规格参数 > 第13947页
MAX706PCUA 现货价格参数; EXB-14V560JX 现货价格参数; SCAN182541ASSCX 现货价格参数; MAX708TESA 现货价格参数; RW79U1R21FS73 现货价格参数; EXB-14V563JX 现货价格参数; MAX7232BFIQH 现货价格参数; RW79U1R30FB12 现货价格参数; EXB-14V680JX 现货价格参数; MM74HC540N 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| MAX706PCUA | maxim integrated | Processor Supervisor 2.63V 2.63V 8-Pin uMAX |
| EXB-14V560JX | panasonic | Res Thick Film Array 56 Ohm 5% ±200ppm/°C ISOL Molded 4-Pin 0302(2 X 0201) Convex SMD Punched Carrier T/R |
| SCAN182541ASSCX | Fairchild Semiconductor | Buffers & Line Drivers Non-Inv Line Drv |
| MAX708TESA | maxim integrated | Processor Supervisor 3.08V 3.08V 8-Pin SOIC N |
| RW79U1R21FS73 | vishay / dale | Res Wirewound 1.21 Ohm 1% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| EXB-14V563JX | panasonic | Res Thick Film Array 56K Ohm 5% ±200ppm/°C ISOL Molded 4-Pin 0302(2 X 0201) Convex SMD Punched Carrier T/R |
| MAX7232BFIQH | maxim integrated | 44 PINS PLCC PKG |
| RW79U1R30FB12 | vishay / dale | Res Wirewound 1.3 Ohm 1% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| EXB-14V680JX | panasonic | Res Thick Film Array 68 Ohm 5% ±200ppm/°C ISOL Molded 4-Pin 0302(2 X 0201) Convex SMD Punched Carrier T/R |
| MM74HC540N | Fairchild Semiconductor | Buffers & Line Drivers Inv Oct 3-STATE Buf |
| 74LVT32D-T | NXP Semiconductors | Logic Gates 3.3V QUAD 2-INPUT OR GATE |
| EXB-14V822JX | panasonic | Res Thick Film Array 8.2K Ohm 5% ±200ppm/°C ISOL Molded 4-Pin 0302(2 X 0201) Convex SMD Punched Carrier T/R |
| RW79U22R6FS73 | vishay / dale | Res Wirewound 22.6 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| MAX735ESA-T | maxim integrated | Conv DC-DC Single Inv 4V to 6.2V 8-Pin SOIC N T/R |
| GTL2107PW | NXP Semiconductors | Translation - Voltage Levels 12-BIT XEON GTL TO LVTTL TRANS |
| EXB-18V105JX | panasonic | Res Thick Film Array 1M Ohm 5% 1/10W ±200ppm/°C ISOL Molded 8-Pin 0502(4 X 0201) Flat SMD Punched Carrier T/R |
| MAX7403CPA | maxim integrated | Active Filter Single SW-CAP Low Pass 8th Order 10kHz 8-Pin PDIP N |
| EXB-18V471JX | panasonic | Res Thick Film Array 470 Ohm 5% 1/10W ±200ppm/°C ISOL Molded 8-Pin 0502(4 X 0201) Flat SMD Punched Carrier T/R |
| RW79U2551FS73 | vishay / dale | Res Wirewound 2.55K Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 74ACTQ16373SSCX | Fairchild Semiconductor | Latches 16-Bit Trans Latch |
| MAX7408CUA | maxim integrated | Active Filter Single SW-CAP Low Pass 5th Order 15kHz 8-Pin uMAX |
| EXB-18V681JX | panasonic | Res Thick Film Array 680 Ohm 5% 1/10W ±200ppm/°C ISOL Molded 8-Pin 0502(4 X 0201) Flat SMD Punched Carrier T/R |
| RW79U30R0FS73 | vishay / dale | Res Wirewound 30 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| MAX748ACPA | maxim integrated | Conv DC-DC Single Step Down 3.3V to 16V 8-Pin PDIP N |
| EXB-28V1R1JX | panasonic | Res Thick Film Array 1.1 Ohm 5% ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Punched Carrier T/R |
