规格参数 > 第71996页
B82412A3471J 现货价格参数; NTR50B37R4DTRF 现货价格参数; 593D476X9010D2TE3 现货价格参数; NTR50B3831BTRF 现货价格参数; SP3222EEY-L 现货价格参数; B82412A3560K 现货价格参数; NTR50B3831NTRF 现货价格参数; 593D686X0020E2TE3 现货价格参数; B82412A3561K 现货价格参数; 5962-0420401HPC 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| B82412A3471J | tdk epcos | Ind Chip Wirewound 470nH 5% 1MHz 30Q-Factor Ceramic 225mA 1210 Blister T/R |
| NTR50B37R4DTRF | nic components | Res Thin Film 2512 37.4 Ohm 0.1% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 593D476X9010D2TE3 | vishay / sprague | Cap Tant Solid 47uF 10V D CASE 10% (7.3 X 4.3 X 2.8mm) SMD 7343-31 0.2 Ohm 125°C T/R |
| NTR50B3831BTRF | nic components | Res Thin Film 2512 3.83K Ohm 0.1% 1/2W ±10ppm/°C Molded SMD SMD Embossed Plastic T/R |
| SP3222EEY-L | Exar | RS-232 Interface IC RS232 2drvr/2rcvr temp -40C to 85C |
| B82412A3560K | tdk epcos | Ind Chip Wirewound 56nH 10% 10MHz 30Q-Factor Ceramic 460mA 1210 Blister T/R |
| NTR50B3831NTRF | nic components | Res Thin Film 2512 3.83K Ohm 0.1% 1/2W ±15ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 593D686X0020E2TE3 | vishay / sprague | Cap Tant Solid 68uF 20V E CASE 20% (7.3 X 4.3 X 4mm) SMD 7343-43 T/R |
| B82412A3561K | tdk epcos | Ind Chip Wirewound 560nH 10% 1MHz 30Q-Factor Ceramic 200mA 1210 Blister T/R |
| 5962-0420401HPC | avago technologies | Optocoupler Logic-Out Push-Pull DC-IN 1-CH 8-Pin CDIP |
| NTR50B3832NTRF | nic components | Res Thin Film 2512 38.3K Ohm 0.1% 1/2W ±15ppm/°C Molded SMD SMD Embossed Plastic T/R |
| KUHP-11A51-120 | te connectivity / p&b | Electromechanical Relay DPDT 20A 120VAC 1.7KOhm Bracket Mount |
| NTR50B3921BTRF | nic components | Res Thin Film 2512 3.92K Ohm 0.1% 1/2W ±10ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B82412A3561M | tdk epcos | Ind Chip Wirewound 560nH 20% 1MHz 30Q-Factor Ceramic 200mA 1210 Blister T/R |
| KUP-5A55-120 | te connectivity / p&b | Electromechanical Relay SPDT 10A 120VAC 2.25KOhm Bracket Mount |
| NTR50B3922CTRF | nic components | Res Thin Film 2512 39.2K Ohm 0.1% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B82412A3680K | tdk epcos | Ind Chip Wirewound 68nH 10% 10MHz 30Q-Factor Ceramic 440mA 1210 Blister T/R |
| CUH-41-30120 | te connectivity / p&b | Electromechanical Relay DPDT 10A 24VDC 2Ohm Plain Case |
| NTR50B3923CTRF | nic components | Res Thin Film 2512 392K Ohm 0.1% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| K10P-11D55-110 | te connectivity / p&b | Electromechanical Relay DPDT 15A 110VDC 11KOhm Through Hole |
| B82412A3681J | tdk epcos | Ind Chip Wirewound 680nH 5% 1MHz 30Q-Factor Ceramic 180mA 1210 Blister T/R |
| NTR50B4120BTRF | nic components | Res Thin Film 2512 412 Ohm 0.1% 1/2W ±10ppm/°C Molded SMD SMD Embossed Plastic T/R |
| W67-X2Q12-30 | te connectivity / p&b | Circuit Breaker Magnetic Hydraulic 1Pole 30A 277VAC |
