规格参数 > 第6472页
NS02B1K800FB12 现货价格参数; L717SDEH09POL2RM5C309 现货价格参数; C052C109D2G5CA 现货价格参数; 986744-4 现货价格参数; GS71116AU-10 现货价格参数; NS02B1R000FS67 现货价格参数; C052C273K5R5CA 现货价格参数; GS73024AB-12 现货价格参数; C052C439D2G5CA 现货价格参数; 986766-1 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| NS02B1K800FB12 | vishay / dale | Res Wirewound 1.8K Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| L717SDEH09POL2RM5C309 | Amphenol Commercial Products | D-Sub Standard Connectors 9P Sz E Std Density Pin Strt PCB 30u |
| C052C109D2G5CA | kemet | Cap Ceramic 1pF 200V C0G 0.5pF Radial 5.08mm 125°C Bulk |
| 986744-4 | te connectivity / amp | SCREW,SHOULDER,PRECISION |
| GS71116AU-10 | gsi technology | SRAM Chip Async Single 3.3V 1M-Bit 64K x 16 10ns 48-Pin FBGA Tray |
| NS02B1R000FS67 | vishay / dale | Res Wirewound 1 Ohm 1% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| C052C273K5R5CA | kemet | Cap Ceramic 0.027uF 50V X7R 10% Radial 5.08mm 125°C Bulk |
| GS73024AB-12 | gsi technology | SRAM Chip Async Single 3.3V 3M-Bit 128K x 24-Bit 12ns 119-Pin FBGA Tray |
| C052C439D2G5CA | kemet | Cap Ceramic 4.3pF 200V C0G 0.5pF Radial 5.08mm 125°C Bulk |
| 986766-1 | te connectivity / amp | BRACKET,SWITCH,COMPACT |
| TCG552U010N1L | Cornell Dubilier | Aluminum Electrolytic Capacitors - Leaded 5500uF 10Volts |
| NS02B1R000FS70 | vishay / dale | Res Wirewound 1 Ohm 1% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| C052G100G2G5CM | kemet | Cap Ceramic 10pF 200V C0G 2% Radial 5.08mm (1%FR) 125°C Bulk |
| 1922349 | Phoenix Contact | Pluggable Terminal Blocks MSTBV 2.5/18-GF-5.08 |
| 986795-2 | te connectivity / amp | GEARMOTOR,PLANETARY,D.C.,ENCOD |
| C052G121G2G5CR | kemet | Cap Ceramic 120pF 200V C0G 2% Radial 5.08mm (0.01%FR) 125°C Bulk |
| NS02B1R000FS73 | vishay / dale | Res Wirewound 1 Ohm 1% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| GS8161E32BD-150 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 18M-Bit 512K x 32 7.5ns/3.8ns 165-Pin FBGA Tray |
| C052G122J1G5CP | kemet | Cap Ceramic 0.0012uF 100V C0G 5% Radial 5.08mm (0.1%FR) 125°C Bulk |
| 992134-1 | te connectivity / amp | WASHER,FLAT |
| GS8161E36BD-250I | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 18M-Bit 512K x 36 5.5ns/2.5ns 165-Pin FBGA Tray |
| NS02B1R000JB12 | vishay / dale | Res Wirewound 1 Ohm 5% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| C052G150G2G5CM | kemet | Cap Ceramic 15pF 200V C0G 2% Radial 5.08mm (1%FR) 125°C Bulk |
| 992174-1 | te connectivity / amp | BUSHING,SURE-GRIP |
| C052G161F2G5CS | kemet | Cap Ceramic 160pF 200V C0G 1% Radial 5.08mm (0.001%FR) 125°C Bulk |
| GS8161Z36BD-250I | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 18M-Bit 512K x 36 5.5ns/2.5ns 165-Pin FBGA Tray |
| NS02B1R000JS70 | vishay / dale | Res Wirewound 1 Ohm 5% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| C052G181G2G5CR | kemet | Cap Ceramic 180pF 200V C0G 2% Radial 5.08mm (0.01%FR) 125°C Bulk |
| GS816236BD-150 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 18M-Bit 512K x 36 7.5ns/3.8ns 165-Pin FBGA Tray |
| 992175-1 | te connectivity / amp | BELT,SYNCHRONOUS (RPP) |
| NS02B1R200FB12 | vishay / dale | Res Wirewound 1.2 Ohm 1% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| C052G201F2G5CS | kemet | Cap Ceramic 200pF 200V C0G 1% Radial 5.08mm (0.001%FR) 125°C Bulk |
| GS816236BD-200 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 18M-Bit 512K x 36 6.5ns/3ns 165-Pin FBGA Tray |
| 992253-1 | te connectivity / amp | THERMOSTAT,DISC,SNAP ACTION |
| C052G241J2G5CMTR | kemet | Cap Ceramic 240pF 200V C0G 5% Radial 5.08mm (1%FR) 125°C T/R |
| GS8170DW72C-333I | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 1.8ns 209-Pin FBGA Tray |
| NS02B1R300HB12 | vishay / dale | Res Wirewound 1.3 Ohm 3% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| C052G271J2G5CR | kemet | Cap Ceramic 270pF 200V C0G 5% Radial 5.08mm (0.01%FR) 125°C Bulk |
| 97-3102A-14S-4S(621) | Amphenol Industrial | Circular MIL Spec Connector 1P Sz 14S Box Mount Socket Recept Solder |
| 992302-1 | te connectivity / amp | CORD, 3 COND, IEC 320, INTL |
| C052G330F2G5CM | kemet | Cap Ceramic 33pF 200V C0G 1% Radial 5.08mm (1%FR) 125°C Bulk |
| NS02B1R300JR50 | vishay / dale | Res Wirewound 1.3 Ohm 5% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| VJ1206A180JXBAT | Vishay/Vitramon | Multilayer Ceramic Capacitors MLCC - SMD/SMT 18pF 100volts 5% |
| 992408-1 | te connectivity / amp | NUT,HEX,LOCK,PREVAILING TORQUE |
| C052G330J2G5CRTR | kemet | Cap Ceramic 33pF 200V C0G 5% Radial 5.08mm (0.01%FR) 125°C T/R |
| LD142C224KAB2A | AVX | Multilayer Ceramic Capacitors MLCC - SMD/SMT 200volts 0.22uF 10% 2225 X7R |
| NS02B1R300JS73 | vishay / dale | Res Wirewound 1.3 Ohm 5% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| C052G361G1G5CRTR | kemet | Cap Ceramic 360pF 100V C0G 2% Radial 5.08mm (0.01%FR) 125°C T/R |
| GS8320ZV18T-166I | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 2M x 18 8ns/3.5ns 100-Pin TQFP Tray |
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