| SN74ABT853NSRE4 | Texas Instruments | Bus Transceivers 8 to 9-Bit Parity Bus Transceivers |
| MAX758AEWE | maxim integrated | Conv DC-DC Single Step Down 4V to 16V 16-Pin SOIC W |
| RW79U30R1FB12 | vishay / dale | Res Wirewound 30.1 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| EXB-28V1R6JX | panasonic | Res Thick Film Array 1.6 Ohm 5% ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Punched Carrier T/R |
| MAX770CSA | maxim integrated | DC DC Cntrlr Single-OUT Step Up 2V to 16.5V Input 8-Pin SOIC N |
| 74LVTH574D-T | NXP Semiconductors | Flip Flops 3.3V D BH +EDGE TRIG 3S |
| EXB-28V204JX | panasonic | Res Thick Film Array 200K Ohm 5% ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Punched Carrier T/R |
| RW79U3481FB12 | vishay / dale | Res Wirewound 3.48K Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| MAX792LCPE | maxim integrated | Processor Supervisor 4.62V 2.75V to 5.5V 16-Pin PDIP N |
| EXB-28V241JX | panasonic | Res Thick Film Array 240 Ohm 5% ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Punched Carrier T/R |
| HEF40106BTT | NXP Semiconductors | Inverters HEX SCHMITT TRIGGER |
| RW79U35R0FB12 | vishay / dale | Res Wirewound 35 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| MAX792LCSE | maxim integrated | Processor Supervisor 4.62V 2.75V to 5.5V 16-Pin SOIC N |
| EXB-28V303JX | panasonic | Res Thick Film Array 30K Ohm 5% ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Punched Carrier T/R |
| EXB-28V622JX | panasonic | Res Thick Film Array 6.2K Ohm 5% ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Punched Carrier T/R |
| RW79U3921FB12 | vishay / dale | Res Wirewound 3.92K Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 74ALVCH162601DG-T | NXP Semiconductors | Bus Transceivers 18-BIT UNIV. BUS XCVR 3-S |
| MAX793TCSE-T | maxim integrated | Processor Supervisor Adj 3V/3.3V 16-Pin SOIC N T/R |
| EXB-28V623JX | panasonic | Res Thick Film Array 62K Ohm 5% ±200ppm/°C ISOL Molded 8-Pin 0804(4 X 0402) Convex SMD Punched Carrier T/R |
| MAX794ESE | maxim integrated | Processor Supervisor Adj 3V/3.3V 16-Pin SOIC N |
| RW79U4020FS73 | vishay / dale | Res Wirewound 402 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 74HC377DB | NXP Semiconductors | Flip Flops OCTAL D-TYPE W/ENABL |
| EXB-2HV112JV | panasonic | Res Thick Film Array 1.1K Ohm 5% 1/4W ±200ppm/°C ISOL Molded 16-Pin 1506(8 X 0402) Convex SMD Punched Carrier T/R |
| MAX800LESE | maxim integrated | Processor Supervisor 0V to 5.5V 16-Pin SOIC N |
页数:
1
5000
6000
7000
8000
9000
10000
11000
12000
13000
13100
13200
13300
13400
13500
13600
13700
13850
13860
13870
13880
13890
13900
13910
13920
13932
13933
13934
13935
13936
13937
13938
13939
13940
13941
13942
13943
13944
13945
13946
13947
13948
13949
13950
13951
13952
13953
13954
13955
13956
13957
13958
13959
13960
13970
13980
13990
14000
14010
14020
14030
14040
14100
14200
14300
14400
14500
14600
14700
14800
15000
16000
17000
18000
19000
20000
21000
22000
30000
40000
50000
60000
70000
80000
90000
100000
234766