规格参数 > 第1086页
CDR11BP681AGNM 现货价格参数; 5788726-6 现货价格参数; TPS3307-25DR 现货价格参数; CDR11BP820AGNS 现货价格参数; 58558-1 现货价格参数; TNETD4200GJL240 现货价格参数; CDR12BG0R8ABUPM 现货价格参数; 58592-1 现货价格参数; TPS3836J25DBVT 现货价格参数; CDR12BG0R8ABUSM 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| CDR11BP681AGNM | avx | Cap Ceramic 680pF 50V C0G 2% SMD (1%FR) 125°C Waffle Pack |
| 5788726-6 | te connectivity / amp | Conn USB RCP/RCP 4/4 POS Solder RA Thru-Hole 8 Terminal 2 Port Tray |
| TPS3307-25DR | texas instruments | Processor Supervisor 2.93V/2.25V/Adj 2.5V/3.3V 8-Pin SOIC T/R |
| CDR11BP820AGNS | avx | Cap Ceramic 82pF 50V C0G 2% SMD (0.001%FR) 125°C Waffle Pack |
| 58558-1 | te connectivity / amp | Connector To Terminal Tool With Die Set |
| TNETD4200GJL240 | rochester electronics | |
| CDR12BG0R8ABUPM | avx | Cap Ceramic 0.8pF 50V +90±20ppm/C 0.1pF SMD (0.1%FR) 125°C Plastic T/R |
| 58592-1 | te connectivity / amp | PROCRIMP TOOL MPQS 1.5-2.5 |
| TPS3836J25DBVT | texas instruments | Processor Supervisor 2.25V 1.6V to 6V 5-Pin SOT-23 T/R |
| CDR12BG0R8ABUSM | avx | Cap Ceramic 0.8pF 50V +90±20ppm/C 0.1pF SMD (0.001%FR) 125°C Plastic T/R |
| TNETE110APGE | rochester electronics | |
| 58J9P36-01C02N | grayhill | Switch Key Lock DPDT 36° Flat Key 0.2A 220VAC 30VDC PC Pins Panel Mount/Through Hole |
| 040-0001 | Rabbit Semiconductor | Processor Accessories Book on MicroC/OS II Second Edition |
| CDR12BG0R8ADUM | avx | Cap Ceramic 0.8pF 50V +90±20ppm/C 0.5pF SMD (1%FR) 125°C Waffle Pack |
| 5916732-2 | te connectivity / amp | Conn PGA Socket SKT 321 POS 2.54mm Solder ST Thru-Hole Tray |
| TNETE2201PJD | rochester electronics | |
| CDR12BG1R0ABUR | avx | Cap Ceramic 1pF 50V +90±20ppm/C 0.1pF SMD (0.01%FR) 125°C Waffle Pack |
| 59416 | weidmuller | Conn Terminal Blocks 9 POS 5.08mm Solder RA Thru-Hole 10A |
| AP601-PCB1960 | TriQuint Semiconductor | RF Development Tools 1930-1990MHz Brd 15dB Gain |
| CDR12BG270AJUPM | avx | Cap Ceramic 27pF 50V +90±20ppm/C 5% SMD (0.1%FR) 125°C Plastic T/R |
| TNETX15VEPGE | rochester electronics | |
| 5962-8687512YA | integrated device technology (idt) | SRAM Chip Async Dual 5V 8K-Bit 1K x 8 45ns 48-Pin LCC |
| USB1T11AMTC | fairchild semiconductor | USB Transceiver 1TR 1.5Mbps/12Mbps 14-Pin TSSOP Rail |
| CDR12BG2R2ABUM | avx | Cap Ceramic 2.2pF 50V +90±20ppm/C 0.1pF SMD (1%FR) 125°C Waffle Pack |
| 5962-8763101SA | texas instruments | Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1-Element 20-Pin CFPAK Tube |
| TNETX3110PGV | rochester electronics | |
| CDR12BG2R2ABUS | avx | Cap Ceramic 2.2pF 50V +90±20ppm/C 0.1pF SMD (0.001%FR) 125°C Waffle Pack |
