规格参数 > 第5569页
10-427950-119 现货价格参数; 70T3539MS133BCI 现货价格参数; 10-503104-268 现货价格参数; MTSW-107-09-S-D-600 现货价格参数; CW02B6R000JE7013 现货价格参数; 70V657S15BC 现货价格参数; 10-503112-026 现货价格参数; MTSW-107-09-T-D-415 现货价格参数; 71256SA12YG8 现货价格参数; CW02B6R000KE7013 现货价格参数;
型号 | 生产商 | 产品描述 |
---|---|---|
10-427950-119 | amphenol | Connector Accessories Receptacle Protection Cap Olive Drab Cadmium Over Nickel Finish Shell Size 11 |
70T3539MS133BCI | integrated device technology (idt) | SRAM Chip Sync Dual 2.5V 18M-Bit 512K x 36 15ns/4.2ns 256-Pin CABGA |
10-503104-268 | amphenol | Conn Rectangular SKT 268 POS 2.54mm Solder ST Thru-Hole |
MTSW-107-09-S-D-600 | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
CW02B6R000JE7013 | vishay / dale | Res Wirewound 6 Ohm 5% 4W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
70V657S15BC | integrated device technology (idt) | SRAM Chip Async Dual 3.3V 1.125M-Bit 32K x 36 15ns 256-Pin CABGA |
10-503112-026 | amphenol | Conn Rectangular SKT 26 POS 2.54mm Solder ST Thru-Hole |
MTSW-107-09-T-D-415 | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
71256SA12YG8 | integrated device technology (idt) | SRAM Chip Async Single 5V 256K-Bit 32K x 8 12ns 28-Pin SOJ T/R |
CW02B6R000KE7013 | vishay / dale | Res Wirewound 6 Ohm 10% 4W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
10-503132-050 | amphenol | Conn Rectangular SKT 50 POS 2.54mm Solder ST Thru-Hole |
7130LA35J | integrated device technology (idt) | SRAM Chip Async Dual 5V 8K-Bit 1K x 8 35ns 52-Pin PLCC |
MTSW-107-09-T-D-465 | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
10-503134-160 | amphenol | Conn Rectangular SKT 160 POS 2.54mm Solder ST Thru-Hole |
CW02B6R200JE7013 | vishay / dale | Res Wirewound 6.2 Ohm 5% 4W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
7133SA55JG | integrated device technology (idt) | SRAM Chip Async Dual 5V 32K-Bit 2K x 16 55ns 68-Pin PLCC |
10-503233-129 | amphenol | Conn Rectangular SKT 129 POS 2.54mm Solder RA Thru-Hole |
MTSW-107-09-T-D-480 | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
71V256SA12YG | integrated device technology (idt) | SRAM Chip Async Single 3.3V 256K-Bit 32K x 8 12ns 28-Pin SOJ Tray |
10-503252-148 | amphenol | Conn Rectangular SKT 148 POS 2.54mm Wire Wrap ST Thru-Hole |
CW02B6R700KE7013 | vishay / dale | Res Wirewound 6.7 Ohm 10% 4W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
7205L25J | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 8K x 9 32-Pin PLCC |
MTSW-107-09-T-D-590 | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
10-538988-020 | amphenol | TOOL FOR 38999 RED/ORANGE /14-10 |
72255LA15PF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 8K x 18 64-Pin TQFP |
CW02B6R800JE7013 | vishay / dale | Res Wirewound 6.8 Ohm 5% 4W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
MTSW-107-09-T-S-120-RE | samtec inc. | Conn Unshrouded Header HDR 7 POS 2.54mm Solder RA Thru-Hole |
MJW0281AG | ON Semiconductor | Transistors Bipolar - BJT NPN DIP PWR XTOR |
72265LA15PFI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 16K x 18 64-Pin TQFP |
CW02B6R800JS7013 | vishay / dale | Res Wirewound 6.8 Ohm 5% 4W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
72421L25J | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 64 x 9 32-Pin PLCC Tray |
MTSW-107-10-G-D-320-RA | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder RA Thru-Hole |
10019396-001 | fci sa | Connector Accessories Shielded Gasket Foam |
72811L25PF | integrated device technology (idt) | FIFO Mem Sync Quad Depth/Width Bi-Dir 512 x 9 x 2 64-Pin TQFP |
CW02B70R00KE1213 | vishay / dale | Res Wirewound 70 Ohm 10% 4W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
1002-7551-002 | aep (applied engineering products) | Conn SMC PL 0Hz to 10GHz 50Ohm Crimp ST Cable Mount Gold |
MTSW-107-10-G-D-500-RA | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder RA Thru-Hole |
72V293L10PF | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 64K x 18/128K x 9 80-Pin TQFP |
100302SCX | fairchild semiconductor | OR/NOR Gate 5-Element 2-IN ECL 24-Pin SOIC W T/R |
CW02B750R0KE1213 | vishay / dale | Res Wirewound 750 Ohm 10% 4W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
MTSW-107-10-G-D-545 | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
746610-4 | te connectivity / amp | Conn IDC Connector M 20 POS 2.54mm IDT RA Cable Mount |
100749-1 | te connectivity / amp | Conn Hard Metric M 55 POS 2mm Press Fit ST Thru-Hole |
CW02B75R00JE1213 | vishay / dale | Res Wirewound 75 Ohm 5% 4W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
10105881 | amphenol | 10-262121-221 |
MTSW-107-10-G-D-630 | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
747841-4 | te connectivity / amp | Conn D-Subminiature PIN 15 POS 2.74mm Solder RA Thru-Hole 15 Terminal 1 Port |
102589-2 | te connectivity / amp | Conn Shrouded Header HDR 36 POS 2.54mm Solder RA Thru-Hole |
74AC11008D | texas instruments | AND Gate 4-Element 2-IN CMOS 16-Pin SOIC Tube |
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