规格参数 > 第11816页
7133SA25JG 现货价格参数; 68657-436 现货价格参数; HEDS-5505#E04 现货价格参数; 68683-224 现货价格参数; 71FE 现货价格参数; AN983X-AH-T-21 现货价格参数; HEDT-9140#I00 现货价格参数; 68683-232 现货价格参数; 71P71104S200BQ8 现货价格参数; HES100ZE-A 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 7133SA25JG | integrated device technology (idt) | SRAM Chip Async Dual 5V 32K-Bit 2K x 16 25ns 68-Pin PLCC |
| 68657-436 | fci sa | Conn Unshrouded Header HDR 36 POS 2.54mm Solder ST Thru-Hole Bag |
| HEDS-5505#E04 | avago technologies | Optical Encoder 5-Pin |
| 68683-224 | fci sa | Conn Socket Strip SKT 48 POS 2.54mm Solder ST Thru-Hole Tube |
| 71FE | cooper bussmann | Fuse 71A 690V 2-Pin Bolt |
| AN983X-AH-T-21 | Infineon Technologies | Network Controller & Processor ICs WIRED NIC |
| HEDT-9140#I00 | avago technologies | Optical Incremental Encoder Module |
| 68683-232 | fci sa | Conn Socket Strip SKT 64 POS 2.54mm Solder ST Thru-Hole Tube |
| 71P71104S200BQ8 | integrated device technology (idt) | SRAM Chip Sync Single 1.8V 18M-Bit 2M x 9-Bit 0.45ns 165-Pin FBGA T/R |
| HES100ZE-A | power-one | Module DC-DC 1-OUT 3.3V 30A 100W 9-Pin Half-Brick |
| 68689-436 | fci sa | Conn Unshrouded Header HDR 36 POS 2.54mm Solder ST Thru-Hole Bag |
| HH-105-PIN | m/a-com technology solutions | Hybrid Junction 4-Pin TO-5-2 |
| 71P74604S167BQGI | integrated device technology (idt) | SRAM Chip Sync Dual 1.8V 18M-Bit 512K x 36 0.5ns 165-Pin FBGA |
| C320C331KDR5TA | kemet | Cap Ceramic 330pF 1000V X7R 10% Radial 2.54mm 125°C Bulk |
| 68696-172 | fci sa | Conn Unshrouded Header HDR 72 POS 2.54mm Solder RA Thru-Hole Poly Bag |
| HIP4083ABT | intersil | MOSFET DRVR 0.3A 3-OUT Hi Side 3-Phase Brdg 16-Pin SOIC N T/R |
| 71V3548S133PFG8 | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 4.5M-Bit 256K x 18 4.2ns 100-Pin TQFP T/R |
| 68705-236H | fci sa | Conn Unshrouded Header HDR 36 POS 2.54mm Solder ST Thru-Hole Bag |
| C320C332J2G5HATR | kemet | Cap Ceramic 0.0033uF 200V C0G 5% Radial 2.54mm 125°C T/R |
| HLD15YGB | power-one | Module DC-DC 2-OUT 5V/1.8V 12A/15A 60W 10-Pin |
| 68898-010 | fci sa | Conn Modular Jack F 6 POS 2.54mm Solder RA Thru-Hole 6 Terminal 1 Port Tube Cat 3 |
| 71V35761SA166BQG | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 4.5M-Bit 128K x 36 3.5ns 165-Pin FBGA |
| HLE-111-02-G-DV-TE | samtec inc. | Conn Socket Strip SKT 22 POS 2.54mm Solder ST Thru-Hole Tube |
| C320C332JCG5TA | kemet | Cap Ceramic 0.0033uF 500V C0G 5% Radial 2.54mm 125°C Bulk |
| AFE1205E | Texas Instruments | Telecom Line Management ICs 2Mbps Sngl Pair HDSL Anlg Front End |
| HLE-120-02-F-DV-P-TR | samtec inc. | Conn Socket Strip SKT 40 POS 2.54mm Solder ST SMD T/R |
| 71V3577S65PFGI8 | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 4M-Bit 128K x 36 65ns 100-Pin TQFP T/R |
| 69145-212 | fci sa | Conn Jumper F 12 POS 2.54mm ST Bag |
| HLE-125-02-G-DV-BE | samtec inc. | Conn Socket Strip SKT 50 POS 2.54mm Solder ST SMD Tube |
| TJA1041T/N1 | NXP Semiconductors | Network Controller & Processor ICs HI SPD CAN TRANSCVR |
| 69145-320 | fci sa | Conn Jumper F 20 POS 2.54mm ST Bag |
| HLMP-K150-C0002 | avago technologies | LED Uni-Color Red 645nm 2-Pin T-1 T/R |
| 71V416L15PHGI8 | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 15ns 44-Pin TSOP-II T/R |
| 69190-609 | fci sa | Conn Unshrouded Header HDR 9 POS 2.54mm Solder ST Thru-Hole Bag |
| HLMP-SD11-J0000 | avago technologies | LED Uni-Color Red 639nm 2-Pin T-1 3/4 Bulk |
| ADM8668TXA12-G | Infineon Technologies | Network Controller & Processor ICs ROUTER / ADM |
| 69192-472 | fci sa | Conn Unshrouded Header HDR 72 POS 2.54mm Solder ST Thru-Hole Bag |
| 71V416S12PHG28 | integrated device technology (idt) | SRAM Chip Async Single 3.3V 4M-Bit 256K x 16 12ns 44-Pin TSOP-II T/R |
| HLS-0101-G-31 | samtec inc. | Conn Socket Strip SKT 1 POS Solder ST Thru-Hole |
| 6N139-X009T | vishay / semiconductor | Optocoupler DC-IN 1-CH Darlington With Base DC-OUT 8-Pin PDIP SMD T/R |
| C320C332KDR5TATR | kemet | Cap Ceramic 0.0033uF 1000V X7R 10% Radial 2.54mm 125°C T/R |
| 71V65803S100BGGI | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 9M-Bit 512K x 18 5ns 119-Pin BGA |
| HLS-0104-T-12 | samtec inc. | Conn Socket Strip SKT 4 POS 2.54mm Solder ST Thru-Hole |
| 7-103361-2 | te connectivity / amp | Conn Shrouded Header HDR 24 POS 2.54mm Solder RA Thru-Hole |
| HLS-0112-G-3 | samtec inc. | Conn Socket Strip SKT 12 POS 2.54mm Solder ST Thru-Hole Tube |
| AU5790D14 | NXP Semiconductors | Network Controller & Processor ICs SINGLE WIRE CAN TRANSCEIVER |
| 71V67703S85BQG | integrated device technology (idt) | SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 8.5ns 165-Pin CABGA |
| 7-146254-0 | te connectivity / amp | Conn Unshrouded Header HDR 40 POS 2.54mm Solder ST Thru-Hole |
| HLS-0115-T-10 | samtec inc. | Conn Socket Strip SKT 15 POS 2.54mm Solder ST Thru-Hole Tube |
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