规格参数 > 第113875页
CDRH127/LDNP-150MC-PR 现货价格参数; MTSW-205-27-G-D-1140 现货价格参数; LT1460EIS8-2.5#PBF 现货价格参数; RMCF0603FT41R2 现货价格参数; IMC1812EB220J 现货价格参数; CDRH64BNP-220MC 现货价格参数; MTSW-206-08-G-S-340 现货价格参数; MXMMAX1607ESA 现货价格参数; IMC1812EB4R7J 现货价格参数; CI100505-27NJ 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| CDRH127/LDNP-150MC-PR | sumida | PLASTIC TAPE |
| MTSW-205-27-G-D-1140 | samtec inc. | Conn Unshrouded Header HDR 10 POS 5.08mm Solder ST Thru-Hole |
| LT1460EIS8-2.5#PBF | Linear Technology | V-Ref Precision 2.5V 40mA 8-Pin SOIC N |
| RMCF0603FT41R2 | stackpole | Res Thick Film 0603 41.2 Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
| IMC1812EB220J | vishay / dale | Ind Chip Molded Wirewound 22uH 5% 2.52MHz 50Q-Factor Powdered Iron 180mA 1812 Bulk |
| CDRH64BNP-220MC | sumida | |
| MTSW-206-08-G-S-340 | samtec inc. | Conn Unshrouded Header HDR 6 POS 5.08mm Solder ST Thru-Hole |
| MXMMAX1607ESA | maxim integrated | USB Power SW Hi Side Single 5.5V 0.85A 8-Pin SOIC N |
| IMC1812EB4R7J | vishay / dale | Ind Chip Molded Wirewound 4.7uH 5% 7.96MHz 50Q-Factor Powdered Iron 315mA 1812 Bulk |
| CI100505-27NJ | bourns | Ind Chip Multi-Layer 27nH 5% 100MHz 8Q-Factor Ceramic 200mA 0402 T/R |
| MTSW-206-08-S-T-200-LA | samtec inc. | Conn Unshrouded Header HDR 18 POS 5.08mm Solder RA Thru-Hole |
| IRF8707GPBF | international rectifier | Trans MOSFET N-CH 30V 11A 8-Pin SOIC |
| NAND32GW3F4AN6F | Micron Technology | NAND Flash Parallel/Serial 3V/3.3V 32Gbit 4G x 8bit 25us 48-Pin TSOP T/R |
| RMCF0603FT422R | stackpole | Res Thick Film 0603 422 Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
| CIR020R20A-8P | itt interconnect solutions | CONNECTOR - |
| MTSW-206-09-T-T-225-RA | samtec inc. | Conn Unshrouded Header HDR 18 POS 5.08mm Solder RA Thru-Hole |
| IRF8714GPBF | international rectifier | Trans MOSFET N-CH 30V 14A 8-Pin SOIC |
| CIR07R-365SY-F80-98 | itt interconnect solutions | CIR07R-36-5SY-F80-98 |
| MTSW-206-10-S-T-200-LA | samtec inc. | Conn Unshrouded Header HDR 18 POS 5.08mm Solder RA Thru-Hole |
| M8340102K4701GBD04 | Vishay | Res Thick Film NET 4.7K Ohm 2% 1.5W ±100ppm/°C BUS Molded 16-Pin DIP Pin Thru-Hole Tube |
| IRF8721GPBF | international rectifier | Trans MOSFET N-CH 30V 14A 8-Pin SOIC |
| S200-4-9020 | te connectivity / raychem wire | S200-4-9020 |
| RMCF0603FT42R2 | stackpole | Res Thick Film 0603 42.2 Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
| MTSW-207-13-G-Q-1040 | samtec inc. | Conn Unshrouded Header HDR 14 POS 5.08mm Solder ST Thru-Hole |
| EP1SGX25DF1020C5 | Altera | None |
| NRC10J390TR | NIC Components | Res Thick Film 0805 39 Ohm 5% 0.125W(1/8W) ±200ppm/°C Molded SMD Paper T/R |
| 202G221-780-06-0 | te connectivity / raychem wire | 202G221-780-06-0 |
