规格参数 > 第13885页
CW02B141R0KE7013 现货价格参数; RS002R9100FB12 现货价格参数; 74LVT273DB-T 现货价格参数; CD74FCT541M96E4 现货价格参数; CW02B14R70JE1213 现货价格参数; RS005105R0CR55 现货价格参数; GS8161V18CD-300I 现货价格参数; CW02B150R0JS70 现货价格参数; 74ABT377ADB-T 现货价格参数; GTL16612DL,518 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| CW02B141R0KE7013 | vishay / dale | Res Wirewound 141 Ohm 10% 4W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| RS002R9100FB12 | vishay / dale | Res Wirewound 0.91 Ohm 1% 4W ±90ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 74LVT273DB-T | NXP Semiconductors | Flip Flops 3.3V OCTAL D |
| CD74FCT541M96E4 | Texas Instruments | Buffers & Line Drivers BiCMOS FCT Ifc Octal Bfr/Ln Drv W/3St Otp |
| CW02B14R70JE1213 | vishay / dale | Res Wirewound 14.7 Ohm 5% 4W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| RS005105R0CR55 | vishay / dale | Res Wirewound 105 Ohm 0.25% 5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| GS8161V18CD-300I | gsi technology | SRAM Chip Sync Quad 1.8V 18M-Bit 1M x 18 5ns/2.5ns 165-Pin FBGA Tray |
| CW02B150R0JS70 | vishay / dale | Res Wirewound 150 Ohm 5% 3W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 74ABT377ADB-T | NXP Semiconductors | Flip Flops OCTAL D-TYPE W/ENABL |
| GTL16612DL,518 | NXP Semiconductors | Bus Transceivers 18-BIT GTL/GTL + TO |
| RS00510K00HS73 | vishay / dale | Res Wirewound 10K Ohm 3% 5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| CW02B15R00JE7013 | vishay / dale | Res Wirewound 15 Ohm 5% 4W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| GS8161ZV36CD-300 | gsi technology | 512K X 36 (18 MEG) NBT, JTAG |
| 74AUP2G07GM-G | NXP Semiconductors | Buffers & Line Drivers DUAL BUFFER 1.8V OPEN DRAIN |
| CW02B15R60KE1213 | vishay / dale | Res Wirewound 15.6 Ohm 10% 4W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| RS00510R00FB14 | vishay / dale | Res Wirewound 10 Ohm 1% 5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| GS8170DW36C-250I | gsi technology | SRAM Chip Sync Quad 1.8V 18M-Bit 512K x 36 2.1ns 209-Pin FBGA Tray |
| CW02B160R0KE70 | vishay / dale | Res Wirewound 160 Ohm 10% 3W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| RS005110R0HB12 | vishay / dale | Res Wirewound 110 Ohm 3% 5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 74HCT7541N | NXP Semiconductors | Buffers & Line Drivers OCT SCHM TRIG BUF/LINE N/INV |
| CW02B165R0JE70 | vishay / dale | Res Wirewound 165 Ohm 5% 3W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| GS8170LW72C-200 | gsi technology | SRAM Chip Sync Octal 1.8V 18M-Bit 256K x 72-Bit 2.25ns 209-Pin FBGA Tray |
| RS005113R0JB12 | vishay / dale | Res Wirewound 113 Ohm 5% 5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| CW02B169R0KE7013 | vishay / dale | Res Wirewound 169 Ohm 10% 4W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| 74HCU04DB-T | NXP Semiconductors | Inverters HEX INVERTER (UNBUF) |
| MM74HCT541SJX | Fairchild Semiconductor | Buffers & Line Drivers Octal 3-STATE Buffer |
| CW02B1K000JE12 | vishay / dale | Res Wirewound 1K Ohm 5% 3W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| RS005120R0JL03 | vishay / dale | Res Wirewound 120 Ohm 5% 5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Lacer Pack |
| 74ACT158SJX | Fairchild Semiconductor | Encoders, Decoders, Multiplexers & Demultiplexers Qd 2-Inp Multiplexer |
| CW02B1K100JE12 | vishay / dale | Res Wirewound 1.1K Ohm 5% 3W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| N74F259D-T | NXP Semiconductors | Latches 8-BIT ADDRSSBL LATCH |
| RS00513K00JB12 | vishay / dale | Res Wirewound 13K Ohm 5% 5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| GS8320EV36T-250I | gsi technology | SRAM Chip Sync Quad 1.8V 36M-Bit 1M x 36 5.5ns/2.5ns 100-Pin TQFP Tray |
| CW02B1K100KE12 | vishay / dale | Res Wirewound 1.1K Ohm 10% 3W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| TPIC6A259DWR | Texas Instruments | Latches 8 Bit Addressable Latch |
| CW02B1K300KE12 | vishay / dale | Res Wirewound 1.3K Ohm 10% 3W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| 74HCT646DB-T | NXP Semiconductors | Bus Transceivers OCTAL TRANSCEIVER/ REGISTER 3-S |
| RS00514R00FB12 | vishay / dale | Res Wirewound 14 Ohm 1% 5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| CW02B1K300KE70 | vishay / dale | Res Wirewound 1.3K Ohm 10% 3W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| GS832132E-133 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 32M-Bit 1M x 32 8.5ns/4ns 165-Pin FBGA Tray |
| ISP1110VH-T | NXP Semiconductors | USB Interface IC USB FS TRANSCVR W/UART |
| RS00515K00BB12 | vishay / dale | Res Wirewound 15K Ohm 0.1% 5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| CW02B1K400JS73 | vishay / dale | Res Wirewound 1.4K Ohm 5% 3W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| GS8321E18E-150I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 36M-Bit 2M x 18 7.5ns/3.8ns 165-Pin FBGA Tray |
| CW02B1K550KE12 | vishay / dale | Res Wirewound 1.55K Ohm 10% 3W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
| RS005160R0JS73 | vishay / dale | Res Wirewound 160 Ohm 5% 5W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
| GS8321E36E-200 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 36M-Bit 1M x 36 6.5ns/3ns 165-Pin FBGA Tray |
| 74LVX273SJX | Fairchild Semiconductor | Flip Flops Oct D-Type Flip-Flop |
| CW02B1K600KE1213 | vishay / dale | Res Wirewound 1.6K Ohm 10% 4W ±30ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
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