规格参数 > 第13830页
ES2FHE3/5BT 现货价格参数; CRCW060349K9FKTA 现货价格参数; CDR14BP200EJUM 现货价格参数; NS02B250R0BS73 现货价格参数; ES3AHE3/57T 现货价格参数; CRCW06034K75FKTA 现货价格参数; CDR14BP240CGUS 现货价格参数; NS02B27R40FB12 现货价格参数; CDR14BP270EJUR 现货价格参数; CRCW0603560RFKTA 现货价格参数;
型号 | 生产商 | 产品描述 |
---|---|---|
ES2FHE3/5BT | vishay / semiconductor | Diode Switching 300V 2A 2-Pin SMB T/R |
CRCW060349K9FKTA | vishay / dale | Res Thick Film 0603 49.9K Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
CDR14BP200EJUM | avx | Cap Ceramic 20pF 500V C0G 5% SMD (1%FR) 125°C Waffle Pack |
NS02B250R0BS73 | vishay / dale | Res Wirewound 250 Ohm 0.1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
ES3AHE3/57T | vishay / semiconductor | Diode Switching 50V 3A 2-Pin SMC T/R |
CRCW06034K75FKTA | vishay / dale | Res Thick Film 0603 4.75K Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
CDR14BP240CGUS | avx | Cap Ceramic 24pF 200V C0G 2% SMD (0.001%FR) 125°C Waffle Pack |
NS02B27R40FB12 | vishay / dale | Res Wirewound 27.4 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
CDR14BP270EJUR | avx | Cap Ceramic 27pF 500V C0G 5% SMD (0.01%FR) 125°C Waffle Pack |
CRCW0603560RFKTA | vishay / dale | Res Thick Film 0603 560 Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
ES3CHE3/57T | vishay / semiconductor | Diode Switching 150V 3A 2-Pin SMC T/R |
NS02B27R40FS70 | vishay / dale | Res Wirewound 27.4 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
CDR14BP2R2EBUR | avx | Cap Ceramic 2.2pF 500V C0G 0.1pF SMD (0.01%FR) 125°C Waffle Pack |
CRCW0603649RFKTA | vishay / dale | Res Thick Film 0603 649 Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
ESH2BHE3/5BT | vishay / semiconductor | Diode Switching 100V 2A 2-Pin SMB T/R |
CDR14BP2R7EBURM | avx | Cap Ceramic 2.7pF 500V C0G 0.1pF SMD (0.01%FR) 125°C Plastic T/R |
CRCW060364K9FKTA | vishay / dale | Res Thick Film 0603 64.9K Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
NS02B2K200FK50 | vishay / dale | Res Wirewound 2.2K Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
CDR14BP391CFUM | avx | Cap Ceramic 390pF 200V C0G 1% SMD (1%FR) 125°C Waffle Pack |
ESH3BHE3/57T | vishay / semiconductor | Diode Switching 100V 3A 2-Pin SMC T/R |
CRCW060368R1FKTA | vishay / dale | Res Thick Film 0603 68.1 Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
NS02B2K400FB12 | vishay / dale | Res Wirewound 2.4K Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
CDR14BP3R6EBUS | avx | Cap Ceramic 3.6pF 500V C0G 0.1pF SMD (0.001%FR) 125°C Waffle Pack |
CRCW06038K66FKTA | vishay / dale | Res Thick Film 0603 8.66K Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
ESQT-125-02-F-D-550 | samtec inc. | Conn Elevated Socket SKT 50 POS 2mm Solder ST Thru-Hole Tube |
CDR14BP3R6ECUR | avx | Cap Ceramic 3.6pF 500V C0G 0.25pF SMD (0.01%FR) 125°C Waffle Pack |
NS02B2K500FS73 | vishay / dale | Res Wirewound 2.5K Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
ESQT-150-03-G-Q-350 | samtec inc. | Conn Elevated Socket SKT 200 POS 2mm Solder ST Thru-Hole Tube |
CDR14BP471CMUS | avx | Cap Ceramic 470pF 200V C0G 20% SMD (0.001%FR) 125°C Waffle Pack |
CRCW080510K0FKTA | vishay / dale | 0805,10K,1%,T/R |
NS02B30R00JE12 | vishay / dale | Res Wirewound 30 Ohm 5% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
CDR14BP502AFUP | avx | Cap Ceramic 0.005uF 50V C0G 1% SMD (0.1%FR) 125°C Waffle Pack |
EU80574KJ041N S LAP2 | intel | MPU Xeon® Processor E5405 64-Bit 45nm 2GHz 771-Pin FCLGA |
CRCW0805150RFKTC | vishay / dale | Res Thick Film 0805 150 Ohm 1% 1/8W ±100ppm/°C Molded SMD SMD Paper T/R |
NS02B35R00FS73 | vishay / dale | Res Wirewound 35 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
CRCW08051K21FKTA | vishay / dale | Res Thick Film 0805 1.21K Ohm 1% 1/8W ±100ppm/°C Molded SMD SMD Paper T/R |
CDR14BP620EFSS | avx | Cap Ceramic 62pF 500V C0G 1% SMD (0.001%FR) 125°C Waffle Pack |
EU80574KJ053N S LANW | intel | INTEL XEON PROCESSOR E5410, 2.33 GHZ CPU SPEED |
NS02B391R0FB12 | vishay / dale | Res Wirewound 391 Ohm 1% 3W ±20ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole Bulk |
CRCW08051K50FKTA | vishay / dale | Res Thick Film 0805 1.5K Ohm 1% 1/8W ±100ppm/°C Molded SMD SMD Paper T/R |
CDR14BP621BFUM | avx | Cap Ceramic 620pF 100V C0G 1% SMD (1%FR) 125°C Waffle Pack |
EU80574KJ060N S LANV | intel | MPU Xeon® Processor E5420 64-Bit 45nm 2.5GHz 771-Pin FCLGA |
NS02B3R000JR36 | vishay / dale | Res Wirewound 3 Ohm 5% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
CRCW08051K50FKTB | vishay / dale | Res Thick Film 0805 1.5K Ohm 1% 1/8W ±100ppm/°C Molded SMD SMD Paper T/R |
CDR14BP681AJUR | avx | Cap Ceramic 680pF 50V C0G 5% SMD (0.01%FR) 125°C Waffle Pack |
CDR14BP820EFUR | avx | Cap Ceramic 82pF 500V C0G 1% SMD (0.01%FR) 125°C Waffle Pack |
NS02B3R670FS70 | vishay / dale | Res Wirewound 3.67 Ohm 1% 3W ±50ppm/°C Ceramic Hi Temp Sil AXL Thru-Hole T/R |
CRCW08051M00FKTA | vishay / dale | Res Thick Film 0805 1M Ohm 1% 1/8W ±100ppm/°C Molded SMD SMD Paper T/R |
EU80574KJ080N S LANQ | intel | MPU Xeon® Processor E5450 64-Bit 45nm 3GHz 771-Pin FCLGA |
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