规格参数 > 第11142页
752091470GP 现货价格参数; M55342K05B115DSWB 现货价格参数; 752101222GP 现货价格参数; GS-R400V/2 现货价格参数; J431DD-18WM 现货价格参数; M55342K05B11E8SS3 现货价格参数; 752101223GPTR7 现货价格参数; GS3417-12V 现货价格参数; HSC-PH0.9-J2 现货价格参数; 752101271GP 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 752091470GP | cts components | Res Thick Film NET 47 Ohm 2% 1.3W ±200ppm/°C BUS Molded 9-Pin Single Row SMD Bulk |
| M55342K05B115DSWB | vishay / dale | Res Thick Film 2208 115 Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| 752101222GP | cts components | Res Thick Film NET 2.2K Ohm 2% 1.4W ±200ppm/°C BUS Molded 10-Pin Single Row SMD Bulk |
| GS-R400V/2 | stmicroelectronics | Conv DC-DC Single Step Down 9.1V to 40V 5-Pin |
| J431DD-18WM | teledyne relays | Electromechanical Relay SPDT 1ADC/0.25AAC 18VDC 2.3KOhm Through Hole |
| M55342K05B11E8SS3 | vishay / dale | Res Thick Film 2208 11.8K Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| 752101223GPTR7 | cts components | Res Thick Film NET 22K Ohm 2% 1.4W ±200ppm/°C BUS Molded 10-Pin Single Row SMD T/R |
| GS3417-12V | glenair | CABLE CLAMP |
| HSC-PH0.9-J2 | Hirose Connector | Fiber Optic Connectors SC TYP PLG LT-WEIGHT .9MM FIBER |
| 752101271GP | cts components | Res Thick Film NET 270 Ohm 2% 1.4W ±200ppm/°C BUS Molded 10-Pin Single Row SMD Bulk |
| GS3418-10C | glenair | CABLE CLAMP |
| M55342K05B12E1TWBT | vishay / dale | Res Thick Film 2208 12.1K Ohm 1% 9/40W ±100ppm/°C Molded SMD SMD Tray |
| 752103201GP | cts components | Res Thick Film NET 200 Ohm 2% 1.4W ±200ppm/°C ISOL Molded 10-Pin Single Row SMD Bulk |
| GS3418-12M | glenair | CABLE CLAMP |
| J431DD-32PM | teledyne relays | Electromechanical Relay SPDT 1ADC/0.25AAC 32VDC Through Hole |
| 752103221GP | cts components | Res Thick Film NET 220 Ohm 2% 1.4W ±200ppm/°C ISOL Molded 10-Pin Single Row SMD Bulk |
| M55342K05B140ESWB | vishay / dale | Res Thick Film 2208 140K Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| GS8160ZV18CT-250 | gsi technology | 1M X 18 (18 MEG) NBT |
| 752103683GPTR7 | cts components | Res Thick Film NET 68K Ohm 2% 1.4W ±200ppm/°C ISOL Molded 10-Pin Single Row SMD T/R |
| J431DD-40WL | teledyne relays | Electromechanical Relay SPDT 1ADC/0.25AAC 40VDC Through Hole |
| GS8160ZV36CT-300I | gsi technology | 512K X 36 (18 MEG) NBT |
| M55342K05B14D0SWB | vishay / dale | Res Thick Film 2208 14 Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| 752121222GPTR7 | cts components | Res Thick Film NET 2.2K Ohm 2% 1.7W ±200ppm/°C BUS Molded 12-Pin Single Row SMD T/R |
| GS8161E18BD-150I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 18M-Bit 1M x 18 7.5ns/3.8ns 165-Pin FBGA Tray |
| J431DD-40WM | teledyne relays | Electromechanical Relay SPDT 1ADC/0.25AAC 40VDC Through Hole |
| M55342K05B150DSS6 | vishay / dale | Res Thick Film 2208 150 Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| HMUB-L4PA-CAP | Hirose Connector | Fiber Optic Connectors FO CONN 4P B PNL SIDE CAP |
| 752121683GPTR7 | cts components | Res Thick Film NET 68K Ohm 2% 1.7W ±200ppm/°C BUS Molded 12-Pin Single Row SMD T/R |
| HSC-PH2-C1(01) | Hirose Connector | Fiber Optic Connectors FIBER OPTIC CONN |
| GS816272CC-300 | gsi technology | SRAM Chip Sync Octal 2.5V/3.3V 18M-Bit 256K x 72-Bit 5ns/2.8ns 209-Pin FBGA Tray |
| 752123105GP | cts components | Res Thick Film NET 1M Ohm 2% 1.7W ±200ppm/°C ISOL Molded 12-Pin Single Row SMD Bulk |
| M55342K05B150ETWBT | vishay / dale | Res Thick Film 2208 150K Ohm 1% 9/40W ±100ppm/°C Molded SMD SMD Tray |
| 752123151GP | cts components | Res Thick Film NET 150 Ohm 2% 1.7W ±200ppm/°C ISOL Molded 12-Pin Single Row SMD Bulk |
| GS8162Z36BB-200 | gsi technology | SRAM Chip Sync Quad 2.5V/3.3V 18M-Bit 512K x 36 6.5ns/3ns 119-Pin FBGA Tray |
| J431DDM3-18L | teledyne relays | Electromechanical Relay SPDT 1ADC/0.25AAC 18VDC 2.3KOhm Through Hole |
| M55342K05B15D0SS2 | vishay / dale | Res Thick Film 2208 15 Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| GS8170DW36AC-250 | gsi technology | SRAM Chip Sync Quad 1.8V 18M-Bit 512K x 36 2.1ns 209-Pin FBGA Tray |
| 752123330GPTR7 | cts components | Res Thick Film NET 33 Ohm 2% 1.7W ±200ppm/°C ISOL Molded 12-Pin Single Row SMD T/R |
| J431DDM3-32M | teledyne relays | QPL TO-5/.100 GRID |
| M55342K05B15D0SS3 | vishay / dale | Res Thick Film 2208 15 Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| 752161103GPTR7 | cts components | Res Thick Film NET 10K Ohm 2% 1.4W ±200ppm/°C BUS Molded 16-Pin Dual Row SMD T/R |
| HSC2-FK-A125(36) | Hirose Connector | Fiber Optic Connectors FIBER OPTIC CONN |
| J431DDM3-5L | teledyne relays | Electromechanical Relay SPDT 1ADC/0.25AAC 5VDC 100Ohm Through Hole |
| 752161223GP | cts components | Res Thick Film NET 22K Ohm 2% 1.4W ±200ppm/°C BUS Molded 16-Pin Dual Row SMD Bulk |
| GS8320EV32T-200I | gsi technology | SRAM Chip Sync Quad 1.8V 32M-Bit 1M x 32 6.5ns/3ns 100-Pin TQFP Tray |
| M55342K05B15E0SS3 | vishay / dale | Res Thick Film 2208 15K Ohm 1% 9/40W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| 752161391GP | cts components | Res Thick Film NET 390 Ohm 2% 1.4W ±200ppm/°C BUS Molded 16-Pin Dual Row SMD Bulk |
| J431DM3-18M | teledyne relays | Electromechanical Relay SPDT 1ADC/0.25AAC 18VDC 2.3KOhm Through Hole |
| GS8321V18E-166 | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 8ns/3.5ns 165-Pin FBGA Tray |
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