规格参数 > 第1076页
5606844 现货价格参数; 5173278-1 现货价格参数; 101-0392 现货价格参数; 5174216-5 现货价格参数; CY7C1371D-133AXC 现货价格参数; TLV571CPW 现货价格参数; 5174225-2 现货价格参数; DAC712U 现货价格参数; MTMMC-C-N2.R2 现货价格参数; TLV571IDW 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 5606844 | Phoenix Contact | Development Software TSWIN.NETPROGRAMMING SOFTWARE |
| 5173278-1 | te connectivity / amp | Conn D-Subminiature M 30 POS 2.54mm Solder RA Thru-Hole 30 Terminal 1 Port |
| 101-0392 | Rabbit Semiconductor | Daughter Cards & OEM Boards SR9300 A/D 0-10V |
| 5174216-5 | te connectivity / amp | Conn D-Subminiature PL 20 POS Solder ST Thru-Hole 20 Terminal 1 Port |
| CY7C1371D-133AXC | cypress semiconductor | SRAM Chip Sync Quad 3.3V 18M-Bit 512K x 36 6.5ns 100-Pin TQFP |
| TLV571CPW | rochester electronics | |
| 5174225-2 | te connectivity / amp | Conn D-Subminiature PL 28 POS Solder RA Thru-Hole 28 Terminal 1 Port |
| DAC712U | texas instruments | DAC 1-CH R-2R 16-bit 28-Pin SOIC Tube |
| MTMMC-C-N2.R2 | Multi-Tech Systems | RF Modules 800/1900 CDMA 1xRTT SprintModemModule-5V |
| TLV571IDW | rochester electronics | 8 BIT SAR A/D |
| 5174253-4 | te connectivity / amp | DR-DIN CONN. FEMALE ASSY (WITH |
| ICB-SK(ML2250CTL KIT) | Oki Semiconductor | Audio IC Development Tools ML2250CTL KIT |
| OM7800/BGU7003/100,598 | NXP Semiconductors | Amplifier IC Development Tools BGU7003 100MHz |
| 5174254-1 | te connectivity / amp | Conn DIN 41612 PL 32 POS 2.54mm Solder ST Thru-Hole |
| TLV990-13PFB | rochester electronics | 3V 13MSPS, 10 BIT CCD AFE |
| CY3630 | Cypress Semiconductor | Development Boards & Kits - Wireless Wireless USB LP Eval Kit |
| 5174718-2 | te connectivity / amp | Conn DIN 41612 PL 64 POS Solder RA Thru-Hole |
| TLY2465CN | rochester electronics | |
| MTSMC-G2-IP-ED-SP | Multi-Tech Systems | RF Modules 900/1800MHz w/Uni IP-5V Quad Band |
| ECE-A1EKS100 | panasonic | Cap Aluminum 10uF 25V 20% (5 X 5mm) Radial 2mm 28mA 1000 hr 85°C Bulk |
| 5175475-3 | te connectivity / amp | CONN SCSI F 30 POS 1.27MM SLDR ST TH 30TERM |
| 5175677-2 | te connectivity / amp | Conn SCSI PL 20 POS 1.27mm IDT RA Cable Mount 20 Terminal 1 Port |
| 101-0590 | Rabbit Semiconductor | Modules Accessories BL2010 Btm Mnt |
| TM00143 | rochester electronics | |
| EEA-FC1E220 | panasonic | Cap Aluminum 22uF 25V 20% (5 X 7mm) Radial 2mm 120mA 1000 hr 105°C Bulk |
| 5175677-7 | te connectivity / amp | Conn SCSI PL 50 POS 1.27mm IDT RA Cable Mount 50 Terminal 1 Port |
| 20-101-1253 | Rabbit Semiconductor | Development Boards & Kits - Other Processors RCM56/57XX Serial Comm Board |
| EEU-FC0J102 | panasonic | Cap Aluminum 1000uF 6.3V 20% (10 X 12.5mm) Radial 5mm 755mA 3000 hr 105°C Bulk |
| SERDES01-40USB/NOPB | Texas Instruments | Interface Development Tools EVAL KIT |
| 32401 | Parallax | Sockets & Adapters XBee 5V/3.3V Adapter Board |
| TM124BBK32-80 | rochester electronics | |
| 5176372-1 | te connectivity / amp | Conn SCSI RCP 40 POS 1.27mm Solder ST Thru-Hole 40 Terminal 1 Port |
| M68DIP16TSSOP | Freescale Semiconductor | Sockets & Adapters ADAPTER |
| ERJ-2GEJ110X | panasonic | Res Thick Film 0402 11 Ohm 5% 1/10W ±200ppm/°C Molded SMD SMD Punched Carrier T/R |
| TM248NBK36R-80 | rochester electronics | |
| 5176377-8 | te connectivity / amp | Conn SCSI RCP 180 POS 1.27mm Solder ST Thru-Hole 180 Terminal 1 Port |
| KSK-LPC935 | IAR Systems | Development Boards & Kits - 8051 KICKSTART KIT NXP LPC935 |
| 5179351-1 | te connectivity / amp | 0.8MM FH REC ASSY 40P EMBOSS |
| ERJ-2GEJ223X | panasonic | Res Thick Film 0402 22K Ohm 5% 1/10W ±200ppm/°C Molded SMD SMD Punched Carrier T/R |
| TMC1175AC3F20 | rochester electronics | |
| S7U4E001A010000 | Epson Electronics America | Multiple Function Sensor Development Tools Multple Sensor Board Wireless |
| 5179508-1 | te connectivity / amp | Conn DIMM Socket SKT 168 POS 2.54mm Solder Thru-Hole Box |
| ERJ-2GEJ623X | panasonic | Res Thick Film 0402 62K Ohm 5% 1/10W ±200ppm/°C Molded SMD SMD Punched Carrier T/R |
| MDEV-900-HP3-SPS-USB | Linx Technologies | RF Development Tools HP-3 Master Dev Sys SMD, USB Module |
| TMC1175AR3C40 | rochester electronics | |
| 51873 | te connectivity / amp | BODY R 22-16 COMM 22-18 MIL 6 |
| LM3207TL-2.53EV | Texas Instruments | Power Management IC Development Tools LM3207TL-2.53 EVAL BOARD |
| ERJ-2RKF2103X | panasonic | Res Thick Film 0402 210K Ohm 1% 1/10W ±100ppm/°C Molded SMD SMD Punched Carrier T/R |
| 5188476-1 | te connectivity / amp | Z-PACK/A M-HDR 154P |
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