规格参数 > 第10653页
0603R-24NK 现货价格参数; T110A684M075AS 现货价格参数; GS8320V18T-150I 现货价格参数; D55342K07B82H0SWB 现货价格参数; 0603R-30NK 现货价格参数; T110B106K006AS 现货价格参数; GS8320ZV36GT-166 现货价格参数; D55342K07B845DSWB 现货价格参数; T110B106M015AS 现货价格参数; GS8321E18E-200 现货价格参数;
| 型号 | 生产商 | 产品描述 |
|---|---|---|
| 0603R-24NK | api delevan | Ind RF Unshielded Wirewound 24nH 10% 250MHz 38Q-Factor Ceramic 700mA 0603 T/R |
| T110A684M075AS | kemet | Cap Tant Solid 0.68uF 75V 20% (3.43 X 7.26mm) Axial 10 Ohm 125°C Bulk |
| GS8320V18T-150I | gsi technology | SRAM Chip Sync Dual 1.8V 36M-Bit 2M x 18 8.5ns/3.8ns 100-Pin TQFP Tray |
| D55342K07B82H0SWB | vishay / dale | Res Thick Film 1206 82K Ohm 2% 1/4W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| 0603R-30NK | api delevan | Ind RF Unshielded Wirewound 30nH 10% 250MHz 40Q-Factor Ceramic 600mA 0603 T/R |
| T110B106K006AS | kemet | Cap Tant Solid 10uF 6V 10% (4.7 X 12.04mm) Axial 6 Ohm 125°C Bulk |
| GS8320ZV36GT-166 | gsi technology | SRAM Chip Sync Single 1.8V 36M-Bit 1M x 36 8ns/3.5ns 100-Pin TQFP Tray |
| D55342K07B845DSWB | vishay / dale | Res Thick Film 1206 845 Ohm 1% 1/4W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| T110B106M015AS | kemet | Cap Tant Solid 10uF 15V 20% (4.7 X 12.04mm) Axial 3.2 Ohm 125°C Bulk |
| GS8321E18E-200 | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 36M-Bit 2M x 18 6.5ns/3ns 165-Pin FBGA Tray |
| 0603R-36NJ | api delevan | Ind RF Unshielded Wirewound 36nH 5% 250MHz 40Q-Factor Ceramic 600mA 0603 T/R |
| T110C107K010ASTR | kemet | Cap Tant Solid 100uF 10V 10% (7.34 X 17.42mm) Axial T/R |
| GS8321E18E-200I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 36M-Bit 2M x 18 6.5ns/3ns 165-Pin FBGA Tray |
| D55342K07B887DSWB | vishay / dale | Res Thick Film 1206 887 Ohm 1% 1/4W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| 0603R-36NK | api delevan | Ind RF Unshielded Wirewound 36nH 10% 250MHz 40Q-Factor Ceramic 600mA 0603 T/R |
| T110C156M035ASTR | kemet | Cap Tant Solid 15uF 35V 20% (7.34 X 17.42mm) Axial 1.6 Ohm 125°C T/R |
| GS8321E18E-250I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 36M-Bit 2M x 18 5.5ns/2.5ns 165-Pin FBGA Tray |
| 0603R-3N9J | api delevan | Ind RF Unshielded Wirewound 3.9nH 5% 250MHz 22Q-Factor Ceramic 700mA 0603 T/R |
| D55342K07B8E25SWB | vishay / dale | Res Thick Film 1206 8.25K Ohm 1% 1/4W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| T110C566K015ASTR | kemet | Cap Tant Solid 56uF 15V 10% (7.34 X 17.42mm) Axial 1.3 Ohm 125°C T/R |
| GS8321E18GE-133 | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 36M-Bit 2M x 18 8.5ns/4ns 165-Pin FBGA Tray |
| T110D476K035AS2864 | kemet | Cap Tant Solid 47uF 35V 10% (8.92 X 19.96mm) Axial Bulk |
