规格参数 > 第71248页
KJ7Y18D35PN 现货价格参数; B82412A3151K 现货价格参数; NTR50F4222DTRF 现货价格参数; KJ7Y8D35PN16 现货价格参数; B82412A3180M 现货价格参数; RCMT08277R0BES03 现货价格参数; KJA111426-169 现货价格参数; NTR50F4223DTRF 现货价格参数; B82412A3181J 现货价格参数; KJA1Y17N8PN 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| KJ7Y18D35PN | itt interconnect solutions | KJ7Y18D35PN |
| B82412A3151K | tdk epcos | Ind Chip Wirewound 150nH 10% 1MHz 25Q-Factor Ceramic 370mA 1210 Blister T/R |
| NTR50F4222DTRF | nic components | Res Thin Film 2512 42.2K Ohm 1% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| KJ7Y8D35PN16 | itt interconnect solutions | KJ7Y8D35PN16 |
| B82412A3180M | tdk epcos | Ind Chip Wirewound 18nH 20% 10MHz 30Q-Factor Ceramic 640mA 1210 Blister T/R |
| RCMT08277R0BES03 | Vishay / Sfernice | 金属被膜抵抗器 - スルーホール RCMT 08 277U 0,1% K4 BA10 e3 |
| KJA111426-169 | itt interconnect solutions | 111444-0169 |
| NTR50F4223DTRF | nic components | Res Thin Film 2512 422K Ohm 1% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B82412A3181J | tdk epcos | Ind Chip Wirewound 180nH 5% 1MHz 25Q-Factor Ceramic 340mA 1210 Blister T/R |
| KJA1Y17N8PN | itt interconnect solutions | KJA1Y17N8PN |
| RCME0230001AYS03 | Vishay / Sfernice | Metal Film Resistors - Through Hole RCME 02 30K 0,2% K6 BA10 e3 |
| KJA6T21W75SN-FO | itt interconnect solutions | CONN D38999 CIRC SKT 4 POS CRMP ST CBL MNT |
| B82412A3181K | tdk epcos | Ind Chip Wirewound 180nH 10% 1MHz 25Q-Factor Ceramic 340mA 1210 Blister T/R |
| NTR50F4321DTRF | nic components | Res Thin Film 2512 4.32K Ohm 1% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| KJA6T25F61SAL | itt interconnect solutions | Conn MIL-DTL-38999 Circular SKT 61 POS Crimp ST Cable Mount 61 Terminal 1 Port |
| B82412A3220J | tdk epcos | Ind Chip Wirewound 22nH 5% 10MHz 30Q-Factor Ceramic 600mA 1210 Blister T/R |
| D38999/26FG41SN-LC | Amphenol Aerospace | Circular MIL Spec Connector 41P SZ 21 PLUG CBL MNT SKT |
| KJA7Y25K35PN | itt interconnect solutions | KJA7Y25K35PN |
| NTR50F43R2CTRF | nic components | Res Thin Film 2512 43.2 Ohm 1% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| KJA7Y9N35PN | itt interconnect solutions | KJA7Y9N35PN |
| B82412A3220K | tdk epcos | Ind Chip Wirewound 22nH 10% 10MHz 30Q-Factor Ceramic 600mA 1210 Blister T/R |
| 282-910K | Xicon | Metal Oxide Resistors USE 282-910K-RC |
| KJJ110798-23 | itt interconnect solutions | CONNECTOR |
| B82412A3271J | tdk epcos | Ind Chip Wirewound 270nH 5% 1MHz 30Q-Factor Ceramic 300mA 1210 Blister T/R |
| NTR50F4420DTRF | nic components | Res Thin Film 2512 442 Ohm 1% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| KJL1Y103470-24 | itt interconnect solutions | 13D35PA W/P.C. CONT. |
| DCP4N05160SL3NMY00 | WIMA | フィルムコンデンサ DC-LINK MKP 4 16.0 uF 900 VDC 20x39.5x41.5 SN |
| KJL1Y13D35PA | itt interconnect solutions | KJL1Y13D35PA |
| B82412A3330J | tdk epcos | Ind Chip Wirewound 33nH 5% 10MHz 25Q-Factor Ceramic 540mA 1210 Blister T/R |
| NTR50F4533CTRF | nic components | Res Thin Film 2512 453K Ohm 1% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| KJL1YC15D35PN | itt interconnect solutions | KJL1YC15D35PN |
| B82412A3330K | tdk epcos | Ind Chip Wirewound 33nH 10% 10MHz 25Q-Factor Ceramic 540mA 1210 Blister T/R |
| KJL7Y21E35PN | itt interconnect solutions | KJL7Y21E35PN |
| CCF07820RGKR36 | Vishay / Dale | Metal Film Resistors - Through Hole 1/4watt 820ohms 2% Rated to 1/2watt |
| B82412A3331K | tdk epcos | Ind Chip Wirewound 330nH 10% 1MHz 30Q-Factor Ceramic 280mA 1210 Blister T/R |
| KJL7YC23D35PN | itt interconnect solutions | KJL7YC23D35PN |
| NTR50F4533DTRF | nic components | Res Thin Film 2512 453K Ohm 1% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| KL-A2A-022 | leach international | MID RANGE |
| PRA135I4-100KBLNT | Vishay | レジスタネットワークおよびアレイ PRA 135 I 4 100K 0,1% 0,01% N TR e2 |
| B82412A3390M | tdk epcos | Ind Chip Wirewound 39nH 20% 10MHz 25Q-Factor Ceramic 500mA 1210 Blister T/R |
| KP1830147014W | vishay / roederstein | Cap Film 470pF 100V PP 5% Radial 5mm 100°C T/R |
| NTR50F46R4CTRF | nic components | Res Thin Film 2512 46.4 Ohm 1% 1/2W ±25ppm/°C Molded SMD SMD Embossed Plastic T/R |
| B82412A3391J | tdk epcos | Ind Chip Wirewound 390nH 5% 1MHz 30Q-Factor Ceramic 260mA 1210 Blister T/R |
| KP1830310061 | vishay / roederstein | Cap Film 0.01uF 63V PP 1% (7.2 X 5.5 X 7mm) Radial 5mm 100°C Bulk |
| P11A1AABJSY00502KR | Vishay | Potentiometers P11A 1 A A BJ S Y00 5K 10% R e3 |
| KP1836410105 | vishay / roederstein | Cap Film 0.1uF 1000V PP 10% (41.5 X 14.5 X 24.5mm) Radial 37.5mm 100°C Bulk |
| B82412A3391M | tdk epcos | Ind Chip Wirewound 390nH 20% 1MHz 30Q-Factor Ceramic 260mA 1210 Blister T/R |
| NTR50F4750DTRF | nic components | Res Thin Film 2512 475 Ohm 1% 1/2W ±50ppm/°C Molded SMD SMD Embossed Plastic T/R |
| KPDH03DN8-4P | itt interconnect solutions | KPDH03DN8-4P |
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