规格参数 > 第11823页
HTSW-105-14-T-S 现货价格参数; SI5318-G-BC 现货价格参数; CYV15G0404DXB-BGXC 现货价格参数; HTSW-105-22-S-S-RA 现货价格参数; 71V3559S75BQ 现货价格参数; 74FCT166244CTPVG 现货价格参数; HTSW-105-22-S-T-RA 现货价格参数; SI3227-B-GQ 现货价格参数; 71V35761SA200BG8 现货价格参数; 74FCT16952ETPAG8 现货价格参数;
型号 | 生产商 | 产品描述 |
---|---|---|
HTSW-105-14-T-S | samtec inc. | Conn Unshrouded Header HDR 5 POS 2.54mm Solder ST Thru-Hole |
SI5318-G-BC | Silicon Labs | Telecom ICs SONET/SDH Precision Clock Multiplier IC |
CYV15G0404DXB-BGXC | Cypress Semiconductor | Telecom Line Management ICs 3.3V QUAD HOTLINK II TRANS W/RECLOCKER |
HTSW-105-22-S-S-RA | samtec inc. | Conn Unshrouded Header HDR 5 POS 2.54mm Solder RA Thru-Hole |
71V3559S75BQ | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 4.5M-Bit 256K x 18 7.5ns 165-Pin CABGA |
74FCT166244CTPVG | integrated device technology (idt) | Buffer/Line Driver 16-CH Non-Inverting 3-ST CMOS 48-Pin SSOP |
HTSW-105-22-S-T-RA | samtec inc. | Conn Unshrouded Header HDR 15 POS 2.54mm Solder RA Thru-Hole |
SI3227-B-GQ | Silicon Labs | Telecom Line Management ICs Dual Chanel Wideband SLIC/CODEC |
71V35761SA200BG8 | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 4.5M-Bit 128K x 36 3.1ns 119-Pin BGA T/R |
74FCT16952ETPAG8 | integrated device technology (idt) | Bus XCVR Dual 16-CH 3-ST 56-Pin TSSOP T/R |
HTSW-105-23-S-D | samtec inc. | Conn Unshrouded Header HDR 10 POS 2.54mm Solder ST Thru-Hole |
CYV15G0403DXB-BGXC | Cypress Semiconductor | Telecom Line Management ICs Quad Indep Ch HOTLink II XCVR |
C320C820JDG5TA | kemet | Cap Ceramic 82pF 1000V C0G 5% Radial 2.54mm 125°C Bulk |
HTSW-106-07-S-D | samtec inc. | Conn Unshrouded Header HDR 12 POS 2.54mm Solder ST Thru-Hole |
74FCT257DTQG8 | integrated device technology (idt) | Multiplexer 1-Element CMOS 3-ST 8-IN 16-Pin QSOP T/R |
71V416S10BEG | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 10ns 48-Pin CABGA Tube/Tray |
HTSW-106-08-H-S | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole |
CY7B9334-270JXCT | Cypress Semiconductor | Telecom Line Management ICs SMPTE HOTLink Receiver COM |
71V424L15YG8 | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 512K x 8 15ns 36-Pin SOJ T/R |
HTSW-106-16-G-D-LA | samtec inc. | Conn Unshrouded Header HDR 12 POS 2.54mm Solder RA Thru-Hole |
HTSW-106-18-T-S-LL | samtec inc. | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole |
C320C820KCR5TA | kemet | Cap Ceramic 82pF 500V X7R 10% Radial 2.54mm 125°C Bulk |
71V65603S100BG | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 5ns 119-Pin BGA |
HTSW-107-25-G-D-LL | samtec inc. | Conn Unshrouded Header HDR 14 POS 2.54mm Solder ST Thru-Hole |
71V65603S100BGI8 | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 5ns 119-Pin BGA T/R |
C320C820KDR5TA | kemet | Cap Ceramic 82pF 1000V X7R 10% Radial 2.54mm 125°C Bulk |
HTSW-108-08-T-T-RA | samtec inc. | Conn Unshrouded Header HDR 24 POS 2.54mm Solder RA Thru-Hole |
71V65703S75BG8 | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 7.5ns 119-Pin BGA T/R |
HTSW-108-26-L-S | samtec inc. | Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole |
71V65703S85PFG | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 8.5ns 100-Pin TQFP |
CO120SQ/48TI-3 | Connect One | Ethernet ICs iChip 802.11b-10/100 BaseT Internt Cntrlr |
HTSW-109-10-H-D-RA | samtec inc. | Conn Unshrouded Header HDR 18 POS 2.54mm Solder RA Thru-Hole |
71V67603S133BQI | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 4.2ns 165-Pin CABGA |
HTSW-110-08-T-D | samtec inc. | Conn Unshrouded Header HDR 20 POS 2.54mm Solder ST Thru-Hole |
ML7037-003TBZ03A-7 | Oki Semiconductor | Telecom Voice Conditioning ICs VSP, Dual EC 120ms Noise Canceller 17dB |
74FCT3807EPGGI8 | integrated device technology (idt) | Clock Fanout Buffer 10-OUT 20-Pin TSSOP T/R |
71V67703S75PFG8 | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 7.5ns 100-Pin TQFP T/R |
HTSW-111-08-G-D-RA-011 | samtec inc. | Conn Unshrouded Header HDR 22 POS 2.54mm Solder RA Thru-Hole |
71V67703S85PFG | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 8.5ns 100-Pin TQFP |
74J-7-1-2 | cooper bussmann | AT&T COLUMBUS FUSE |
HTSW-112-08-S-S-RA | samtec inc. | Conn Unshrouded Header HDR 12 POS 2.54mm Solder RA Thru-Hole |
HV441PJ-G | Supertex | Telephone Ringers High Voltage Ring Generator |
HTSW-112-24-G-T | samtec inc. | Conn Unshrouded Header HDR 36 POS 2.54mm Solder ST Thru-Hole |
74LCX11MX | rochester electronics | 3V TRIPLE 3 INPUT NAND GATE |
C320C822KCR5TATR | kemet | Cap Ceramic 0.0082uF 500V X7R 10% Radial 2.54mm 125°C T/R |
HTSW-114-07-S-T | samtec inc. | Conn Unshrouded Header HDR 42 POS 2.54mm Solder ST Thru-Hole |
74LCX138SJX | rochester electronics | 3V 1-OF-8 DECODER |
HTSW-115-06-G-T | samtec inc. | Conn Unshrouded Header HDR 45 POS 2.54mm Solder ST Thru-Hole |
SI3225-KQ | Silicon Labs | Telecom Line Management ICs DUAL CH SLIC CODEC |
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