规格参数 > 第113690页
S19262PBI 现货价格参数; 5112-7501-000 现货价格参数; HTSW-209-22-L-D-LA 现货价格参数; 602GB00E0898PF586 现货价格参数; F211AG224J063L 现货价格参数; MTSW-214-12-T-D-200-RA 现货价格参数; 52883-0294-PROTO 现货价格参数; HTSW-209-29-T-S-RA 现货价格参数; 602GB00E0898SF416 现货价格参数; F5E10L-10M5 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| S19262PBI | AppliedMicro | DW/FEC/PM and AsyncMap Device 676-Pin BGA |
| 5112-7501-000 | aep (applied engineering products) | Conn TNC-SMB Adapter F/M ST Panel Mount |
| HTSW-209-22-L-D-LA | samtec inc. | Conn Unshrouded Header HDR 18 POS 5.08mm Solder RA Thru-Hole |
| 602GB00E0898PF586 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| F211AG224J063L | KEMET Electronics | Cap Film 0.22uF 63V PPS 5% (13 X 4 X 9mm) Radial 10mm 150°C T/R |
| MTSW-214-12-T-D-200-RA | samtec inc. | Conn Unshrouded Header HDR 28 POS 5.08mm Solder RA Thru-Hole |
| 52883-0294-PROTO | molex | Conn Board to Board RCP 20 POS 0.64mm Solder ST SMD T/R |
| HTSW-209-29-T-S-RA | samtec inc. | Conn Unshrouded Header HDR 9 POS 5.08mm Solder RA Thru-Hole |
| 602GB00E0898SF416 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| F5E10L-10M5 | Panduit | Cable Assembly Dual Fiber Optic Patch Cord 5m Duplex LC to Duplex LC PL-PL |
| 52883-0794-PROTO | molex | Conn Board to Board RCP 70 POS 0.64mm Solder ST SMD T/R |
| HTSW-209-30-G-S-RA | samtec inc. | Conn Unshrouded Header HDR 9 POS 5.08mm Solder RA Thru-Hole |
| 602GB00E1006PE | amphenol pcd | Conn Miniature Bayonet PIN 6 POS Crimp ST Flange Mount 6 Terminal 1 Port |
| 593D476X0025E2TE3 | Vishay | Cap Tant Solid 47uF 25V E CASE 20% (7.3 X 4.3 X 4mm) SMD 7343-43 0.2 Ohm 125°C T/R |
| 52883-1094-PROTO | molex | Conn Board to Board RCP 100 POS 0.64mm Solder ST SMD T/R |
| MTSW-214-22-T-D-100-LA | samtec inc. | Conn Unshrouded Header HDR 28 POS 5.08mm Solder RA Thru-Hole |
| HTSW-209-30-T-D-RA | samtec inc. | Conn Unshrouded Header HDR 18 POS 5.08mm Solder RA Thru-Hole |
| 602GB00E1006PE416 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| 551-0001-846F | Dialight | T 1 SING CUSTOM CBI |
| 52901-0674-PROTO | molex | Conn Board to Board RCP 60 POS 0.635mm Solder ST SMD Embossed T/R |
| HTSW-210-08-F-Q-RA | samtec inc. | Conn Unshrouded Header HDR 20 POS 5.08mm Solder RA Thru-Hole |
| 602GB00E1006PF | amphenol pcd | Conn Miniature Bayonet PIN 6 POS Crimp ST Flange Mount 6 Terminal 1 Port |
| SLLC8051F700GQ | silicon laboratories | MCU 8-bit C8051F70x 8051 CISC 15KB Flash 2.5V/3.3V 64-Pin TQFP |
| 52991-0608-PROTO | molex | Conn Board to Board RCP 60 POS 0.5mm Solder ST SMD Embossed T/R |
| HTSW-210-08-G-S-RA | samtec inc. | Conn Unshrouded Header HDR 10 POS 5.08mm Solder RA Thru-Hole |
| MTSW-214-28-T-D-730-RA | samtec inc. | Conn Unshrouded Header HDR 28 POS 5.08mm Solder RA Thru-Hole |
| 602GB00E1006PN416 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| SLLC8051F804GS | silicon laboratories | MCU 8-bit C8051F8xx 8051 CISC 16KB Flash 3V 16-Pin SOIC |
| 530AA176M560DG | silicon laboratories | SMD Crystal Oscillator 176.56MHz 3.3V 6-Pin SMD Tray |
| 602GB00E1006SB416 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| HTSW-210-08-L-D-LA | samtec inc. | Conn Unshrouded Header HDR 20 POS 5.08mm Solder RA Thru-Hole |
| SLLC8051F811GS | silicon laboratories | MCU 8-bit C8051F8xx 8051 CISC 16KB Flash 3V 16-Pin SOIC |
| 530AA176M560DGR | silicon laboratories | SMD Crystal Oscillator 176.56MHz 3.3V 6-Pin SMD T/R |
| 602GB00E1006SB586 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| MTSW-220-08-G-D-010 | samtec inc. | Conn Unshrouded Header HDR 40 POS 5.08mm Solder ST Thru-Hole |
| HTSW-210-08-L-D-RA | samtec inc. | Conn Unshrouded Header HDR 20 POS 5.08mm Solder RA Thru-Hole |
| SLLC8051F921GMR | silicon laboratories | MCU 8-bit C8051F92x 8051 CISC 32KB Flash 1.9V/2.4V 24-Pin QFN EP T/R |
| 531138-5 | te connectivity / amp | Conn Box Connector RCP 165 POS 2.54mm Solder ST Thru-Hole |
| 602GB00E1006SC586 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| HTSW-210-08-L-Q-RA | samtec inc. | Conn Unshrouded Header HDR 20 POS 5.08mm Solder RA Thru-Hole |
| M39003/03-2003 | KEMET Electronics | Cap Tant Solid 12uF 6V 10% (3.43 X 7.26mm) Axial (0.1%FR) 6 Ohm 125°C Bulk |
| SLLC8051F931GMR | silicon laboratories | MCU 8-bit C8051F93x 8051 CISC 64KB Flash 1.9V/2.4V 24-Pin QFN EP T/R |
| 602GB00E1006SF586 | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| HTSW-210-16-T-Q-LA | samtec inc. | Conn Unshrouded Header HDR 20 POS 5.08mm Solder RA Thru-Hole |
| MTSW-220-09-T-D-430-RA | samtec inc. | Conn Unshrouded Header HDR 40 POS 5.08mm Solder RA Thru-Hole |
| SLLC8051F990GM | silicon laboratories | MCU 8-bit C8051F99x 8051 CISC 8KB Flash 2.4V 20-Pin QFN EP |
| CDR32BP330BKSSTR | KEMET Electronics | Cap Ceramic 33pF 100V C0G 10% SMD 1206 (0.001%FR) 125°C Plastic T/R |
| 602GB00E1007PF | amphenol pcd | HI-TEMP BAYONET LOCK CONECT W/REAR INSERT/RELEASE CRIMP CONT |
| HTSW-214-08-T-S-LA | samtec inc. | Conn Unshrouded Header HDR 14 POS 5.08mm Solder RA Thru-Hole |
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