规格参数 > 第11824页

74LCX540BQX 现货价格参数; TMPN3150B1AFG(I) 现货价格参数; HTSW-115-14-G-D 现货价格参数; 74LCX574BQX 现货价格参数; HTSW-116-14-G-T 现货价格参数; MSM7570-01T3K 现货价格参数; 74LCXR2245MSAX 现货价格参数; HTSW-117-07-S-D 现货价格参数; SI3220-KQ 现货价格参数; HTSW-120-06-T-S 现货价格参数;

型号 生产商 产品描述
74LCX540BQX fairchild semiconductor Buffer/Line Driver 8-CH Inverting 3-ST CMOS 20-Pin DQFN EP T/R
TMPN3150B1AFG(I) Toshiba Network Controller & Processor ICs Neuron Chip w/ ext ROM I/F
HTSW-115-14-G-D samtec inc. Conn Unshrouded Header HDR 30 POS 2.54mm Solder ST Thru-Hole
74LCX574BQX fairchild semiconductor Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1-Element 20-Pin DQFN EP T/R
HTSW-116-14-G-T samtec inc. Conn Unshrouded Header HDR 48 POS 2.54mm Solder ST Thru-Hole
MSM7570-01T3K Oki Semiconductor Telecom ICs 32 KBPS SINGLE CH ADPCM CODEC IC
74LCXR2245MSAX fairchild semiconductor Bus XCVR Single 8-CH 3-ST 20-Pin SSOP T/R
HTSW-117-07-S-D samtec inc. Conn Unshrouded Header HDR 34 POS 2.54mm Solder ST Thru-Hole
SI3220-KQ Silicon Labs Telecom Line Management ICs Dual-Channel SLIC INTERNAL 65 VRMS
HTSW-120-06-T-S samtec inc. Conn Unshrouded Header HDR 20 POS 2.54mm Solder ST Thru-Hole
74LV2GT04AUSE-E renesas electronics Inverter 3-Element CMOS 8-Pin SSOP T/R
71V67803S166BG integrated device technology (idt) SRAM Chip Sync Single 3.3V 9M-Bit 512K x 18 3.5ns 119-Pin BGA
HTSW-121-09-G-D samtec inc. Conn Unshrouded Header HDR 42 POS 2.54mm Solder ST Thru-Hole
CY7C924ADX-AXI Cypress Semiconductor Network Controller & Processor ICs 200 MBaud HOTLink Transceiver
74LVC162245APFG8 integrated device technology (idt) Bus XCVR Dual 16-CH 3-ST 48-Pin TVSOP T/R
72-271608-03P amphenol Conn Subminiature Cylindrical PIN 3 POS Solder ST Cable Mount 3 Terminal 1 Port
HTSW-124-10-G-D-RA samtec inc. Conn Unshrouded Header HDR 48 POS 2.54mm Solder RA Thru-Hole
7200L50J8 integrated device technology (idt) FIFO Mem Async Dual Depth/Width Uni-Dir 256 x 9 32-Pin PLCC T/R
C320C911JCG5TA kemet Cap Ceramic 910pF 500V C0G 5% Radial 2.54mm 125°C Bulk
HTSW-125-08-L-D samtec inc. Conn Unshrouded Header HDR 50 POS 2.54mm Solder ST Thru-Hole
74LVCH32245ABFG8 integrated device technology (idt) Bus XCVR Quad 32-CH 3-ST 96-Pin CABGA T/R
7201LA15SO integrated device technology (idt) FIFO Mem Async Dual Depth/Width Uni-Dir 512 x 9 28-Pin SOIC Tube/Tray
HTSW-130-08-S-D samtec inc. Conn Unshrouded Header HDR 60 POS 2.54mm Solder ST Thru-Hole
C321C101K2G5TA kemet Cap Ceramic 100pF 200V C0G 10% Radial 6.35mm 125°C Bulk
74LVTH573MTC rochester electronics QUAD 2 INPUT NAND GATE (S.O.)
7202LA12SOG8 integrated device technology (idt) FIFO Mem Async Dual Depth/Width Uni-Dir 1K x 9 28-Pin SOIC T/R
HTSW-135-10-G-D samtec inc. Conn Unshrouded Header HDR 70 POS 2.54mm Solder ST Thru-Hole
C321C102J2G5TA kemet Cap Ceramic 0.001uF 200V C0G 5% Radial 6.35mm 125°C Bulk
7202LA25SOI8 integrated device technology (idt) FIFO Mem Async Dual Depth/Width Uni-Dir 1K x 9 28-Pin SOIC T/R
74LVX138MX fairchild semiconductor Decoder/Demultiplexer Single 3-to-8 16-Pin SOIC N T/R
HTSW-136-08-T-D-RA samtec inc. Conn Unshrouded Header HDR 72 POS 2.54mm Solder RA Thru-Hole
7204L15TP integrated device technology (idt) FIFO Mem Async Dual Depth/Width Uni-Dir 4K x 9 28-Pin PDIP
CO110/48L Connect One Ethernet ICs iChip CO110PC Intrnt Cntrlr I-temp
HTSW-136-09-T-D samtec inc. Conn Unshrouded Header HDR 72 POS 2.54mm Solder ST Thru-Hole
74SSTUA32S868BK integrated device technology (idt) 28-BIT BUFFERRED REGISTER WITH PARITY FOR DDR2.176 TFBGA (GR
7205L25J8 integrated device technology (idt) FIFO Mem Async Dual Depth/Width Uni-Dir 8K x 9 32-Pin PLCC T/R
HTSW-150-24-L-D samtec inc. Conn Unshrouded Header HDR 100 POS 2.54mm Solder ST Thru-Hole
722-12 teledyne relays Electromechanical Relay DPDT 1ADC/0.25AAC 12VDC 500Ohm Through Hole
CYV15G0402DXB-BGXC Cypress Semiconductor Telecom Line Management ICs Quad Port Video HOTLink II Video
TMPN3120FE5MG(I) Toshiba Network Controller & Processor ICs Neuron Chip w/ 3 KB EEPROM
HTSW-150-30-G-D samtec inc. Conn Unshrouded Header HDR 100 POS 2.54mm Solder ST Thru-Hole
72205LB25TFI integrated device technology (idt) FIFO Mem Sync Dual Depth/Width Uni-Dir 256 x 18 64-Pin STQFP
NJM#567M NJR Telecom ICs _ Lead Free Package
C321C103M5U5HA kemet Cap Ceramic 0.01uF 50V Z5U 20% Radial 6.35mm 85°C Bulk
HW-02-08-T-D-250-SM samtec inc. Conn Board Stacker HDR 4 POS 2.54mm Solder ST SMD
72206-100CALF fci sa Conn PCMCIA HDR 68 POS 2.54mm Solder RA Thru-Hole Tray 0.5A/Contact
HW-02-10-G-D-522-SM-LC samtec inc. Conn Board Stacker HDR 4 POS 2.54mm Solder ST SMD
74SSTV16859RGQ8G3 texas instruments Registered Buffer Single 13-CH CMOS 56-Pin VQFN EP T/R
72235LB25TFI integrated device technology (idt) FIFO Mem Sync Dual Depth/Width Uni-Dir 2K x 18 64-Pin STQFP

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