| GS8321EV36GE-166 | gsi technology | SRAM Chip Sync Quad 1.8V 36M-Bit 1M x 36 7ns/3.5ns 165-Pin FBGA Tray |
| 0603R-43NG | api delevan | Ind RF Unshielded Wirewound 43nH 2% 200MHz 38Q-Factor Ceramic 600mA 0603 T/R |
| D55342K07B909ESS3 | vishay / dale | Res Thick Film 1206 909K Ohm 1% 1/4W ±100ppm/°C 0.001% Molded SMD SMD T/R |
| T110D826K015AS | kemet | Cap Tant Solid 82uF 15V 10% (8.92 X 19.96mm) Axial Bulk |
| GS8321EV36GE-166I | gsi technology | SRAM Chip Sync Quad 1.8V 36M-Bit 1M x 36 7ns/3.5ns 165-Pin FBGA Tray |
| 0603R-4N3K | api delevan | Ind RF Unshielded Wirewound 4.3nH 10% 250MHz 22Q-Factor Ceramic 700mA 0603 T/R |
| T120B106M010AS | kemet | AXIAL,HERM SEAL,10UF,10V,20%,B CASE,BULK |
| D55342K07B90E9TWBT | vishay / dale | Res Thick Film 1206 90.9K Ohm 1% 1/4W ±100ppm/°C Molded SMD SMD Tray |
| GS8321ZV32GE-200 | gsi technology | SRAM Chip Sync Quad 1.8V 32M-Bit 1M x 32 7.5ns/3ns 165-Pin FBGA Tray |
| T120B685K015AS | kemet | AXIAL,HERM SEAL,6.8UF,15V,10%,B CASE,BULK |
| GS832272C-225 | gsi technology | SRAM Chip Sync Octal 2.5V/3.3V 36M-Bit 512K x 72-Bit 7ns/2.7ns 209-Pin FBGA Tray |
| 0603R-56NJ | api delevan | Ind RF Unshielded Wirewound 56nH 5% 200MHz 38Q-Factor Ceramic 600mA 0603 T/R |
| D55342K07B953DSWB | vishay / dale | Res Thick Film 1206 953 Ohm 1% 1/4W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| T12T-C | panduit | Cable Accessories Spiral Wrap Teflon Natural |
| GS8322V18E-150 | gsi technology | SRAM Chip Sync Quad 1.8V 36M-Bit 2M x 18 8.5ns/3.8ns 165-Pin FBGA Tray |
| 0603R-5N6J | api delevan | Ind RF Unshielded Wirewound 5.6nH 5% 250MHz 20Q-Factor Ceramic 700mA 0603 T/R |
| T140D227K016AS | kemet | Cap Tant Solid 220uF 16V 10% (8.92 X 19.96mm) Axial Bulk |
| D55342K07B97D6SWB | vishay / dale | Res Thick Film 1206 97.6 Ohm 1% 1/4W ±100ppm/°C 0.001% Molded SMD SMD Tray |
| GS8322Z18GE-166I | gsi technology | SRAM Chip Sync Dual 2.5V/3.3V 36M-Bit 2M x 18 8ns/3.5ns 165-Pin FBGA Tray |
| T140D567K010AS | kemet | Cap Tant Solid 560uF 10V 10% (8.92 X 19.96mm) Axial Bulk |
| GS8322ZV36E-133I | gsi technology | SRAM Chip Sync Quad 1.8V 36M-Bit 1M x 36 8.5ns/4ns 165-Pin FBGA Tray |
| 0603R-72NJ | api delevan | Ind RF Unshielded Wirewound 72nH 5% 150MHz 34Q-Factor Ceramic 400mA 0603 T/R |
| D55342M07B100ETWBT | vishay / dale | Res Thick Film 1206 100K Ohm 1% 1/4W ±300ppm/°C Molded SMD SMD Tray |
| T19N-M0 | panduit | Cable Accessories Spiral Wrap Tubing Nylon Black |
| GS8322ZV36GE-200I | gsi technology | SRAM Chip Sync Quad 1.8V 36M-Bit 1M x 36 7.5ns/3ns 165-Pin FBGA Tray |
| 0603R-82NK | api delevan | Ind RF Unshielded Wirewound 82nH 10% 150MHz 34Q-Factor Ceramic 400mA 0603 T/R |
| T19T-C | panduit | Cable Accessories Spiral Wrap Teflon Natural |
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