规格参数 > 第1238页
MTMS-136-52-S-S-205 现货价格参数; 1301.9306 现货价格参数; CDR14BG131DJSP 现货价格参数; 5962-8851001XA 现货价格参数; MTMS-150-60-G-D-230 现货价格参数; CDR14BG201DFSP 现货价格参数; 1301.9313 现货价格参数; MTSW-101-07-T-S-240 现货价格参数; CDR14BG2R0EBSS 现货价格参数; 5962-8851001XC 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| MTMS-136-52-S-S-205 | samtec inc. | Conn Unshrouded Header HDR 36 POS 1.27mm Solder ST Thru-Hole Tube |
| 1301.9306 | schurter | Switch Tactile N.O. SPST Round Button PC Pins 0.05A 12VDC 100000Cycle 1.6N Thru-Hole Box |
| CDR14BG131DJSP | avx | Cap Ceramic 130pF 300V +90±20ppm/C 5% SMD (0.1%FR) 125°C Waffle Pack |
| 5962-8851001XA | rochester electronics | 394SD/883B,QUAD,12BIT,DAC |
| MTMS-150-60-G-D-230 | samtec inc. | Conn Unshrouded Header HDR 100 POS 1.27mm Solder ST Thru-Hole Tube |
| CDR14BG201DFSP | avx | Cap Ceramic 200pF 300V +90±20ppm/C 1% SMD (0.1%FR) 125°C Waffle Pack |
| 1301.9313 | schurter | Switch Tactile N.O. SPST Round Button Gull Wing 0.05A 12VDC 100000Cycle 1.6N SMD Box |
| MTSW-101-07-T-S-240 | samtec inc. | Conn Unshrouded Header HDR 1 POS Solder ST Thru-Hole |
| CDR14BG2R0EBSS | avx | Cap Ceramic 2pF 500V +90±20ppm/C 0.1pF SMD (0.001%FR) 125°C Waffle Pack |
| 5962-8851001XC | rochester electronics | |
| MTSW-101-07-T-T-110-RA | samtec inc. | Conn Unshrouded Header HDR 3 POS Solder RA Thru-Hole |
| 1301.9317 | schurter | Switch Tactile N.O. SPST Round Button Gull Wing 0.05A 12VDC 100000Cycle 1.6N SMD Box |
| CDR14BG2R2EBURM | avx | Cap Ceramic 2.2pF 500V +90±20ppm/C 0.1pF SMD (0.01%FR) 125°C Plastic T/R |
| MTSW-102-07-L-S-190 | samtec inc. | Conn Unshrouded Header HDR 2 POS 2.54mm Solder ST Thru-Hole |
| 5962-88515032A | rochester electronics | |
| CDR14BG361CGUPM | avx | Cap Ceramic 360pF 200V +90±20ppm/C 2% SMD (0.1%FR) 125°C Plastic T/R |
| 1312302-1 | te connectivity / amp | CONNECTOR |
| MTSW-102-08-S-S-235 | samtec inc. | Conn Unshrouded Header HDR 2 POS 2.54mm Solder ST Thru-Hole |
| CDR14BG3R0ECUPM500 | avx | Cap Ceramic 3pF 500V +90±20ppm/C 0.25pF SMD (0.1%FR) 125°C Plastic T/R |
| 5962-8855203XA | integrated device technology (idt) | SRAM Chip Async Single 5V 256K-Bit 32K x 8 55ns 28-Pin CDIP |
| MTSW-102-09-T-S-475 | samtec inc. | Conn Unshrouded Header HDR 2 POS 2.54mm Solder ST Thru-Hole |
| 930-0308 | Lighting Science Group | LED Lighting Development Tools Test Boards |
| CDR14BG3R3ECUM | avx | Cap Ceramic 3.3pF 500V +90±20ppm/C 0.25pF SMD (1%FR) 125°C Waffle Pack |
| MTSW-102-11-H-D-640 | samtec inc. | Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST Thru-Hole |
| CDR14BG471CKSS | avx | Cap Ceramic 470pF 200V +90±20ppm/C 10% SMD (0.001%FR) 125°C Waffle Pack |
| 5962-8858702XA | rochester electronics | |
| LFBGADAS1C | Freescale Semiconductor | Sockets & Adapters PB-FREE 256 PIN 1.0 MM Z |
| MTSW-102-12-L-D-120 | samtec inc. | Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST Thru-Hole |
| CDR14BG561BFSM | avx | Cap Ceramic 560pF 100V +90±20ppm/C 1% SMD (1%FR) 125°C Waffle Pack |
| MTSW-102-22-G-S-430 | samtec inc. | Conn Unshrouded Header HDR 2 POS 2.54mm Solder ST Thru-Hole |
| 1320121-1 | te connectivity / amp | SHEAR, FLOATING |
| CDR14BG5R1EDWSM500 | avx | Cap Ceramic 5.1pF 500V +90±20ppm/C 0.5pF SMD (0.001%FR) 125°C Plastic T/R |
| 5962-8867301LA | rochester electronics | |
| MTSW-103-07-G-D-225 | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole |
| CDR14BG621BJUS | avx | Cap Ceramic 620pF 100V +90±20ppm/C 5% SMD (0.001%FR) 125°C Waffle Pack |
| 1320194-1 | te connectivity / amp | GROUND PIN DRIVE BAR |
| MTSW-103-07-G-S-130-RA | samtec inc. | Conn Unshrouded Header HDR 3 POS 2.54mm Solder RA Thru-Hole |
| 5962-8868201EA | rochester electronics | |
| CDR14BG821AKSM | avx | Cap Ceramic 820pF 50V +90±20ppm/C 10% SMD (1%FR) 125°C Waffle Pack |
| 1337245-3 | te connectivity / amp | Conn Housing RCP 2 POS 5.46mm Crimp ST Cable Mount Loose Piece |
| MTSW-103-07-T-S-100-RA | samtec inc. | Conn Unshrouded Header HDR 3 POS 2.54mm Solder RA Thru-Hole |
| CDR14BG821AKSP | avx | Cap Ceramic 820pF 50V +90±20ppm/C 10% SMD (0.1%FR) 125°C Waffle Pack |
| 5962-8870801CA | rochester electronics | |
| MTSW-103-08-G-S-130-RA | samtec inc. | Conn Unshrouded Header HDR 3 POS 2.54mm Solder RA Thru-Hole |
| CDR14BG821AKUP | avx | Cap Ceramic 820pF 50V +90±20ppm/C 10% SMD (0.1%FR) 125°C Waffle Pack |
| 1338293-2 | te connectivity / amp | SHEAR, FLOATING |
| MTSW-103-08-L-S-340 | samtec inc. | Conn Unshrouded Header HDR 3 POS 2.54mm Solder ST Thru-Hole |
| CDR14BG8R2EBUSM | avx | Cap Ceramic 8.2pF 500V +90±20ppm/C 0.1pF SMD (0.001%FR) 125°C Plastic T/R |
| 5962-8871304RA | rochester electronics |
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