SPI MASTERBRIDGE |
| CWR11MB105JCB | avx | Cap Tant Solid 1uF 35V B CASE 5% (3.5 X 2.8 X 1.9mm) SMD 3528-21 (0.01%FR) 6.5 Ohm 125°C Bulk |
| GS8170LW72AGC-350 | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 1.7ns 209-Pin FBGA Tray |
| CWR11MB105KBC | avx | Cap Tant Solid 1uF 35V B CASE 10% (3.5 X 2.8 X 1.9mm) SMD 3528-21 (0.1%FR) 6.5 Ohm 125°C Bulk |
| C0805C101F5GAL7800 | Kemet | マルチレイヤーセラミックキャパシタ MLCC - SMD/SMT 100.PF 50.0V |
| GS8171DW36AGC-250I | gsi technology | SRAM Chip Sync Quad 1.8V 18M-Bit 512K x 36 2.1ns 209-Pin BGA Tray |
| GS8171DW72AGC-250I | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 2.1ns 209-Pin FBGA Tray |
| CWR11MB105KCB | avx | Cap Tant Solid 1uF 35V B CASE 10% (3.5 X 2.8 X 1.9mm) SMD 3528-21 (0.01%FR) 6.5 Ohm 125°C Bulk |
| H009-1200-03T | Spectrum Sensors | Signal Conditioning 0.875 dia. Servo Hi Temp Analog Dual |
| GS8171DW72AGC-300I | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 1.8ns 209-Pin FBGA Tray |
| CWR11MB105KDA | avx | Cap Tant Solid 1uF 35V B CASE 10% (3.5 X 2.8 X 1.9mm) SMD 3528-21 (0.001%FR) 6.5 Ohm 125°C Bulk |
| M85049/25-150N | Amphenol PCD | Circular MIL Spec Backshells BACKSHELL NON ENV EMI/RFI ST NICKEL |
| GS8171DW72AGC-333 | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 1.8ns 209-Pin FBGA Tray |
| CWR11MB105KDB | avx | Cap Tant Solid 1uF 35V B CASE 10% (3.5 X 2.8 X 1.9mm) SMD 3528-21 (0.001%FR) 6.5 Ohm 125°C Bulk |
| GS8171DW72AGC-333I | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 1.8ns 209-Pin FBGA Tray |
| SC16C654BIBS-F | NXP Semiconductors | UART Interface IC 16CB 2.5V-5V 4CH UART 64B FIFO |
| CWR11MB155KBB | avx | Cap Tant Solid 1.5uF 35V C CASE 10% (6 X 3.2 X 2.5mm) SMD 6032-28 (0.1%FR) 4.5 Ohm 125°C Bulk |
| GS8171DW72AGC-350I | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 1.7ns 209-Pin FBGA Tray |
| CWR11MB155KCC | avx | Cap Tant Solid 1.5uF 35V C CASE 10% (6 X 3.2 X 2.5mm) SMD 6032-28 (0.01%FR) 4.5 Ohm 125°C Bulk |
| H009-1001-030 | Spectrum Sensors | Signal Conditioning 0.875 dia. Servo Analog |
| GS82032AGQ-133 | gsi technology | 2MB (64K X 32) SYNCH BURST SCD |
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