规格参数 > 第12013页
THS4601CDDA 现货价格参数; GS832236E-150 现货价格参数; CY62136VNLL-70ZSXAT 现货价格参数; CR-59S66O 现货价格参数; THS7530PWP 现货价格参数; GS8322V36B-200I 现货价格参数; CY62137VNLL-70ZSXAT 现货价格参数; TIBPAL16L8-12MJ 现货价格参数; CR-59S66O-T 现货价格参数; GS8322Z18B-133I 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| THS4601CDDA | texas instruments | OP Amp Single GP ±16.5V 8-Pin HSOP EP Tube |
| GS832236E-150 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 36M-Bit 1M x 36 8.5ns/3.8ns 165-Pin FBGA Tray |
| CY62136VNLL-70ZSXAT | cypress semiconductor | SRAM Chip Async Single 3V 2M-Bit 128K x 16 70ns 44-Pin TSOP-II T/R |
| CR-59S66O | teledyne relays | RF Switch 0MHz to 26.5GHz 50dB |
| THS7530PWP | texas instruments | SP Amp Variable Gain Amp Single 5.5V 14-Pin HTSSOP EP Rail |
| GS8322V36B-200I | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 1M x 36 7.5ns/3ns 119-Pin FBGA Tray |
| CY62137VNLL-70ZSXAT | cypress semiconductor | SRAM Chip Async Single 3V 2M-Bit 128K x 16 70ns 44-Pin TSOP-II T/R |
| TIBPAL16L8-12MJ | texas instruments | High Performance Impact-X PAL Circuits 20-Pin CDIP Tube |
| CR-59S66O-T | teledyne relays | RF Switch 0MHz to 26.5GHz 50dB |
| GS8322Z18B-133I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 36M-Bit 2M x 18 8.5ns/4ns 119-Pin FBGA Tray |
| TIBPAL16R8-7MFKB | texas instruments | High Performance Impact-X PAL Circuits 20-Pin LCCC Tube |
| CY62137VNLL-70ZSXE | cypress semiconductor | SRAM Chip Async Single 3V 2M-Bit 128K x 16 70ns 44-Pin TSOP-II |
| GS8322Z18E-166I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 36M-Bit 2M x 18 8ns/3.5ns 165-Pin FBGA Tray |
| CRCW0603120RFKEC | vishay / dale | Res Thick Film 0603 120 Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
| TIBPAL20R4-15CFN | texas instruments | High Performance Impact PAL Circuits 28-Pin PLCC |
| GS8322Z18GB-150I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 36M-Bit 2M x 18 8.5ns/3.8ns 119-Pin FBGA Tray |
| CY74FCT162240CTPVC | rochester electronics | 16 BIT BUFFER |
| CRCW06034K70FKEC | vishay / dale | Res Thick Film 0603 4.7K Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
| TIBPAL20R4-20MJTB | texas instruments | High Performance Impact PAL Circuits 24-Pin CDIP Tube |
| GS8322ZV36B-200 | gsi technology | SRAM Chip Sync Quad 1.8V 36M-Bit 1M x 36 7.5ns/3ns 119-Pin FBGA Tray |
| CY74FCT16240ATPVC | rochester electronics | 16 BIT BUFFER |
| TIM1011-10L | toshiba | Trans JFET 15V 11.5A 3-Pin 2-11C1B |
| GS8342R36GE-200I | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 1M x 36 0.45ns 165-Pin FBGA Tray |
| CRCW06038K20FKEC | vishay / dale | Res Thick Film 0603 8.2K Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
| TIM1414-2-252 | toshiba | Trans JFET 15V 2.6A 3-Pin 2-9D1B |
| CY74FCT2543CTQCT | rochester electronics | REDUCED DRIVE LATCHED TRANSCEIVER |
| GS8342S08E-200 | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 4M x 8 0.45ns 165-Pin FBGA Tray |
| TIM3742-8UL | toshiba | Trans JFET 15V 7A 3-Pin 2-11D1B |
| GS8342S36E-300I | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 1M x 36 0.45ns 165-Pin FBGA Tray |
| CRCW12105R60FNEA | vishay / dale | Res Thick Film 1210 5.6 Ohm 1% 1/2W ±200ppm/°C Molded SMD SMD Paper T/R |
| CY7C0852AV-133AXCT | cypress semiconductor | SRAM Chip Sync Dual 3.3V 4M-Bit 128K x 36 4.7ns 176-Pin TQFP |
| TIM7179-6UL | toshiba | Trans JFET 15V 5A 3-Pin 2-11D1B |
| GS8342S36GE-300I | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 1M x 36 0.45ns 165-Pin FBGA Tray |
| CY7C0852AV-167BBC | cypress semiconductor | SRAM Chip Sync Dual 3.3V 4M-Bit 128K x 36 4ns 172-Pin FBGA |
| CRCW201045R3FKEF | vishay / dale | Res Thick Film 2010 45.3 Ohm 1% 3/4W ±100ppm/°C Molded SMD SMD Blister T/R |
| TJHD22701 | amphenol pcd | TJHD22701 JUNCTION MODULE |
| GS84018AB-150I | gsi technology | SRAM Chip Sync Dual 3.3V 4M-Bit 256K x 18 10ns/3.8ns 119-Pin FBGA Tray |
| WM8501GED/RV | Wolfson Microelectronics | Digital to Analog Converters - DAC 24-bit 192kHz Stereo DAC w/ Line Driver |
| DAC108S085CIMT | Texas Instruments | Digital to Analog Converters - DAC |
| CRCW25125R76FNEG | vishay / dale | Res Thick Film 2512 5.76 Ohm 1% 1W ±200ppm/°C Molded SMD SMD Blister T/R |
| CY7C1041CV33-10ZSXA | cypress semiconductor | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 10ns 44-Pin TSOP-II Tray |
| TJM122706 | amphenol pcd | M81714/1-DC2 JUNCTION MODULE |
| GS840E18AGT-166I | gsi technology | SRAM Chip Sync Dual 3.3V 4M-Bit 256K x 18 8.5ns/3.5ns 100-Pin TQFP Tray |
| CRS-33S1C-T | teledyne relays | RF Switch 2P3T 0MHz to 22GHz 50dB |
| TJT701015 | amphenol pcd | TJT701015 MOUNTING RAIL |
| CY7C1041CV33-10ZSXAT | cypress semiconductor | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 10ns 44-Pin TSOP-II T/R |
| ADC1173CIMTCX | Texas Instruments | Analog to Digital Converters - ADC |
| TL061IP | texas instruments | OP Amp Single GP ±18V 8-Pin PDIP Tube |
| CRS-33S1O | teledyne relays | RF Switch 2P3T 0MHz to 22GHz 50dB |
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