| DEM-PCM2912EVM | Texas Instruments | Audio IC Development Tools DEM-PCM2912EVM Eval Mod |
| 5962-87700032A | analog devices | DAC 1-CH R-2R 8-bit 20-Pin LCC |
| CDR12BG3R0ACWRM | avx | Cap Ceramic 3pF 50V +90±20ppm/C 0.25pF SMD (0.01%FR) 125°C Plastic T/R |
| 5962-9052605MXA | texas instruments | DSP Floating-Point 32-Bit 50MHz 25MIPS 181-Pin CPGA Tray |
| TP13054ADW | rochester electronics | CMOS COMBINED CODEC AND FILTER (U-LAW) |
| XC2S50-6FG256C | xilinx | FPGA Spartan®-II Family 50K Gates 1728 Cells 263MHz 0.18um Technology 2.5V 256-Pin FBGA |
| CDR12BG3R9ACWS | avx | Cap Ceramic 3.9pF 50V +90±20ppm/C 0.25pF SMD (0.001%FR) 125°C Waffle Pack |
| 5962-9071101M2A | maxim integrated | MICROPROCESSOR WATCHDOG/BATTERY SWITCHOVER/RE |
| TP13054BN | rochester electronics | CMOS CODEC & FILTER (U-LAW), INDUS TEMP |
| CDR12BG4R7ABWP | avx | Cap Ceramic 4.7pF 50V +90±20ppm/C 0.1pF SMD (0.1%FR) 125°C Waffle Pack |
| 5962-9081101MPA | maxim integrated | Processor Supervisor 8-Pin CDIP |
| XC3S50-4VQ100I | xilinx | FPGA Spartan®-3 Family 50K Gates 1728 Cells 630MHz 90nm Technology 1.2V 100-Pin VTQFP |
| CDR12BG560AFUM | avx | Cap Ceramic 56pF 50V +90±20ppm/C 1% SMD (1%FR) 125°C Waffle Pack |
| 5962-9469101QLA | texas instruments | Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1-Element 24-Pin CDIP Tube |
| TP13057AN | rochester electronics | |
| XC9572XL-10CS48I | xilinx | CPLD XC9500XL Family 1.6K Gates 72 Macro Cells 100MHz 0.35um (CMOS) Technology 3.3V 48-Pin CSBGA |
| CDR12BG5R1ACUR | avx | Cap Ceramic 5.1pF 50V +90±20ppm/C 0.25pF SMD (0.01%FR) 125°C Waffle Pack |
| 5962-9564201VSA | texas instruments | Bus XCVR Single 8-CH 3-ST 20-Pin CFPAK Tube |
| CDR12BG6R2ACWP | avx | Cap Ceramic 6.2pF 50V +90±20ppm/C 0.25pF SMD (0.1%FR) 125°C Waffle Pack |
| 5962-9685401QRA | texas instruments | Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1-Element 20-Pin CDIP Tube |
| XCR3128XL-10VQ100C | xilinx | CPLD CoolRunner XPLA3 Family 3K Gates 128 Macro Cells 95MHz 0.35um (CMOS) Technology 3.3V 100-Pin VTQFP |
| TP13057BDW | rochester electronics | CMOS COMBINED CODEC AND FILTER (A-LAW) |
页数:
1
100
200
300
400
500
600
700
800
990
1000
1010
1020
1030
1040
1050
1060
1071
1072
1073
1074
1075
1076
1077
1078
1079
1080
1081
1082
1083
1084
1085
1086
1087
1088
1089
1090
1091
1092
1093
1094
1095
1096
1097
1098
1099
1100
1110
1120
1130
1140
1150
1160
1170
1200
1300
1400
1500
1600
1700
1800
1900
2000
3000
4000
5000
6000
7000
8000
9000
10000
20000
30000
40000
50000
60000
70000
80000
234766