| MTSW-209-09-L-D-225-LA | samtec inc. | Conn Unshrouded Header HDR 18 POS 5.08mm Solder RA Thru-Hole |
| HPG5066X | Stanley Electric | LED Uni-Color Green 560nm 2-Pin T-1 3/4 Bulk |
| MIC39101-3.3YM | Micrel Semiconductor | LDO Regulator Pos 3.3V 1A 8-Pin SOIC |
| S200-4-W2-22-9 | te connectivity / raychem wire | S200-4-W2-22-9 |
| RMCF0603FT43K2 | stackpole | Res Thick Film 0603 43.2K Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
| MTSW-209-09-S-Q-100-RA | samtec inc. | Conn Unshrouded Header HDR 18 POS 5.08mm Solder RA Thru-Hole |
| IRS-A200ST01-R1 | murata electronics | Pyroelectric Infrared Sensor 4-Pin SMD T/R |
| LTC1235CSW#PBF | Linear Technology | Processor Supervisor 4.65V 4.65V 16-Pin SOIC W |
| CLT-107-02-L-D-BE-P | samtec inc. | Conn Socket Strip SKT 14 POS 2mm Solder ST SMD Tube |
| MTSW-209-10-G-D-100-RA | samtec inc. | Conn Unshrouded Header HDR 18 POS 5.08mm Solder RA Thru-Hole |
| LTC2630ISC6-HZ8#TRPBF | Linear Technology | DAC 1-CH 8-bit 6-Pin SC-70 T/R |
| MS3101E369SW | ITT Corporation | Conn MIL-C-5015 Circular SKT 31 POS Solder ST Cable Mount 31 Terminal 1 Port |
| D-141-0112CS1812 | te connectivity / raychem wire | D-141-0112CS1812 |
| MTSW-209-10-G-D-225-LA | samtec inc. | Conn Unshrouded Header HDR 18 POS 5.08mm Solder RA Thru-Hole |
| RMCF0603FT453R | stackpole | Res Thick Film 0603 453 Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Paper T/R |
| ISC1210ER1R5J | vishay / dale | Ind Chip Shielded/Molded Wirewound 1.5uH 5% 7.96MHz 30Q-Factor Powdered Iron 370mA 1210 T/R |
| 68000-600H | FCI | Conn Unshrouded Header HDR 2.54mm Solder ST Thru-Hole Reel |
| MTSW-209-10-G-Q-225-RA | samtec inc. | Conn Unshrouded Header HDR 18 POS 5.08mm Solder RA Thru-Hole |
| CN3000-APP-SSL | cavium | Octeon Production Software Toolkits |
| ISC1210ER560K | vishay / dale | Ind Chip Shielded/Molded Wirewound 56uH 10% 2.52MHz 30Q-Factor Powdered Iron 95mA 1210 T/R |
| LTC1440CN8#PBF | Linear Technology | Comparator Single ±5.5V/11V 8-Pin PDIP N |
| MTSW-209-11-L-Q-100-RA | samtec inc. | Conn Unshrouded Header HDR 18 POS 5.08mm Solder RA Thru-Hole |
页数:
1
20000
30000
40000
50000
60000
70000
80000
90000
104000
105000
106000
107000
108000
109000
110000
111000
112900
113000
113100
113200
113300
113400
113500
113600
113780
113790
113800
113810
113820
113830
113840
113850
113860
113861
113862
113863
113864
113865
113866
113867
113868
113869
113870
113871
113872
113873
113874
113875
113876
113877
113878
113879
113880
113881
113882
113883
113884
113885
113886
113887
113888
113890
113900
113910
113920
113930
113940
113950
113960
114000
114100
114200
114300
114400
114500
114600
114700
115000
116000
117000
118000
119000
120000
121000
122000
130000
140000
150000
160000
170000
180000
190000
200000
234766