规格参数 > 第11824页
74LCX540BQX 现货价格参数; TMPN3150B1AFG(I) 现货价格参数; HTSW-115-14-G-D 现货价格参数; 74LCX574BQX 现货价格参数; HTSW-116-14-G-T 现货价格参数; MSM7570-01T3K 现货价格参数; 74LCXR2245MSAX 现货价格参数; HTSW-117-07-S-D 现货价格参数; SI3220-KQ 现货价格参数; HTSW-120-06-T-S 现货价格参数;
型号 | 生产商 | 产品描述 |
---|---|---|
74LCX540BQX | fairchild semiconductor | Buffer/Line Driver 8-CH Inverting 3-ST CMOS 20-Pin DQFN EP T/R |
TMPN3150B1AFG(I) | Toshiba | Network Controller & Processor ICs Neuron Chip w/ ext ROM I/F |
HTSW-115-14-G-D | samtec inc. | Conn Unshrouded Header HDR 30 POS 2.54mm Solder ST Thru-Hole |
74LCX574BQX | fairchild semiconductor | Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1-Element 20-Pin DQFN EP T/R |
HTSW-116-14-G-T | samtec inc. | Conn Unshrouded Header HDR 48 POS 2.54mm Solder ST Thru-Hole |
MSM7570-01T3K | Oki Semiconductor | Telecom ICs 32 KBPS SINGLE CH ADPCM CODEC IC |
74LCXR2245MSAX | fairchild semiconductor | Bus XCVR Single 8-CH 3-ST 20-Pin SSOP T/R |
HTSW-117-07-S-D | samtec inc. | Conn Unshrouded Header HDR 34 POS 2.54mm Solder ST Thru-Hole |
SI3220-KQ | Silicon Labs | Telecom Line Management ICs Dual-Channel SLIC INTERNAL 65 VRMS |
HTSW-120-06-T-S | samtec inc. | Conn Unshrouded Header HDR 20 POS 2.54mm Solder ST Thru-Hole |
74LV2GT04AUSE-E | renesas electronics | Inverter 3-Element CMOS 8-Pin SSOP T/R |
71V67803S166BG | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 9M-Bit 512K x 18 3.5ns 119-Pin BGA |
HTSW-121-09-G-D | samtec inc. | Conn Unshrouded Header HDR 42 POS 2.54mm Solder ST Thru-Hole |
CY7C924ADX-AXI | Cypress Semiconductor | Network Controller & Processor ICs 200 MBaud HOTLink Transceiver |
74LVC162245APFG8 | integrated device technology (idt) | Bus XCVR Dual 16-CH 3-ST 48-Pin TVSOP T/R |
72-271608-03P | amphenol | Conn Subminiature Cylindrical PIN 3 POS Solder ST Cable Mount 3 Terminal 1 Port |
HTSW-124-10-G-D-RA | samtec inc. | Conn Unshrouded Header HDR 48 POS 2.54mm Solder RA Thru-Hole |
7200L50J8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 256 x 9 32-Pin PLCC T/R |
C320C911JCG5TA | kemet | Cap Ceramic 910pF 500V C0G 5% Radial 2.54mm 125°C Bulk |
HTSW-125-08-L-D | samtec inc. | Conn Unshrouded Header HDR 50 POS 2.54mm Solder ST Thru-Hole |
74LVCH32245ABFG8 | integrated device technology (idt) | Bus XCVR Quad 32-CH 3-ST 96-Pin CABGA T/R |
7201LA15SO | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 512 x 9 28-Pin SOIC Tube/Tray |
HTSW-130-08-S-D | samtec inc. | Conn Unshrouded Header HDR 60 POS 2.54mm Solder ST Thru-Hole |
C321C101K2G5TA | kemet | Cap Ceramic 100pF 200V C0G 10% Radial 6.35mm 125°C Bulk |
74LVTH573MTC | rochester electronics | QUAD 2 INPUT NAND GATE (S.O.) |
7202LA12SOG8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 1K x 9 28-Pin SOIC T/R |
HTSW-135-10-G-D | samtec inc. | Conn Unshrouded Header HDR 70 POS 2.54mm Solder ST Thru-Hole |
C321C102J2G5TA | kemet | Cap Ceramic 0.001uF 200V C0G 5% Radial 6.35mm 125°C Bulk |
7202LA25SOI8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 1K x 9 28-Pin SOIC T/R |
74LVX138MX | fairchild semiconductor | Decoder/Demultiplexer Single 3-to-8 16-Pin SOIC N T/R |
HTSW-136-08-T-D-RA | samtec inc. | Conn Unshrouded Header HDR 72 POS 2.54mm Solder RA Thru-Hole |
7204L15TP | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 4K x 9 28-Pin PDIP |
CO110/48L | Connect One | Ethernet ICs iChip CO110PC Intrnt Cntrlr I-temp |
HTSW-136-09-T-D | samtec inc. | Conn Unshrouded Header HDR 72 POS 2.54mm Solder ST Thru-Hole |
74SSTUA32S868BK | integrated device technology (idt) | 28-BIT BUFFERRED REGISTER WITH PARITY FOR DDR2.176 TFBGA (GR |
7205L25J8 | integrated device technology (idt) | FIFO Mem Async Dual Depth/Width Uni-Dir 8K x 9 32-Pin PLCC T/R |
HTSW-150-24-L-D | samtec inc. | Conn Unshrouded Header HDR 100 POS 2.54mm Solder ST Thru-Hole |
722-12 | teledyne relays | Electromechanical Relay DPDT 1ADC/0.25AAC 12VDC 500Ohm Through Hole |
CYV15G0402DXB-BGXC | Cypress Semiconductor | Telecom Line Management ICs Quad Port Video HOTLink II Video |
TMPN3120FE5MG(I) | Toshiba | Network Controller & Processor ICs Neuron Chip w/ 3 KB EEPROM |
HTSW-150-30-G-D | samtec inc. | Conn Unshrouded Header HDR 100 POS 2.54mm Solder ST Thru-Hole |
72205LB25TFI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 256 x 18 64-Pin STQFP |
NJM#567M | NJR | Telecom ICs _ Lead Free Package |
C321C103M5U5HA | kemet | Cap Ceramic 0.01uF 50V Z5U 20% Radial 6.35mm 85°C Bulk |
HW-02-08-T-D-250-SM | samtec inc. | Conn Board Stacker HDR 4 POS 2.54mm Solder ST SMD |
72206-100CALF | fci sa | Conn PCMCIA HDR 68 POS 2.54mm Solder RA Thru-Hole Tray 0.5A/Contact |
HW-02-10-G-D-522-SM-LC | samtec inc. | Conn Board Stacker HDR 4 POS 2.54mm Solder ST SMD |
74SSTV16859RGQ8G3 | texas instruments | Registered Buffer Single 13-CH CMOS 56-Pin VQFN EP T/R |
72235LB25TFI | integrated device technology (idt) | FIFO Mem Sync Dual Depth/Width Uni-Dir 2K x 18 64-Pin STQFP |
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