规格参数 > 第10902页
145189-1 现货价格参数; ERJ-S12F5600U 现货价格参数; X9C303PIZ 现货价格参数; 4232R-222J 现货价格参数; 1452179-2 现货价格参数; XC2V2000-4FGG676I 现货价格参数; 1457207-5 现货价格参数; ERJ-S12F5601U 现货价格参数; XC2V3000-6FFG1152C 现货价格参数; 4232R-222K 现货价格参数;
型号 | 生产商 | 产品描述 |
---|---|---|
145189-1 | te connectivity / amp | AMP .050C/L PCI 60 DUAL POS |
ERJ-S12F5600U | panasonic | Res Thick Film 1812 560 Ohm 1% 3/4W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
X9C303PIZ | intersil | Digital Potentiometer 100POS 32KOhm Single 8-Pin PDIP |
4232R-222J | api delevan | Ind RF Unshielded Wirewound 2.2uH 5% 7.9MHz 30Q-Factor Iron 416mA 1210 T/R |
1452179-2 | te connectivity / amp | DOOR LATCH HDR,RE10 |
XC2V2000-4FGG676I | xilinx | FPGA Virtex-II Family 2M Gates 24192 Cells 650MHz 0.15um/0.12um (CMOS) Technology 1.5V 676-Pin FBGA |
1457207-5 | te connectivity / amp | C/A SM ST TO LC DUP 5M1 |
ERJ-S12F5601U | panasonic | Res Thick Film 1812 5.6K Ohm 1% 3/4W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
XC2V3000-6FFG1152C | xilinx | FPGA Virtex-II Family 3M Gates 32256 Cells 820MHz 0.15um/0.12um (CMOS) Technology 1.5V 1152-Pin FCBGA |
4232R-222K | api delevan | Ind RF Unshielded Wirewound 2.2uH 10% 7.9MHz 30Q-Factor Iron 416mA 1210 T/R |
146129-2 | te connectivity / amp | Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST SMD |
XC2V4000-4BF957I | xilinx | FPGA Virtex-II Family 4M Gates 51840 Cells 650MHz 0.15um/0.12um (CMOS) Technology 1.5V 957-Pin FCBGA |
ERJ-S12F5602U | panasonic | Res Thick Film 1812 56K Ohm 1% 3/4W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
4232R-273F | api delevan | Ind RF Unshielded Wirewound 27uH 1% 2.5MHz 30Q-Factor Iron 153mA 1210 T/R |
146172-1 | te connectivity / amp | 25/26 MODII HDR DRST B/A .100 |
XC2V8000-4FF1517C | xilinx | FPGA Virtex-II Family 8M Gates 104882 Cells 650MHz 0.15um/0.12um (CMOS) Technology 1.5V 1517-Pin FCBGA |
ERJ-S12F5603U | panasonic | Res Thick Film 1812 560K Ohm 1% 3/4W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
146218-6 | te connectivity / amp | 18/26 MODII HDR SRST B/A 100CL |
4232R-331H | api delevan | Ind RF Unshielded Wirewound 330nH 3% 25MHz 17Q-Factor Phenolic 400mA 1210 T/R |
XC2VP100-5FF1704C | xilinx | FPGA Virtex-II Pro Family 99216 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 1704-Pin FCBGA |
146220-2 | te connectivity / amp | Conn Unshrouded Header HDR 10 POS 2.54mm Solder ST Thru-Hole |
XC2VP100-6FF1696I | xilinx | FPGA Virtex-II Pro Family 99216 Cells 1200MHz 0.13um/90nm (CMOS) Technology 1.5V 1696-Pin FCBGA |
ERJ-S12F5620U | panasonic | Res Thick Film 1812 562 Ohm 1% 3/4W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
4232R-333F | api delevan | Ind RF Unshielded Wirewound 33uH 1% 2.5MHz 30Q-Factor Iron 150mA 1210 T/R |
XC2VP2-7FFG672C | xilinx | FPGA Virtex-II Pro Family 3168 Cells 1350MHz 0.13um/90nm (CMOS) Technology 1.5V 672-Pin FCBGA |
HSC-AT11CS-A14 | Hirose Connector | Fiber Optic Connectors SC TYP OPTICAL FIXED ATTENUATOR 14 dB |
ERJ-S12F5621U | panasonic | Res Thick Film 1812 5.62K Ohm 1% 3/4W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
4232R-333H | api delevan | Ind RF Unshielded Wirewound 33uH 3% 2.5MHz 30Q-Factor Iron 150mA 1210 T/R |
XC2VP40-7FF1148C | xilinx | FPGA Virtex-II Pro Family 43632 Cells 1350MHz 0.13um/90nm (CMOS) Technology 1.5V 1148-Pin FCBGA |
HSC-A3-D1(21) | Hirose Connector | Fiber Optic Connectors FO CONN SC ADAPTR SC/SC PLSTC HOUS |
XC2VP70-5FF1704I | xilinx | FPGA Virtex-II Pro Family 74448 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 1704-Pin FCBGA |
ERJ-S12F5760U | panasonic | Res Thick Film 1812 576 Ohm 1% 3/4W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
HMUB-L8PA-1(40) | Hirose Connector | Fiber Optic Connectors FO CONN 8POS PKG SIDE |
4232R-393K | api delevan | Ind RF Unshielded Wirewound 39uH 10% 2.5MHz 30Q-Factor Iron 139mA 1210 T/R |
XC4VLX40-11FF1148I | xilinx | FPGA Virtex®-4 LX Family 41472 Cells 90nm (CMOS) Technology 1.2V 1148-Pin FCBGA |
146286-6 | te connectivity / amp | Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Thru-Hole |
ERJ-S12F5761U | panasonic | Res Thick Film 1812 5.76K Ohm 1% 3/4W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
4232R-471H | api delevan | Ind RF Unshielded Wirewound 470nH 3% 25MHz 17Q-Factor Phenolic 363mA 1210 T/R |
XC4VLX60-11FFG668C | xilinx | FPGA Virtex®-4 LX Family 59904 Cells 90nm (CMOS) Technology 1.2V 668-Pin FCBGA |
146297-8 | te connectivity / amp | Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole |
146305-2 | te connectivity / amp | Conn Unshrouded Header HDR 2 POS 2.54mm Solder RA Thru-Hole |
XC5VLX85-1FF1153C | xilinx | FPGA Virtex®-5 LX Family 82944 Cells 65nm (CMOS) Technology 1V 1153-Pin FCBGA |
ERJ-S12F57R6U | panasonic | Res Thick Film 1812 57.6 Ohm 1% 3/4W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
4232R-472F | api delevan | Ind RF Unshielded Wirewound 4.7uH 1% 7.9MHz 30Q-Factor Iron 339mA 1210 T/R |
XCR3512XL-12FGG324C | xilinx | CPLD CoolRunner XPLA3 Family 12K Gates 512 Macro Cells 77MHz 0.35um (CMOS) Technology 3.3V 324-Pin FBGA |
146310-9 | te connectivity / amp | Conn Unshrouded Header HDR 18 POS 2.54mm Solder RA Thru-Hole |
ERJ-S12F5901U | panasonic | Res Thick Film 1812 5.9K Ohm 1% 3/4W ±100ppm/°C Molded SMD SMD Embossed Carrier T/R |
4232R-562K | api delevan | Ind RF Unshielded Wirewound 5.6uH 10% 7.9MHz 30Q-Factor Iron 322mA 1210 T/R |
146382-3 | te connectivity / amp | 03 MODII HDR SRST B/A .100CL |
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