规格参数 > 第11823页

HTSW-105-14-T-S 现货价格参数; SI5318-G-BC 现货价格参数; CYV15G0404DXB-BGXC 现货价格参数; HTSW-105-22-S-S-RA 现货价格参数; 71V3559S75BQ 现货价格参数; 74FCT166244CTPVG 现货价格参数; HTSW-105-22-S-T-RA 现货价格参数; SI3227-B-GQ 现货价格参数; 71V35761SA200BG8 现货价格参数; 74FCT16952ETPAG8 现货价格参数;

型号 生产商 产品描述
HTSW-105-14-T-S samtec inc. Conn Unshrouded Header HDR 5 POS 2.54mm Solder ST Thru-Hole
SI5318-G-BC Silicon Labs Telecom ICs SONET/SDH Precision Clock Multiplier IC
CYV15G0404DXB-BGXC Cypress Semiconductor Telecom Line Management ICs 3.3V QUAD HOTLINK II TRANS W/RECLOCKER
HTSW-105-22-S-S-RA samtec inc. Conn Unshrouded Header HDR 5 POS 2.54mm Solder RA Thru-Hole
71V3559S75BQ integrated device technology (idt) SRAM Chip Sync Single 3.3V 4.5M-Bit 256K x 18 7.5ns 165-Pin CABGA
74FCT166244CTPVG integrated device technology (idt) Buffer/Line Driver 16-CH Non-Inverting 3-ST CMOS 48-Pin SSOP
HTSW-105-22-S-T-RA samtec inc. Conn Unshrouded Header HDR 15 POS 2.54mm Solder RA Thru-Hole
SI3227-B-GQ Silicon Labs Telecom Line Management ICs Dual Chanel Wideband SLIC/CODEC
71V35761SA200BG8 integrated device technology (idt) SRAM Chip Sync Single 3.3V 4.5M-Bit 128K x 36 3.1ns 119-Pin BGA T/R
74FCT16952ETPAG8 integrated device technology (idt) Bus XCVR Dual 16-CH 3-ST 56-Pin TSSOP T/R
HTSW-105-23-S-D samtec inc. Conn Unshrouded Header HDR 10 POS 2.54mm Solder ST Thru-Hole
CYV15G0403DXB-BGXC Cypress Semiconductor Telecom Line Management ICs Quad Indep Ch HOTLink II XCVR
C320C820JDG5TA kemet Cap Ceramic 82pF 1000V C0G 5% Radial 2.54mm 125°C Bulk
HTSW-106-07-S-D samtec inc. Conn Unshrouded Header HDR 12 POS 2.54mm Solder ST Thru-Hole
74FCT257DTQG8 integrated device technology (idt) Multiplexer 1-Element CMOS 3-ST 8-IN 16-Pin QSOP T/R
71V416S10BEG integrated device technology (idt) SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 10ns 48-Pin CABGA Tube/Tray
HTSW-106-08-H-S samtec inc. Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole
CY7B9334-270JXCT Cypress Semiconductor Telecom Line Management ICs SMPTE HOTLink Receiver COM
71V424L15YG8 integrated device technology (idt) SRAM Chip Async Single 3.3V 4M-Bit 512K x 8 15ns 36-Pin SOJ T/R
HTSW-106-16-G-D-LA samtec inc. Conn Unshrouded Header HDR 12 POS 2.54mm Solder RA Thru-Hole
HTSW-106-18-T-S-LL samtec inc. Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole
C320C820KCR5TA kemet Cap Ceramic 82pF 500V X7R 10% Radial 2.54mm 125°C Bulk
71V65603S100BG integrated device technology (idt) SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 5ns 119-Pin BGA
HTSW-107-25-G-D-LL samtec inc. Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole
71V65603S100BGI8 integrated device technology (idt) SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 5ns 119-Pin BGA T/R
C320C820KDR5TA kemet Cap Ceramic 82pF 1000V X7R 10% Radial 2.54mm 125°C Bulk
HTSW-108-08-T-T-RA samtec inc. Conn Unshrouded Header HDR 24 POS 2.54mm Solder RA Thru-Hole
71V65703S75BG8 integrated device technology (idt) SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 7.5ns 119-Pin BGA T/R
HTSW-108-26-L-S samtec inc. Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole
71V65703S85PFG integrated device technology (idt) SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 8.5ns 100-Pin TQFP
CO120SQ/48TI-3 Connect One Ethernet ICs iChip 802.11b-10/100 BaseT Internt Cntrlr
HTSW-109-10-H-D-RA samtec inc. Conn Unshrouded Header HDR 18 POS 2.54mm Solder RA Thru-Hole
71V67603S133BQI integrated device technology (idt) SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 4.2ns 165-Pin CABGA
HTSW-110-08-T-D samtec inc. Conn Unshrouded Header HDR 20 POS 2.54mm Solder ST Thru-Hole
ML7037-003TBZ03A-7 Oki Semiconductor Telecom Voice Conditioning ICs VSP, Dual EC 120ms Noise Canceller 17dB
74FCT3807EPGGI8 integrated device technology (idt) Clock Fanout Buffer 10-OUT 20-Pin TSSOP T/R
71V67703S75PFG8 integrated device technology (idt) SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 7.5ns 100-Pin TQFP T/R
HTSW-111-08-G-D-RA-011 samtec inc. Conn Unshrouded Header HDR 22 POS 2.54mm Solder RA Thru-Hole
71V67703S85PFG integrated device technology (idt) SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 8.5ns 100-Pin TQFP
74J-7-1-2 cooper bussmann AT&T COLUMBUS FUSE
HTSW-112-08-S-S-RA samtec inc. Conn Unshrouded Header HDR 12 POS 2.54mm Solder RA Thru-Hole
HV441PJ-G Supertex Telephone Ringers High Voltage Ring Generator
HTSW-112-24-G-T samtec inc. Conn Unshrouded Header HDR 36 POS 2.54mm Solder ST Thru-Hole
74LCX11MX rochester electronics 3V TRIPLE 3 INPUT NAND GATE
C320C822KCR5TATR kemet Cap Ceramic 0.0082uF 500V X7R 10% Radial 2.54mm 125°C T/R
HTSW-114-07-S-T samtec inc. Conn Unshrouded Header HDR 42 POS 2.54mm Solder ST Thru-Hole
74LCX138SJX rochester electronics 3V 1-OF-8 DECODER
HTSW-115-06-G-T samtec inc. Conn Unshrouded Header HDR 45 POS 2.54mm Solder ST Thru-Hole
SI3225-KQ Silicon Labs Telecom Line Management ICs DUAL CH SLIC CODEC

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