| NTR50B4120DTRF | nic components | Res Thin Film 2512 412 Ohm 0.1% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B82412A3681K | tdk epcos | Ind Chip Wirewound 680nH 10% 1MHz 30Q-Factor Ceramic 180mA 1210 Blister T/R |
| R10-E1M4-V700 | te connectivity / p&b | Electromechanical Relay 4PDT 5A 24VDC 700Ohm Plug-In |
| NTR50B4121BTRF | nic components | Res Thin Film 2512 4.12K Ohm 0.1% 1/2W ±10ppm/°C Molded SMD SMD Embossed Plastic T/R |
| VTM1ACD | te connectivity / amp | Electromechanical Relay SPST-NO 1A 120VDC 120VAC Panel Mount |
| B82412A3820J | tdk epcos | Ind Chip Wirewound 82nH 5% 10MHz 30Q-Factor Ceramic 430mA 1210 Blister T/R |
| NTR50B4121CTRF | nic components | Res Thin Film 2512 4.12K Ohm 0.1% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 624H | ebm-papst | DC Fan Ball Bearing 24V 2.4W 6850RPM 27.1CFM 39dB Flange Mount |
| NTR50B41R2CTRF | nic components | Res Thin Film 2512 41.2 Ohm 0.1% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B82412A3821M | tdk epcos | Ind Chip Wirewound 820nH 20% 1MHz 30Q-Factor Ceramic 150mA 1210 Blister T/R |
| 624HH | ebm-papst | DC Fan Ball Bearing 24V 3.6W 8200RPM 33CFM 43dB Flange Mount |
| NTR50B4220BTRF | nic components | Res Thin Film 2512 422 Ohm 0.1% 1/2W ±10ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B82422A1103J100 | tdk epcos | Ind Chip Molded Wirewound 10uH 5% 1MHz 27Q-Factor Ferrite 180mA 1210 Blister T/R |
| D-141-0108 | te connectivity / raychem wire | D-141-0108 |
| NTR50B4220CTRF | nic components | Res Thin Film 2512 422 Ohm 0.1% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B82422A1122J100 | tdk epcos | Ind Chip Molded Wirewound 1.2uH 5% 1MHz 20Q-Factor Ferrite 370mA 1210 Blister T/R |
| NTR50B4221BTRF | nic components | Res Thin Film 2512 4.22K Ohm 0.1% 1/2W ±10ppm/°C Molded SMD SMD Embossed Plastic T/R |
| NTR50B4222BTRF | nic components | Res Thin Film 2512 42.2K Ohm 0.1% 1/2W ±10ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B82422A1183K100 | tdk epcos | Ind Chip Molded Wirewound 18uH 10% 100KHz 27Q-Factor Ferrite 155mA 1210 Blister T/R |
| 202C611-51-0-CS5325 | te connectivity / raychem wire | 648533-000 |
| NTR50B4222CTRF | nic components | Res Thin Film 2512 42.2K Ohm 0.1% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B82422A1272J100 | tdk epcos | Ind Chip Molded Wirewound 2.7uH 5% 1MHz 25Q-Factor Ferrite 240mA 1210 Blister T/R |
| NTR50B42R2BTRF | nic components | Res Thin Film 2512 42.2 Ohm 0.1% 1/2W ±10ppm/°C Molded SMD SMD Embossed Plastic T/R |
| 66-9903 | vishay / semiconductor | 300U30A |
| B82422A1333J100 | tdk epcos | Ind Chip Molded Wirewound 33uH 5% 100KHz 27Q-Factor Ferrite 105mA 1210 Blister T/R |
| NTR50B4320DTRF | nic components | Res Thin Film 2512 432 Ohm 0.1% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
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