规格参数 > 第10968页
ERJ-S1TF27R4U 现货价格参数; 550T001M3CCB1G-58-9 现货价格参数; BZW50-33B 现货价格参数; 511-24G 现货价格参数; ERJ-S1TF2803U 现货价格参数; 550T001M3R3B1L 现货价格参数; C052C104M5R5CA 现货价格参数; 511-24H 现货价格参数; 550T003NF1R3K0F02 现货价格参数; ERJ-S1TF2871U 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| ERJ-S1TF27R4U | panasonic | Res Thick Film 2512 27.4 Ohm 1% 1W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
| 550T001M3CCB1G-58-9 | glenair | ADAPTER |
| BZW50-33B | stmicroelectronics | Diode TVS Single Bi-Dir 33V 5KW 2-Pin Case R-6 T/R |
| 511-24G | api delevan | Ind RF Molded/Unshielded 1.3uH 2% 7.9MHz 33Q-Factor Phenolic 685mA AXL T/R |
| ERJ-S1TF2803U | panasonic | Res Thick Film 2512 280K Ohm 1% 1W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
| 550T001M3R3B1L | glenair | Connector Accessories D-Subminiature Strain Relief Split Backshell 25 POS Top Cable Entry Electroless Nickel Rear Mounting |
| C052C104M5R5CA | kemet | Cap Ceramic 0.1uF 50V X7R 20% Radial 5.08mm 125°C Bulk |
| 511-24H | api delevan | Ind RF Molded/Unshielded 1.3uH 3% 7.9MHz 33Q-Factor Phenolic 685mA AXL T/R |
| 550T003NF1R3K0F02 | glenair | Connector Accessories EMI/RFI D-Sub Split Backshell Olive Drab Cadmium Over Electroless Nickel Aluminum 1 Shell Size |
| ERJ-S1TF2871U | panasonic | Res Thick Film 2512 2.87K Ohm 1% 1W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
| C052T272K1X5CM | kemet | Cap Ceramic 0.0027uF 100V X7R 10% Radial 5.08mm (1%FR) 125°C Bulk |
| 550T004M1R4E1F03 | glenair | Connector Accessories Top Entry EMI/RFI D-Subminiature Split Backshell with Strain Relief Rear Mounting with EMI Gasket Shell Size 1 |
| 511-24J | api delevan | Ind RF Molded/Unshielded 1.3uH 5% 7.9MHz 33Q-Factor Phenolic 685mA AXL T/R |
| C056T271K2X5CS | kemet | Cap Ceramic 270pF 200V X7R 10% Radial 5.08mm (0.001%FR) 125°C Bulk |
| 550T008M3R6K0F05 | glenair | Connector Accessories Top Entry EMI/RFI D-Sub Split Backshell G-Spring Shield Termination With Strain Relief Without EMI Gasket Rear Mounting Shell Size 3 |
| ERJ-S1TF28R7U | panasonic | Res Thick Film 2512 28.7 Ohm 1% 1W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
| C056T390K2X5CR | kemet | Cap Ceramic 39pF 200V X7R 10% Radial 5.08mm (0.01%FR) Bulk |
| 511-26J | api delevan | Ind RF Molded/Unshielded Wirewound 1.6uH 5% 7.9MHz 33Q-Factor Phenolic 610mA AXL T/R |
| 550T024NF405R2K1-389 | glenair | Connector Accessories Top Entry D-Sub Split Backshell Rear Mounting With EMI Gasket Shell Size 4 |
| ERJ-S1TF2941U | panasonic | Res Thick Film 2512 2.94K Ohm 1% 1W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
| C056T393K5X5CR | kemet | Cap Ceramic 0.039uF 50V X7R 10% Radial 5.08mm (0.01%FR) 125°C Bulk |
| 550T102M4F0E | glenair | Connector Accessories D-Sub Qwik-Ty Split Backshell with Strain-Relief Electroless Nickel Aluminum 4 Shell Size |
| 511-28G | api delevan | Ind RF Molded/Unshielded 2uH 2% 7.9MHz 33Q-Factor Phenolic 530mA AXL T/R |
| C0603C333K5RACTU | kemet | Cap Ceramic 0.033uF 50V X7R 10% SMD 0603 125°C Paper T/R |
| ERJ-S1TF3000U | panasonic | Res Thick Film 2512 300 Ohm 1% 1W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
| 552071-6 | te connectivity / amp | COVER, 180 DEG., 36 POS, TNG |
| C0603C399C5GACTU | kemet | Cap Ceramic 3.9pF 50V C0G 0.25pF SMD 0603 125°C Paper T/R |
| 511-32J | api delevan | Ind RF Molded/Unshielded 3uH 5% 7.9MHz 33Q-Factor Phenolic 355mA AXL T/R |
| 552770-2 | te connectivity / amp | Solder Terminal 18-24AWG Tin-Lead Strip |
| ERJ-S1TF3001U | panasonic | Res Thick Film 2512 3K Ohm 1% 1W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
| C062K393K1X5CA | kemet | Cap Ceramic 0.039uF 100V X7R 10% Radial 5.08mm 125°C Bulk |
| 552966-4 | te connectivity / amp | Cable Accessories Cartridge Assembly Yellow Individual |
| 511-34J | api delevan | Ind RF Molded/Unshielded 3.6uH 5% 7.9MHz 33Q-Factor Phenolic 325mA AXL T/R |
| C062T334K5X5CM | kemet | Cap Ceramic 0.33uF 50V X7R 10% Radial 5.08mm (1%FR) Bulk |
| ERJ-S1TF3010U | panasonic | Res Thick Film 2512 301 Ohm 1% 1W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
| 555057-1 | te connectivity / amp | Conn IEEE 488 RCP 50 POS 2.16mm Solder RA Thru-Hole 50 Terminal 1 Port |
| 511-36J | api delevan | Ind RF Molded/Unshielded 4.3uH 5% 7.9MHz 33Q-Factor Phenolic 305mA AXL T/R |
| C0805C181F5GACTU | kemet | Cap Ceramic 180pF 50V C0G 1% SMD 0805 125°C Paper T/R |
| 555139-1 | te connectivity / amp | Conn IEEE 488 RCP 24 POS 2.16mm Solder RA Thru-Hole 24 Terminal 1 Port |
| ERJ-S1TF3012U | panasonic | Res Thick Film 2512 30.12K Ohm 1% 1W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
| 2-2064937-1 | TE Connectivity | Fiber Optic Connectors |
| 511-40H | api delevan | Ind RF Molded/Unshielded 6.2uH 3% 7.9MHz 45Q-Factor Iron 455mA AXL T/R |
| HMUA-P1-H4(41) | Hirose Connector | Fiber Optic Connectors FO CONN SIMPLEX PLUG |
| ERJ-S1TF3013U | panasonic | Res Thick Film 2512 301K Ohm 1% 1W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
| 106004-3089 | Molex | Fiber Optic Connectors SPX AD BEZEL MX LBL BL BLK MTP SMAL FLNG |
| 2799429 | Phoenix Contact | Fiber Optic Connectors PSM-SET-BFOC-LINK/2 |
| 511-44F | api delevan | Ind RF Molded/Unshielded 9.1uH 1% 7.9MHz 55Q-Factor Iron 350mA AXL T/R |
| C0805C472M2RACTU | kemet | Cap Ceramic 0.0047uF 200V X7R 20% SMD 0805 125°C Plastic T/R |
| ERJ-S1TF3092U | panasonic | Res Thick Film 2512 30.92K Ohm 1% 1W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
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